SE519713C2 - Förfarande och anordning för passiv upplinjering - Google Patents

Förfarande och anordning för passiv upplinjering

Info

Publication number: SE519713C2
Authority: SE; Sweden
Prior art keywords: carrier; laser; alignment; structures; passive
Prior art date: 2000-05-23

Application number

SE0100367A

Other languages

English (en)

Swedish (sv)

Other versions

SE0100367D0 (sv

SE0100367L (sv

Inventor

Paul Eriksen

Christian Vieider

Goeran Palmskog

Mats Granberg

Krister Froejdh

Pontus Lundstroem

Thomas Ericson

Lennart Baecklin

Original Assignee

Ericsson Telefon Ab L M

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-05-23

Filing date

2001-02-06

Publication date

2003-04-01

2000-05-23 Priority claimed from SE0001954A external-priority patent/SE0001954D0/xx

2001-02-06 Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M

2001-02-06 Priority to SE0100367A priority Critical patent/SE519713C2/sv

2001-02-06 Publication of SE0100367D0 publication Critical patent/SE0100367D0/xx

2001-05-23 Priority to DE60142832T priority patent/DE60142832D1/de

2001-05-23 Priority to KR1020027000938A priority patent/KR100902433B1/ko

2001-05-23 Priority to CN01801356A priority patent/CN1380987A/zh

2001-05-23 Priority to EP01934792A priority patent/EP1290481B1/de

2001-05-23 Priority to AT01934792T priority patent/ATE478356T1/de

2001-05-23 Priority to AU60942/01A priority patent/AU6094201A/en

2001-05-23 Priority to JP2001586503A priority patent/JP4808900B2/ja

2001-05-23 Priority to CA2380240A priority patent/CA2380240C/en

2001-05-23 Priority to US09/862,461 priority patent/US20020019068A1/en

2001-05-23 Priority to PCT/SE2001/001181 priority patent/WO2001090794A1/en

2001-11-26 Publication of SE0100367L publication Critical patent/SE0100367L/

2003-04-01 Publication of SE519713C2 publication Critical patent/SE519713C2/sv

2005-07-11 Priority to US11/177,493 priority patent/US7317746B2/en

Links

238000000034 method Methods 0.000 title claims abstract description 12
239000000835 fiber Substances 0.000 claims abstract description 5
229920000642 polymer Polymers 0.000 claims description 4
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 8
229910052710 silicon Inorganic materials 0.000 abstract description 8
239000010703 silicon Substances 0.000 abstract description 8
238000005516 engineering process Methods 0.000 abstract description 5
239000000758 substrate Substances 0.000 abstract description 4
239000004065 semiconductor Substances 0.000 abstract description 2
230000003287 optical effect Effects 0.000 description 7
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
239000000463 material Substances 0.000 description 4
229910000679 solder Inorganic materials 0.000 description 4
235000012431 wafers Nutrition 0.000 description 4
238000005266 casting Methods 0.000 description 3
230000000873 masking effect Effects 0.000 description 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
238000003491 array Methods 0.000 description 2
239000000969 carrier Substances 0.000 description 2
238000000708 deep reactive-ion etching Methods 0.000 description 2
150000004767 nitrides Chemical class 0.000 description 2
238000003825 pressing Methods 0.000 description 2
230000010076 replication Effects 0.000 description 2
239000000377 silicon dioxide Substances 0.000 description 2
239000004593 Epoxy Substances 0.000 description 1
229910052581 Si3N4 Inorganic materials 0.000 description 1
238000004026 adhesive bonding Methods 0.000 description 1
238000005253 cladding Methods 0.000 description 1
230000001808 coupling effect Effects 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000001312 dry etching Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
230000004927 fusion Effects 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
238000001459 lithography Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000000465 moulding Methods 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
229920002120 photoresistant polymer Polymers 0.000 description 1
239000010453 quartz Substances 0.000 description 1
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Landscapes

Physics & Mathematics (AREA)
Optics & Photonics (AREA)
General Physics & Mathematics (AREA)
Electromagnetism (AREA)
Engineering & Computer Science (AREA)
Plasma & Fusion (AREA)
Optical Couplings Of Light Guides (AREA)
Semiconductor Lasers (AREA)
Optical Integrated Circuits (AREA)
Manipulator (AREA)
Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)

SE0100367A 2000-05-23 2001-02-06 Förfarande och anordning för passiv upplinjering SE519713C2 (sv)

Priority Applications (12)

