JPS58206192A - プリント回路板の製造方法及び装置 - Google Patents

プリント回路板の製造方法及び装置

Info

Publication number: JPS58206192A
Authority: JP; Japan
Prior art keywords: foil; screen; holes; substrate; ink composition
Prior art date: 1982-05-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP58083445A

Other languages

English (en)

Japanese (ja)

Inventor

ウエルダ−・ルンドベルク

ヘルム−ト・ウインツエル

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Technologies Corp

Original Assignee

Kollmorgen Technologies Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-05-13

Filing date

1983-05-10

Publication date

1983-12-01

1983-05-10 Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp

1983-12-01 Publication of JPS58206192A publication Critical patent/JPS58206192A/ja

Status Pending legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims description 31
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
239000000758 substrate Substances 0.000 claims description 30
229910052802 copper Inorganic materials 0.000 claims description 28
239000010949 copper Substances 0.000 claims description 28
239000011888 foil Substances 0.000 claims description 25
229910052751 metal Inorganic materials 0.000 claims description 21
239000002184 metal Substances 0.000 claims description 21
238000007650 screen-printing Methods 0.000 claims description 21
238000005260 corrosion Methods 0.000 claims description 18
230000007797 corrosion Effects 0.000 claims description 18
239000011148 porous material Substances 0.000 claims description 14
239000000463 material Substances 0.000 claims description 12
239000000203 mixture Substances 0.000 claims description 11
238000004519 manufacturing process Methods 0.000 claims description 10
239000011347 resin Substances 0.000 claims description 7
229920005989 resin Polymers 0.000 claims description 7
238000005530 etching Methods 0.000 claims description 6
239000000853 adhesive Substances 0.000 claims description 5
230000001070 adhesive effect Effects 0.000 claims description 5
229910052782 aluminium Inorganic materials 0.000 claims description 3
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
238000000151 deposition Methods 0.000 claims description 3
238000010586 diagram Methods 0.000 claims description 3
239000004033 plastic Substances 0.000 claims description 3
239000002904 solvent Substances 0.000 claims description 2
238000009835 boiling Methods 0.000 claims 1
238000005429 filling process Methods 0.000 claims 1
230000000873 masking effect Effects 0.000 claims 1
239000010410 layer Substances 0.000 description 16
239000004020 conductor Substances 0.000 description 7
239000010408 film Substances 0.000 description 6
239000011889 copper foil Substances 0.000 description 5
238000007747 plating Methods 0.000 description 5
238000009713 electroplating Methods 0.000 description 4
239000000945 filler Substances 0.000 description 4
229920002120 photoresistant polymer Polymers 0.000 description 3
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
230000001681 protective effect Effects 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
239000004593 Epoxy Substances 0.000 description 1
229910001128 Sn alloy Inorganic materials 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
239000012790 adhesive layer Substances 0.000 description 1
230000002411 adverse Effects 0.000 description 1
238000007605 air drying Methods 0.000 description 1
229910001870 ammonium persulfate Inorganic materials 0.000 description 1
229910052785 arsenic Inorganic materials 0.000 description 1
RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
230000003197 catalytic effect Effects 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
150000001879 copper Chemical class 0.000 description 1
QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
239000003085 diluting agent Substances 0.000 description 1
238000001035 drying Methods 0.000 description 1
239000003365 glass fiber Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
239000012528 membrane Substances 0.000 description 1
229910001092 metal group alloy Inorganic materials 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000012041 precatalyst Substances 0.000 description 1
238000007639 printing Methods 0.000 description 1
230000005855 radiation Effects 0.000 description 1
230000003678 scratch resistant effect Effects 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000007921 spray Substances 0.000 description 1
239000010409 thin film Substances 0.000 description 1
229910000597 tin-copper alloy Inorganic materials 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Printing Plates And Materials Therefor (AREA)
Manufacturing Of Printed Wiring (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)

JP58083445A 1982-05-13 1983-05-10 プリント回路板の製造方法及び装置 Pending JPS58206192A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE3217983A DE3217983C2 (de)	1982-05-13	1982-05-13	Verfahren zum Herstellen einer Abdeckmaske
DE32179839		1982-05-13

Publications (1)

Publication Number	Publication Date
JPS58206192A true JPS58206192A (ja)	1983-12-01

Family

ID=6163461

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP58083445A Pending JPS58206192A (ja)	1982-05-13	1983-05-10	プリント回路板の製造方法及び装置

Country Status (9)

Country	Link
JP (1)	JPS58206192A (da)
CA (1)	CA1196731A (da)
CH (1)	CH659753A5 (da)
DE (1)	DE3217983C2 (da)
DK (1)	DK210983A (da)
GB (1)	GB2120017B (da)
IT (1)	IT1197651B (da)
NL (1)	NL8301586A (da)
SE (1)	SE8302619L (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3514093A1 (de) *	1985-04-16	1986-10-23	Kaspar 5241 Gebhardshain Eidenberg	Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen
US4884337A (en) *	1986-11-26	1989-12-05	Epicor Technology, Inc.	Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material
US4748742A (en) *	1986-11-26	1988-06-07	Multitek Corporation	Method for temporarily sealing holes in printed circuit boards
US6276055B1 (en)	1998-09-02	2001-08-21	Hadco Santa Clara, Inc.	Method and apparatus for forming plugs in vias of a circuit board layer
US6855385B2 (en)	2000-05-31	2005-02-15	Ttm Advanced Circuits, Inc.	PCB support plate for PCB via fill
CN1444839A (zh)	2000-05-31	2003-09-24	Ttm先进电路公司	填充方法
AU2001264968A1 (en)	2000-05-31	2001-12-11	Honeywell International, Inc.	Filling device
US6454154B1 (en)	2000-05-31	2002-09-24	Honeywell Advanced Circuits, Inc.	Filling device
US6800232B2 (en)	2000-05-31	2004-10-05	Ttm Advanced Circuits, Inc.	PCB support plate method for PCB via fill
US6506332B2 (en)	2000-05-31	2003-01-14	Honeywell International Inc.	Filling method
CN110557889A (zh) *	2018-05-30	2019-12-10	胜宏科技（惠州）股份有限公司	一种铝片网版塞孔的制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52118261A (en) *	1976-03-30	1977-10-04	Matsushita Electric Industrial Co Ltd	Method of producing through hole printed circuit board
JPS5658797A (en) *	1979-10-18	1981-05-21	Yashima Denki Kk	Ac power control circuit in induction motor
JPS5667985A (en) *	1979-11-08	1981-06-08	Matsushita Electric Industrial Co Ltd	Method of printing ink using metal mask

