SE446348B - Sett att pa en berare elektropletera en tunn kopparfolie till anvendning i tryckta kretsar - Google Patents

Sett att pa en berare elektropletera en tunn kopparfolie till anvendning i tryckta kretsar

Info

Publication number: SE446348B
Authority: SE; Sweden
Prior art keywords: copper; bath; fluoride; carrier; concentration
Prior art date: 1978-01-16

Application number

SE7900329A

Other languages

English (en)

Swedish (sv)

Other versions

SE7900329L (sv

Inventor

B M Luce

B L Berdan

Original Assignee

Gould Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-01-16

Filing date

1979-01-15

Publication date

1986-09-01

1979-01-15 Application filed by Gould Inc filed Critical Gould Inc

1979-07-17 Publication of SE7900329L publication Critical patent/SE7900329L/xx

1986-09-01 Publication of SE446348B publication Critical patent/SE446348B/sv

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 54
229910052802 copper Inorganic materials 0.000 title claims description 39
239000010949 copper Substances 0.000 title claims description 39
238000000034 method Methods 0.000 claims description 28
238000007747 plating Methods 0.000 claims description 24
239000011889 copper foil Substances 0.000 claims description 15
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 14
229910052782 aluminium Inorganic materials 0.000 claims description 14
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
238000009713 electroplating Methods 0.000 claims description 14
-1 nitrate ions Chemical class 0.000 claims description 14
PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 14
239000011888 foil Substances 0.000 claims description 13
239000000203 mixture Substances 0.000 claims description 13
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 claims description 10
229910002651 NO3 Inorganic materials 0.000 claims description 8
239000011775 sodium fluoride Substances 0.000 claims description 7
235000013024 sodium fluoride Nutrition 0.000 claims description 7
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
230000002378 acidificating effect Effects 0.000 claims description 6
229910052759 nickel Inorganic materials 0.000 claims description 5
239000011698 potassium fluoride Substances 0.000 claims description 5
235000003270 potassium fluoride Nutrition 0.000 claims description 5
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 4
KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 4
229910001431 copper ion Inorganic materials 0.000 claims description 4
239000000463 material Substances 0.000 claims description 4
239000002667 nucleating agent Substances 0.000 claims description 4
RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 claims description 3
DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 3
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
239000002253 acid Substances 0.000 claims description 3
WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 3
229910001634 calcium fluoride Inorganic materials 0.000 claims description 3
229910052742 iron Inorganic materials 0.000 claims description 3
229910017604 nitric acid Inorganic materials 0.000 claims description 3
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
229910052725 zinc Inorganic materials 0.000 claims description 2
239000011701 zinc Substances 0.000 claims description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 2
PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims 2
239000012876 carrier material Substances 0.000 claims 1
150000001875 compounds Chemical class 0.000 claims 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 7
239000010408 film Substances 0.000 description 7
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
239000000758 substrate Substances 0.000 description 6
230000006911 nucleation Effects 0.000 description 5
238000010899 nucleation Methods 0.000 description 5
FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 4
VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 4
NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 3
XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
238000005530 etching Methods 0.000 description 3
238000004519 manufacturing process Methods 0.000 description 3
150000002823 nitrates Chemical class 0.000 description 3
PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 2
XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
229910000365 copper sulfate Inorganic materials 0.000 description 2
238000002156 mixing Methods 0.000 description 2
239000011148 porous material Substances 0.000 description 2
235000010333 potassium nitrate Nutrition 0.000 description 2
239000004323 potassium nitrate Substances 0.000 description 2
238000001556 precipitation Methods 0.000 description 2
235000010344 sodium nitrate Nutrition 0.000 description 2
239000004317 sodium nitrate Substances 0.000 description 2
239000008399 tap water Substances 0.000 description 2
235000020679 tap water Nutrition 0.000 description 2
AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
229920000742 Cotton Polymers 0.000 description 1
241000282326 Felis catus Species 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
238000013019 agitation Methods 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
239000002585 base Substances 0.000 description 1
230000033228 biological regulation Effects 0.000 description 1
239000000969 carrier Substances 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
229910017052 cobalt Inorganic materials 0.000 description 1
239000010941 cobalt Substances 0.000 description 1
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
239000011152 fibreglass Substances 0.000 description 1
150000004673 fluoride salts Chemical class 0.000 description 1
238000010348 incorporation Methods 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
238000000691 measurement method Methods 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000012544 monitoring process Methods 0.000 description 1
150000002815 nickel Chemical class 0.000 description 1
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
239000002244 precipitate Substances 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
239000003352 sequestering agent Substances 0.000 description 1
239000000176 sodium gluconate Substances 0.000 description 1
235000012207 sodium gluconate Nutrition 0.000 description 1
229940005574 sodium gluconate Drugs 0.000 description 1
235000019333 sodium laurylsulphate Nutrition 0.000 description 1
235000011006 sodium potassium tartrate Nutrition 0.000 description 1
238000003756 stirring Methods 0.000 description 1
239000010409 thin film Substances 0.000 description 1
239000000080 wetting agent Substances 0.000 description 1
239000011787 zinc oxide Substances 0.000 description 1
NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Electroplating Methods And Accessories (AREA)
Electroplating And Plating Baths Therefor (AREA)