Application Number	Priority Date	Filing Date	Title
SE0100367A SE519713C2 (sv)	2000-05-23	2001-02-06	Förfarande och anordning för passiv upplinjering
PCT/SE2001/001181 WO2001090794A1 (en)	2000-05-23	2001-05-23	Method and device for passive alignment
US09/862,461 US20020019068A1 (en)	2000-05-23	2001-05-23	Method and device for passive alignment
AT01934792T ATE478356T1 (de)	2000-05-23	2001-05-23	Verfahren und vorrichtung zur passiven ausrichtung
KR1020027000938A KR100902433B1 (ko)	2000-05-23	2001-05-23	수동 정렬을 위한 방법 및 장치
CN01801356A CN1380987A (zh)	2000-05-23	2001-05-23	被动校准的方法和装置
EP01934792A EP1290481B1 (de)	2000-05-23	2001-05-23	Verfahren und vorrichtung zur passiven ausrichtung
DE60142832T DE60142832D1 (de)	2000-05-23	2001-05-23	Verfahren und vorrichtung zur passiven ausrichtung
AU60942/01A AU6094201A (en)	2000-05-23	2001-05-23	Method and device for passive alignment
JP2001586503A JP4808900B2 (ja)	2000-05-23	2001-05-23	受動位置合わせの方法および装置
CA2380240A CA2380240C (en)	2000-05-23	2001-05-23	Method and device for passive alignment
US11/177,493 US7317746B2 (en)	2000-05-23	2005-07-11	Method and device for passive alignment

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
SE0001954A SE0001954D0 (sv)	2000-05-23	2000-05-23	Anordning för passiv upplinjering
SE0100367A SE519713C2 (sv)	2000-05-23	2001-02-06	Förfarande och anordning för passiv upplinjering

Publications (3)

Publication Number	Publication Date
SE0100367D0 SE0100367D0 (sv)	2001-02-06
SE0100367L SE0100367L (sv)	2001-11-26
SE519713C2 true SE519713C2 (sv)	2003-04-01

Family

ID=26655120

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE0100367A SE519713C2 (sv)	2000-05-23	2001-02-06	Förfarande och anordning för passiv upplinjering

Country Status (11)

Country	Link
US (2)	US20020019068A1 (de)
EP (1)	EP1290481B1 (de)
JP (1)	JP4808900B2 (de)
KR (1)	KR100902433B1 (de)
CN (1)	CN1380987A (de)
AT (1)	ATE478356T1 (de)
AU (1)	AU6094201A (de)
CA (1)	CA2380240C (de)
DE (1)	DE60142832D1 (de)
SE (1)	SE519713C2 (de)
WO (1)	WO2001090794A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3975066B2 (ja) *	2001-10-12	2007-09-12	株式会社トプコン	レーザ発振装置
US7223635B1 (en) *	2003-07-25	2007-05-29	Hrl Laboratories, Llc	Oriented self-location of microstructures with alignment structures
JP4699262B2 (ja) *	2006-03-31	2011-06-08	京セラ株式会社	光導波路コネクタ及びそれを用いた光接続構造、並びに光導波路コネクタの製造方法
JP4754613B2 (ja) *	2008-11-27	2011-08-24	日東電工株式会社	光電気混載基板およびその製造方法
US8265436B2 (en)	2010-05-12	2012-09-11	Industrial Technology Research Institute	Bonding system for optical alignment
JP6052815B2 (ja) *	2014-09-30	2016-12-27	インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌＢｕｓｉｎｅｓｓＭａｃｈｉｎｅｓＣｏｒｐｏｒａｔｉｏｎ	導波路用のコネクタおよびアライメント方法
US10852492B1 (en) *	2014-10-29	2020-12-01	Acacia Communications, Inc.	Techniques to combine two integrated photonic substrates
US12164159B2 (en)	2021-12-22	2024-12-10	Teramount Ltd.	Backside optical connector
US9804334B2 (en)	2015-10-08	2017-10-31	Teramount Ltd.	Fiber to chip optical coupler
US10564374B2 (en)	2015-10-08	2020-02-18	Teramount Ltd.	Electro-optical interconnect platform
US12189195B2 (en)	2015-10-08	2025-01-07	Teramount Ltd.	Optical coupling
US12265259B2 (en)	2019-01-23	2025-04-01	Teramount Ltd.	Waveguide mode coupling
US12379555B2 (en)	2021-10-27	2025-08-05	Teramount Ltd.	Detachable connector for co-packaged optics
US11585991B2 (en)	2019-02-28	2023-02-21	Teramount Ltd.	Fiberless co-packaged optics
US12124087B2 (en)	2015-10-08	2024-10-22	Teramount Ltd.	Wideband surface coupling
US10048455B2 (en) *	2016-01-18	2018-08-14	Cisco Technology, Inc.	Passive fiber array connector alignment to photonic chip
US9835809B2 (en) *	2016-03-28	2017-12-05	Cisco Technology, Inc.	Alignment of optical components using nanomagnets
US10031299B2 (en)	2016-05-27	2018-07-24	Corning Optical Communications LLC	Silicon-based optical ports providing passive alignment connectivity
US10656339B2 (en)	2018-03-14	2020-05-19	Cisco Technology, Inc.	Fiber to chip alignment using passive vgroove structures
JP7662669B2 (ja) *	2020-02-03	2025-04-15	センコーアドバンスドコンポーネンツインコーポレイテッド	弾性平均結合
US11562984B1 (en)	2020-10-14	2023-01-24	Hrl Laboratories, Llc	Integrated mechanical aids for high accuracy alignable-electrical contacts
US12057429B1 (en)	2021-06-23	2024-08-06	Hrl Laboratories, Llc	Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0339706A (ja) *	1989-07-06	1991-02-20	Fujitsu Ltd	光モジュール
JP3090335B2 (ja) *	1990-12-03	2000-09-18	株式会社東芝	光半導体モジュール
JPH06130254A (ja) *	1992-10-15	1994-05-13	Toshiba Corp	光部品結合装置
US5412748A (en) *	1992-12-04	1995-05-02	Kabushiki Kaisha Toshiba	Optical semiconductor module
DE4240950C1 (de) *	1992-12-07	1994-03-31	Bosch Gmbh Robert	Verfahren zum Herstellen eines Deckels für eine integriert optische Schaltung und Deckel für eine integriert optische Schaltung
JPH0777634A (ja) *	1993-09-09	1995-03-20	Fujitsu Ltd	光端末装置
GB2293248B (en) *	1994-09-07	1998-02-18	Northern Telecom Ltd	Providing optical coupling between optical components
US5535296A (en) *	1994-09-28	1996-07-09	Optobahn Corporation	Integrated optoelectronic coupling and connector
TW298627B (en) *	1995-08-31	1997-02-21	At & T Corp	Article comprising a fiber-to-planar waveguide coupling and method of making the article
SE510049C2 (sv) *	1996-03-25	1999-04-12	Ericsson Telefon Ab L M	Anordning för att ansluta minst en vågledare till en optisk sändare eller mottagare
JPH1039176A (ja) *	1996-07-24	1998-02-13	Furukawa Electric Co Ltd:The	光素子の基板実装方法
KR100248407B1 (ko) *	1997-08-06	2000-03-15	이계철	광섬유와 광소자의 수동정렬 방법
DE19845227A1 (de) *	1998-10-01	2000-04-06	Daimler Chrysler Ag	Anordnung zur Justage optischer Komponenten
JP2000121889A (ja) *	1998-10-21	2000-04-28	Nec Corp	光モジュール及び該光モジュールの製造方法
JP2000171669A (ja) *	1998-12-03	2000-06-23	Hitachi Ltd	光素子アレイモジュールおよびその製造方法ならびに多芯光コネクタと光素子搭載基板
US6219470B1 (en) *	1999-09-23	2001-04-17	Xiang Zheng Tu	Wavelength division multiplexing transmitter and receiver module
JP2001324631A (ja) *	2000-05-12	2001-11-22	Nec Corp	基板、光ファイバ接続端部材、光素子ハウジング部材、光モジュール及び基板の製造方法