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1249966B (de) *		1967-09-14	Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.)	Verfahren zum Herstellen von metallisierten Wandungen von Bohrungen in gedruckten Leiterplatten
GB1042234A (en) *	1965-03-05	1966-09-14	Mullard Ltd	Multilayer printed circuits
GB1194853A (en) *	1967-02-16	1970-06-17	Btr Industries Ltd	A Method of Forming Printed Circuits

1982
- 1982-05-13 DE DE3217983A patent/DE3217983C2/de not_active Expired
1983
- 1983-05-03 GB GB08312009A patent/GB2120017B/en not_active Expired
- 1983-05-04 NL NL8301586A patent/NL8301586A/nl not_active Application Discontinuation
- 1983-05-06 SE SE8302619A patent/SE8302619L/xx not_active Application Discontinuation
- 1983-05-10 CH CH2557/83A patent/CH659753A5/de not_active IP Right Cessation
- 1983-05-10 JP JP58083445A patent/JPS58206192A/ja active Pending
- 1983-05-11 DK DK210983A patent/DK210983A/da not_active Application Discontinuation
- 1983-05-13 IT IT48288/83A patent/IT1197651B/it active
- 1983-05-13 CA CA000428115A patent/CA1196731A/en not_active Expired

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS52118261A (en) *	1976-03-30	1977-10-04	Matsushita Electric Industrial Co Ltd	Method of producing through hole printed circuit board
JPS5658797A (en) *	1979-10-18	1981-05-21	Yashima Denki Kk	Ac power control circuit in induction motor
JPS5667985A (en) *	1979-11-08	1981-06-08	Matsushita Electric Industrial Co Ltd	Method of printing ink using metal mask

Also Published As

Publication number	Publication date
DE3217983C2 (de)	1984-03-29
GB2120017B (en)	1986-02-19
IT1197651B (it)	1988-12-06
CA1196731A (en)	1985-11-12
DK210983A (da)	1983-11-14
IT8348288A0 (it)	1983-05-13
NL8301586A (nl)	1983-12-01
GB2120017A (en)	1983-11-23
GB8312009D0 (en)	1983-06-08
DE3217983A1 (de)	1983-11-17
DK210983D0 (da)	1983-05-11
SE8302619L (sv)	1983-11-14
SE8302619D0 (sv)	1983-05-06
CH659753A5 (de)	1987-02-13

Publication	Publication Date	Title
US4529477A (en)	1985-07-16	Process for the manufacture of printed circuit boards
US3672986A (en)	1972-06-27	Metallization of insulating substrates
EP0003605B1 (en)	1982-12-15	Toning and solvent washout process for making conductive interconnections
US3698940A (en)	1972-10-17	Method of making additive printed circuit boards and product thereof
US3666549A (en)	1972-05-30	Method of making additive printed circuit boards and product thereof
JPS60207395A (ja)	1985-10-18	スルーホールメツキした電気プリント回路板の製造法
CA1196731A (en)	1985-11-12	Process and device for the manufacture of printed circuit boards
JP2002525882A (ja)	2002-08-13	多層回路の製造方法
JP3037755B2 (ja)	2000-05-08	プリント配線基板の製造方法
GB2030781A (en)	1980-04-10	Multilayer printed circuit
JPH09307216A (ja)	1997-11-28	配線基板の製造方法及び配線基板
JPH0964538A (ja)	1997-03-07	プリント配線板の製造方法
US3819430A (en)	1974-06-25	Method of manufacturing circuit board connectors
JP7390846B2 (ja)	2023-12-04	リジッド・フレックス多層プリント配線板及びその製造方法
CN115379661A (zh)	2022-11-22	一种印制线路板及其制备方法
JP2713037B2 (ja)	1998-02-16	プリント配線板及びその製造方法
JPH09506468A (ja)	1997-06-24	プリント回路基板の製造方法
JPH0756910B2 (ja)	1995-06-14	スルーホール付配線板の製造方法
CA1258138A (en)	1989-08-01	Method for manufacture of printed circuit boards having solder-masked traces
JP3191686B2 (ja)	2001-07-23	印刷配線板の製造方法
JPS6088494A (ja)	1985-05-18	回路基板の製造方法
JPH0528919B2 (da)	1993-04-27
JPH02144988A (ja)	1990-06-04	スルーホール付配線板の製造方法
JPH02143584A (ja)	1990-06-01	スルーホール付配線板の製造方法
JPH029195A (ja)	1990-01-12	スルーホール付印刷配線板の製造方法