SE8302619L - Forfarande och anordning for framstellning av kopplingsplattor - Google Patents

Forfarande och anordning for framstellning av kopplingsplattor

Info

Publication number
SE8302619L
SE8302619L SE8302619A SE8302619A SE8302619L SE 8302619 L SE8302619 L SE 8302619L SE 8302619 A SE8302619 A SE 8302619A SE 8302619 A SE8302619 A SE 8302619A SE 8302619 L SE8302619 L SE 8302619L
Authority
SE
Sweden
Prior art keywords
foil
metal
screen
screen printing
hole
Prior art date
Application number
SE8302619A
Other languages
English (en)
Swedish (sv)
Other versions
SE8302619D0 (sv
Inventor
W Lundberg
H Winzer
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE8302619D0 publication Critical patent/SE8302619D0/xx
Publication of SE8302619L publication Critical patent/SE8302619L/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
SE8302619A 1982-05-13 1983-05-06 Forfarande och anordning for framstellning av kopplingsplattor SE8302619L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3217983A DE3217983C2 (de) 1982-05-13 1982-05-13 Verfahren zum Herstellen einer Abdeckmaske

Publications (2)

Publication Number Publication Date
SE8302619D0 SE8302619D0 (sv) 1983-05-06
SE8302619L true SE8302619L (sv) 1983-11-14

Family

ID=6163461

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8302619A SE8302619L (sv) 1982-05-13 1983-05-06 Forfarande och anordning for framstellning av kopplingsplattor

Country Status (9)

Country Link
JP (1) JPS58206192A (da)
CA (1) CA1196731A (da)
CH (1) CH659753A5 (da)
DE (1) DE3217983C2 (da)
DK (1) DK210983A (da)
GB (1) GB2120017B (da)
IT (1) IT1197651B (da)
NL (1) NL8301586A (da)
SE (1) SE8302619L (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3514093A1 (de) * 1985-04-16 1986-10-23 Kaspar 5241 Gebhardshain Eidenberg Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen
US4884337A (en) * 1986-11-26 1989-12-05 Epicor Technology, Inc. Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material
US4748742A (en) * 1986-11-26 1988-06-07 Multitek Corporation Method for temporarily sealing holes in printed circuit boards
US6276055B1 (en) 1998-09-02 2001-08-21 Hadco Santa Clara, Inc. Method and apparatus for forming plugs in vias of a circuit board layer
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
CN1444839A (zh) 2000-05-31 2003-09-24 Ttm先进电路公司 填充方法
AU2001264968A1 (en) 2000-05-31 2001-12-11 Honeywell International, Inc. Filling device
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
CN110557889A (zh) * 2018-05-30 2019-12-10 胜宏科技（惠州）股份有限公司 一种铝片网版塞孔的制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1249966B (de) * 1967-09-14 Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) Verfahren zum Herstellen von metallisierten Wandungen von Bohrungen in gedruckten Leiterplatten
GB1042234A (en) * 1965-03-05 1966-09-14 Mullard Ltd Multilayer printed circuits
GB1194853A (en) * 1967-02-16 1970-06-17 Btr Industries Ltd A Method of Forming Printed Circuits
JPS52118261A (en) * 1976-03-30 1977-10-04 Matsushita Electric Industrial Co Ltd Method of producing through hole printed circuit board
JPS5658797A (en) * 1979-10-18 1981-05-21 Yashima Denki Kk Ac power control circuit in induction motor
JPS5667985A (en) * 1979-11-08 1981-06-08 Matsushita Electric Industrial Co Ltd Method of printing ink using metal mask

Also Published As

Publication number Publication date
DE3217983C2 (de) 1984-03-29
GB2120017B (en) 1986-02-19
IT1197651B (it) 1988-12-06
CA1196731A (en) 1985-11-12
DK210983A (da) 1983-11-14
IT8348288A0 (it) 1983-05-13
NL8301586A (nl) 1983-12-01
GB2120017A (en) 1983-11-23
GB8312009D0 (en) 1983-06-08
DE3217983A1 (de) 1983-11-17
DK210983D0 (da) 1983-05-11
JPS58206192A (ja) 1983-12-01
SE8302619D0 (sv) 1983-05-06
CH659753A5 (de) 1987-02-13

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