SE458568B - Halvledarkomponent med ett skivformigt halvledarelement, innefattande en skyddsanordning av keramiskt material som omgriper halvledarelementet och aer fixerad i foerhaallande till detta medelst en passiviseringsmassa - Google Patents

Halvledarkomponent med ett skivformigt halvledarelement, innefattande en skyddsanordning av keramiskt material som omgriper halvledarelementet och aer fixerad i foerhaallande till detta medelst en passiviseringsmassa

Info

Publication number
SE458568B
SE458568B SE8006179A SE8006179A SE458568B SE 458568 B SE458568 B SE 458568B SE 8006179 A SE8006179 A SE 8006179A SE 8006179 A SE8006179 A SE 8006179A SE 458568 B SE458568 B SE 458568B
Authority
SE
Sweden
Prior art keywords
semiconductor element
protection device
housing
surrounds
disc
Prior art date
Application number
SE8006179A
Other languages
English (en)
Swedish (sv)
Other versions
SE8006179L (sv
Inventor
H Ehinger
H Juchmann
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of SE8006179L publication Critical patent/SE8006179L/
Publication of SE458568B publication Critical patent/SE458568B/sv

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/01—Manufacture or treatment
    • H10D48/07—Manufacture or treatment of devices having bodies comprising cuprous oxide [Cu2O] or cuprous iodide [CuI]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
  • Thyristors (AREA)
SE8006179A 1979-09-12 1980-09-04 Halvledarkomponent med ett skivformigt halvledarelement, innefattande en skyddsanordning av keramiskt material som omgriper halvledarelementet och aer fixerad i foerhaallande till detta medelst en passiviseringsmassa SE458568B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2936780A DE2936780C2 (de) 1979-09-12 1979-09-12 Halbleiterbauelement

Publications (2)

Publication Number Publication Date
SE8006179L SE8006179L (sv) 1981-03-13
SE458568B true SE458568B (sv) 1989-04-10

Family

ID=6080617

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8006179A SE458568B (sv) 1979-09-12 1980-09-04 Halvledarkomponent med ett skivformigt halvledarelement, innefattande en skyddsanordning av keramiskt material som omgriper halvledarelementet och aer fixerad i foerhaallande till detta medelst en passiviseringsmassa

Country Status (3)

Country Link
JP (1) JPS5646541A (de)
DE (1) DE2936780C2 (de)
SE (1) SE458568B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134876A (ja) * 1983-01-20 1984-08-02 Mitsubishi Electric Corp 半導体装置
DE8909244U1 (de) * 1989-07-31 1989-09-21 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement
JPH0760893B2 (ja) * 1989-11-06 1995-06-28 三菱電機株式会社 半導体装置およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354971A (en) * 1976-10-28 1978-05-18 Mitsubishi Electric Corp Semiconductor device
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
US4131905A (en) * 1977-05-26 1978-12-26 Electric Power Research Institute, Inc. Light-triggered thyristor and package therefore

Also Published As

Publication number Publication date
DE2936780C2 (de) 1985-02-07
JPS5646541A (en) 1981-04-27
DE2936780A1 (de) 1981-03-26
SE8006179L (sv) 1981-03-13

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