2001
- 2001-02-06 SE SE0100367A patent/SE519713C2/sv not_active IP Right Cessation
- 2001-05-23 KR KR1020027000938A patent/KR100902433B1/ko not_active Expired - Fee Related
- 2001-05-23 AT AT01934792T patent/ATE478356T1/de not_active IP Right Cessation
- 2001-05-23 EP EP01934792A patent/EP1290481B1/de not_active Expired - Lifetime
- 2001-05-23 AU AU60942/01A patent/AU6094201A/en not_active Abandoned
- 2001-05-23 DE DE60142832T patent/DE60142832D1/de not_active Expired - Lifetime
- 2001-05-23 CN CN01801356A patent/CN1380987A/zh active Pending
- 2001-05-23 CA CA2380240A patent/CA2380240C/en not_active Expired - Fee Related
- 2001-05-23 WO PCT/SE2001/001181 patent/WO2001090794A1/en not_active Ceased
- 2001-05-23 JP JP2001586503A patent/JP4808900B2/ja not_active Expired - Fee Related
- 2001-05-23 US US09/862,461 patent/US20020019068A1/en not_active Abandoned
2005
- 2005-07-11 US US11/177,493 patent/US7317746B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
SE0100367D0 (sv)	2001-02-06
US20060007972A1 (en)	2006-01-12
JP4808900B2 (ja)	2011-11-02
US7317746B2 (en)	2008-01-08
CA2380240A1 (en)	2001-11-29
ATE478356T1 (de)	2010-09-15
KR100902433B1 (ko)	2009-06-11
SE0100367L (sv)	2001-11-26
EP1290481B1 (de)	2010-08-18
DE60142832D1 (de)	2010-09-30
AU6094201A (en)	2001-12-03
WO2001090794A1 (en)	2001-11-29
CA2380240C (en)	2011-05-03
JP2003534568A (ja)	2003-11-18
EP1290481A1 (de)	2003-03-12
US20020019068A1 (en)	2002-02-14
KR20020021161A (ko)	2002-03-18
CN1380987A (zh)	2002-11-20

Legal Events

Date	Code	Title	Description
2009-10-13	NUG	Patent has lapsed

Publication	Publication Date	Title
SE519713C2 (sv)	2003-04-01	Förfarande och anordning för passiv upplinjering
CA2244496C (en)	2003-04-08	Optical fiber passive alignment apparatus using alignment platform
CN107430245B (zh)	2021-02-02	用于光子ic表征和封装的多端口光学探头
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JP4885399B2 (ja)	2012-02-29	光ファイバと光電子素子との受動的位置合わせのための方法およびデバイス
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