SE7900329A 1978-01-16 1979-01-15 Sett att pa en berare elektropletera en tunn kopparfolie till anvendning i tryckta kretsar SE446348B (sv)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US05/869,687 US4169018A (en)	1978-01-16	1978-01-16	Process for electroforming copper foil

Publications (2)

Publication Number	Publication Date
SE7900329L SE7900329L (sv)	1979-07-17
SE446348B true SE446348B (sv)	1986-09-01

Family

ID=25354080

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE7900329A SE446348B (sv)	1978-01-16	1979-01-15	Sett att pa en berare elektropletera en tunn kopparfolie till anvendning i tryckta kretsar

Country Status (11)

Country	Link
US (1)	US4169018A (fr)
JP (1)	JPS6030751B2 (fr)
BR (1)	BR7900244A (fr)
CA (1)	CA1167406A (fr)
DE (1)	DE2856682C2 (fr)
FR (1)	FR2414565B1 (fr)
GB (1)	GB2012307B (fr)
IT (1)	IT1114330B (fr)
LU (1)	LU80788A1 (fr)
NL (1)	NL185528C (fr)
SE (1)	SE446348B (fr)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4468293A (en) *	1982-03-05	1984-08-28	Olin Corporation	Electrochemical treatment of copper for improving its bond strength
US4515671A (en) *	1983-01-24	1985-05-07	Olin Corporation	Electrochemical treatment of copper for improving its bond strength
US4565607A (en) *	1984-03-09	1986-01-21	Energy Conversion Devices, Inc.	Method of fabricating an electroplated substrate
US4530739A (en) *	1984-03-09	1985-07-23	Energy Conversion Devices, Inc.	Method of fabricating an electroplated substrate
US5431803A (en) *	1990-05-30	1995-07-11	Gould Electronics Inc.	Electrodeposited copper foil and process for making same
US5403465A (en) *	1990-05-30	1995-04-04	Gould Inc.	Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
BR9105776A (pt) *	1990-05-30	1992-08-04	Gould Inc	Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada
US5527998A (en) *	1993-10-22	1996-06-18	Sheldahl, Inc.	Flexible multilayer printed circuit boards and methods of manufacture
KR0157889B1 (ko) *	1995-07-24	1999-02-01	문정환	선택적 구리 증착방법
RU2166567C2 (ru) *	1995-09-22	2001-05-10	Сиркюи Фуаль Люксембург Трейдинг С.А.Р.Л.	Способ изготовления электроосажденной медной фольги и медная фольга, полученная этим способом
TW432124B (en) *	1996-05-13	2001-05-01	Mitsui Mining & Amp Smelting C	Electrolytic copper foil with high post heat tensile strength and its manufacturing method
AU6159898A (en) *	1997-02-14	1998-09-08	Dover Industrial Chrome, Inc.	Plating apparatus and method
SG101924A1 (en) *	1998-10-19	2004-02-27	Mitsui Mining & Smelting Co	Composite material used in making printed wiring boards
EP0996318B1 (fr) *	1998-10-19	2006-04-19	Mitsui Mining & Smelting Co., Ltd.	Nouvelle feuille composite, procédé de sa production et laminé revêtu de cuivre
SG100612A1 (en) *	1998-10-21	2003-12-26	Mitsui Mining & Smelting Co	Novel composite foil, process for producing the same and copper-clad laminate
US6224737B1 (en)	1999-08-19	2001-05-01	Taiwan Semiconductor Manufacturing Company	Method for improvement of gap filling capability of electrochemical deposition of copper
US6354916B1 (en) *	2000-02-11	2002-03-12	Nu Tool Inc.	Modified plating solution for plating and planarization and process utilizing same
US6350364B1 (en)	2000-02-18	2002-02-26	Taiwan Semiconductor Manufacturing Company	Method for improvement of planarity of electroplated copper
EP1225253A1 (fr) *	2001-01-22	2002-07-24	DSL Dresden Material-Innovation GmbH	Pocédé continu d'électroformage de bande pour électrodes de pile et mandrin utilisé dans ce procédé d'électroformage
US6893742B2 (en) *	2001-02-15	2005-05-17	Olin Corporation	Copper foil with low profile bond enhancement
US7132158B2 (en) *	2003-10-22	2006-11-07	Olin Corporation	Support layer for thin copper foil
WO2008029376A2 (fr)	2006-09-07	2008-03-13	Enthone Inc.	Depôt de polymère conducteur et métallisation de substrats non-conducteurs
EP1897973A1 (fr) *	2006-09-07	2008-03-12	Enthone, Inc.	Dépôt d'un polymère conducteur et métallisation de substrats non conducteurs
US7875900B2 (en) *	2008-12-01	2011-01-25	Celsia Technologies Taiwan, Inc.	Thermally conductive structure of LED and manufacturing method thereof
US20130264214A1 (en) *	2012-04-04	2013-10-10	Rohm And Haas Electronic Materials Llc	Metal plating for ph sensitive applications
US10131998B2 (en)	2015-10-02	2018-11-20	Global Solar Energy, Inc.	Metalization of flexible polymer sheets
US10040271B1 (en)	2015-10-02	2018-08-07	Global Solar Energy, Inc.	Metalization of flexible polymer sheets

