SG128506A1 - Ultrasonic cleaning module - Google Patents

Ultrasonic cleaning module

Info

Publication number
SG128506A1
SG128506A1 SG200504058A SG200504058A SG128506A1 SG 128506 A1 SG128506 A1 SG 128506A1 SG 200504058 A SG200504058 A SG 200504058A SG 200504058 A SG200504058 A SG 200504058A SG 128506 A1 SG128506 A1 SG 128506A1
Authority
SG
Singapore
Prior art keywords
chuck
packages
nozzle
electronic packages
ultrasonic cleaning
Prior art date
Application number
SG200504058A
Other languages
English (en)
Inventor
Cheung Yiu Ming
Sze Chak Tong
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of SG128506A1 publication Critical patent/SG128506A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning By Liquid Or Steam (AREA)
SG200504058A 2002-04-30 2003-04-25 Ultrasonic cleaning module SG128506A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37701802P 2002-04-30 2002-04-30
US10/413,602 US6949146B2 (en) 2002-04-30 2003-04-14 Ultrasonic cleaning module for singulated electronic packages

Publications (1)

Publication Number Publication Date
SG128506A1 true SG128506A1 (en) 2007-01-30

Family

ID=29219037

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200504058A SG128506A1 (en) 2002-04-30 2003-04-25 Ultrasonic cleaning module

Country Status (7)

Country Link
US (1) US6949146B2 (de)
EP (1) EP1358950B1 (de)
JP (1) JP2004006855A (de)
KR (1) KR100588252B1 (de)
AT (1) ATE474674T1 (de)
DE (1) DE60333416D1 (de)
SG (1) SG128506A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050103916A (ko) * 2003-02-04 2005-11-01 포워드 테크놀로지 에이 크레스트 그룹 컴퍼니 초음파 세척 탱크
US8978673B2 (en) * 2007-08-09 2015-03-17 Asm Assembly Automation Ltd Megasonic cleaning system
KR100873333B1 (ko) * 2007-11-21 2008-12-10 세메스 주식회사 처리 유체 공급 장치 및 이를 포함하는 기판 처리 장치
JP2013169474A (ja) * 2012-02-17 2013-09-02 Mitsubishi Electric Corp 異物除去方法、異物除去装置
JP6321912B2 (ja) * 2013-03-29 2018-05-09 芝浦メカトロニクス株式会社 基板の洗浄処理装置及び洗浄処理方法
CN103456605B (zh) * 2013-09-24 2016-02-10 深圳市凯尔迪光电科技有限公司 全自动半导体封装微尘清洗设备
CN106733906B (zh) * 2016-11-30 2024-04-09 武汉大学深圳研究院 一种用于清洗太阳能电池板污垢的超声波清洗装置
US20190363018A1 (en) 2018-05-24 2019-11-28 Semiconductor Components Industries, Llc Die cleaning systems and related methods
JP2020134289A (ja) * 2019-02-19 2020-08-31 キオクシア株式会社 半導体装置の検査方法及び検査装置
CN111889446A (zh) * 2020-06-29 2020-11-06 中国电子科技集团公司第十三研究所 元器件水溶胶清洗机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3369418B2 (ja) * 1996-11-25 2003-01-20 大日本スクリーン製造株式会社 超音波振動子、超音波洗浄ノズル、超音波洗浄装置、基板洗浄装置、基板洗浄処理システムおよび超音波洗浄ノズル製造方法
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
JPH1154471A (ja) * 1997-08-05 1999-02-26 Tokyo Electron Ltd 処理装置及び処理方法
JP2944598B2 (ja) * 1997-11-21 1999-09-06 株式会社プレテック 洗浄装置および精密基板を洗浄する方法
JP4388640B2 (ja) * 1999-09-10 2009-12-24 株式会社ディスコ Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル
US6730176B2 (en) * 2001-07-09 2004-05-04 Birol Kuyel Single wafer megasonic cleaner method, system, and apparatus
US6746022B2 (en) * 2001-12-26 2004-06-08 Asm Assembly Automation Ltd. Chuck for holding a workpiece

Also Published As

Publication number Publication date
KR20030086240A (ko) 2003-11-07
ATE474674T1 (de) 2010-08-15
US20030200987A1 (en) 2003-10-30
DE60333416D1 (de) 2010-09-02
JP2004006855A (ja) 2004-01-08
US6949146B2 (en) 2005-09-27
EP1358950A1 (de) 2003-11-05
KR100588252B1 (ko) 2006-06-12
EP1358950B1 (de) 2010-07-21

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