SG154406A1 - Mcm packages - Google Patents

Mcm packages

Info

Publication number
SG154406A1
SG154406A1 SG200900242-9A SG2009002429A SG154406A1 SG 154406 A1 SG154406 A1 SG 154406A1 SG 2009002429 A SG2009002429 A SG 2009002429A SG 154406 A1 SG154406 A1 SG 154406A1
Authority
SG
Singapore
Prior art keywords
substrate
ipd
heat sink
chip
system substrate
Prior art date
Application number
SG200900242-9A
Other languages
English (en)
Inventor
Yinon Degani
Yu Fan
Charley Chunlei Gao
Kunquan Sun
Liguo Sun
Original Assignee
Sychip Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sychip Inc filed Critical Sychip Inc
Publication of SG154406A1 publication Critical patent/SG154406A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
SG200900242-9A 2008-01-22 2009-01-14 Mcm packages SG154406A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/009,805 US20090184416A1 (en) 2008-01-22 2008-01-22 MCM packages

Publications (1)

Publication Number Publication Date
SG154406A1 true SG154406A1 (en) 2009-08-28

Family

ID=40791395

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200900242-9A SG154406A1 (en) 2008-01-22 2009-01-14 Mcm packages

Country Status (7)

Country Link
US (1) US20090184416A1 (fr)
EP (1) EP2093798A3 (fr)
JP (1) JP2009218576A (fr)
KR (1) KR20090080914A (fr)
CN (1) CN101599486A (fr)
CA (1) CA2647863A1 (fr)
SG (1) SG154406A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101814443B (zh) * 2010-03-31 2011-07-20 中国人民解放军国防科学技术大学 一种带光接口的高性能处理器多芯片组件芯片设计方法
CN106462788B (zh) * 2014-03-18 2020-07-07 惠普发展公司，有限责任合伙企业 安全元件
KR102287396B1 (ko) 2014-10-21 2021-08-06 삼성전자주식회사 시스템 온 패키지 모듈과 이를 포함하는 모바일 컴퓨팅 장치
KR102445515B1 (ko) * 2017-09-29 2022-09-21 현대자동차주식회사 차량용 전력모듈
US11812545B2 (en) 2020-01-08 2023-11-07 Delta Electronics (Shanghai) Co., Ltd Power supply system and electronic device
US12342450B2 (en) 2020-01-08 2025-06-24 Delta Electronics (Shanghai) Co., Ltd Power supply apparatus, load and electronic device
US12610453B2 (en) 2020-01-08 2026-04-21 Delta Electronics (Shanghai) Co., Ltd. Vertical power supply system and manufacturing method of connection board
CN113097190B (zh) 2020-01-08 2024-08-13 台达电子企业管理（上海）有限公司 电源模块及电子装置
CN113096933B (zh) 2020-01-08 2022-04-22 台达电子企业管理（上海）有限公司 多相耦合电感、多相耦合电感阵列及两相反耦合电感
CN113098234B (zh) 2020-01-08 2022-11-01 台达电子企业管理（上海）有限公司 供电系统
CN112509998A (zh) * 2020-11-18 2021-03-16 杰群电子科技（东莞）有限公司 一种高功率半导体产品晶圆级封装工艺及半导体产品
CN117174000A (zh) * 2023-09-19 2023-12-05 京东方科技集团股份有限公司 一种显示模组以及显示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3549294B2 (ja) * 1995-08-23 2004-08-04 新光電気工業株式会社 半導体装置及びその実装構造
US5869894A (en) 1997-07-18 1999-02-09 Lucent Technologies Inc. RF IC package
DE19746835A1 (de) * 1997-10-23 1999-05-06 Jenoptik Jena Gmbh Verfahren zum Montieren einer einseitig mit einer HR-Schicht beschichteten Laserkristallscheibe auf einen Kühlkörper und verfahrensgemäß hergestellte Schichtanordnung
JP2000243467A (ja) * 1999-02-17 2000-09-08 Toyota Motor Corp 電子部品基板のはんだ付け方法
JP2001257234A (ja) * 2000-03-08 2001-09-21 Kobe Steel Ltd 半導体装置及びその製造方法
US6525413B1 (en) * 2000-07-12 2003-02-25 Micron Technology, Inc. Die to die connection method and assemblies and packages including dice so connected
US7176506B2 (en) * 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
JP3768880B2 (ja) * 2001-12-28 2006-04-19 松下電器産業株式会社 フリップチップ実装基板、製造方法及び無線装置
JP3968051B2 (ja) * 2003-05-14 2007-08-29 富士通株式会社 半導体装置とその製造方法、および半導体装置前駆体とその製造方法
KR100543729B1 (ko) * 2004-03-24 2006-01-20 아바고테크놀로지스코리아 주식회사 열 방출 효율이 높고 두께는 물론 크기를 감소시킨 고주파모듈 패키지 및 그 조립 방법
US7759793B2 (en) * 2004-12-13 2010-07-20 Renesas Technology Corp. Semiconductor device having elastic solder bump to prevent disconnection

Also Published As

Publication number Publication date
CN101599486A (zh) 2009-12-09
KR20090080914A (ko) 2009-07-27
EP2093798A2 (fr) 2009-08-26
EP2093798A3 (fr) 2012-11-14
JP2009218576A (ja) 2009-09-24
CA2647863A1 (fr) 2009-07-22
US20090184416A1 (en) 2009-07-23

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