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2871172A (en) *	1955-11-02	1959-01-27	James T N Atkinson	Electro-plating of metals
US2882209A (en) *	1957-05-20	1959-04-14	Udylite Res Corp	Electrodeposition of copper from an acid bath
US3634205A (en) *	1968-09-27	1972-01-11	Bunker Ramo	Method of plating a uniform copper layer on an apertured printed circuit board
BE788117A (fr) *	1971-08-30	1973-02-28	Perstorp Ab	Procede de production d'elements pour circuits imprimes
US3998601A (en) *	1973-12-03	1976-12-21	Yates Industries, Inc.	Thin foil
CA1044636A (fr) *	1974-01-07	1978-12-19	Betty L. Berdan	Formation de nodules sur une surface metallique
US3969199A (en) *	1975-07-07	1976-07-13	Gould Inc.	Coating aluminum with a strippable copper deposit

1978
- 1978-01-16 US US05/869,687 patent/US4169018A/en not_active Expired - Lifetime
- 1978-12-19 CA CA000318233A patent/CA1167406A/fr not_active Expired
- 1978-12-29 DE DE2856682A patent/DE2856682C2/de not_active Expired
1979
- 1979-01-03 GB GB79139A patent/GB2012307B/en not_active Expired
- 1979-01-12 IT IT47609/79A patent/IT1114330B/it active
- 1979-01-12 FR FR7900765A patent/FR2414565B1/fr not_active Expired
- 1979-01-15 SE SE7900329A patent/SE446348B/sv not_active IP Right Cessation
- 1979-01-15 BR BR7900244A patent/BR7900244A/pt unknown
- 1979-01-15 LU LU80788A patent/LU80788A1/fr unknown
- 1979-01-15 NL NLAANVRAGE7900311,A patent/NL185528C/xx not_active IP Right Cessation
- 1979-01-16 JP JP54002309A patent/JPS6030751B2/ja not_active Expired

Also Published As

Publication number	Publication date
SE7900329L (sv)	1979-07-17
US4169018A (en)	1979-09-25
JPS54101725A (en)	1979-08-10
IT7947609A0 (it)	1979-01-12
FR2414565B1 (fr)	1985-06-28
BR7900244A (pt)	1979-08-14
NL185528C (nl)	1990-05-01
JPS6030751B2 (ja)	1985-07-18
FR2414565A1 (fr)	1979-08-10
DE2856682C2 (de)	1986-07-31
LU80788A1 (fr)	1979-05-16
CA1167406A (fr)	1984-05-15
IT1114330B (it)	1986-01-27
GB2012307A (en)	1979-07-25
NL7900311A (nl)	1979-07-18
DE2856682A1 (de)	1979-07-19
GB2012307B (en)	1982-06-30

Legal Events

Date

Code

Title

Description

1995-01-31

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Patent has lapsed

Ref document number: 7900329-9

Effective date: 19940510

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Publication	Publication Date	Title
SE446348B (sv)	1986-09-01	Sett att pa en berare elektropletera en tunn kopparfolie till anvendning i tryckta kretsar
US3998601A (en)	1976-12-21	Thin foil
US3969199A (en)	1976-07-13	Coating aluminum with a strippable copper deposit
US6689268B2 (en)	2004-02-10	Copper foil composite including a release layer
US4898647A (en)	1990-02-06	Process and apparatus for electroplating copper foil
US4131517A (en)	1978-12-26	Surface treating process for copper foil for use in printed circuit
KR900000865B1 (ko)	1990-02-17	구리-크롬-폴리이미드 복합체 및 그의 제조방법
JP2002292788A (ja)	2002-10-09	複合銅箔及び該複合銅箔の製造方法
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