SG58992G - Integrated circuit device having strip line structure therein - Google Patents

Integrated circuit device having strip line structure therein

Info

Publication number
SG58992G
SG58992G SG589/92A SG58992A SG58992G SG 58992 G SG58992 G SG 58992G SG 589/92 A SG589/92 A SG 589/92A SG 58992 A SG58992 A SG 58992A SG 58992 G SG58992 G SG 58992G
Authority
SG
Singapore
Prior art keywords
line structure
strip line
microstrip line
integrated circuit
semiconductor chip
Prior art date
Application number
SG589/92A
Other languages
English (en)
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of SG58992G publication Critical patent/SG58992G/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/209—Vertical interconnections, e.g. vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Microwave Amplifiers (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Waveguides (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Train Traffic Observation, Control, And Security (AREA)
SG589/92A 1985-04-13 1992-06-03 Integrated circuit device having strip line structure therein SG58992G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077550A JPH0812887B2 (ja) 1985-04-13 1985-04-13 高速集積回路パツケ−ジ

Publications (1)

Publication Number Publication Date
SG58992G true SG58992G (en) 1992-09-04

Family

ID=13637119

Family Applications (1)

Application Number Title Priority Date Filing Date
SG589/92A SG58992G (en) 1985-04-13 1992-06-03 Integrated circuit device having strip line structure therein

Country Status (8)

Country Link
US (1) US4875087A (de)
EP (1) EP0198698B1 (de)
JP (1) JPH0812887B2 (de)
AT (1) ATE68915T1 (de)
CA (1) CA1246170A (de)
DE (1) DE3682101D1 (de)
HK (1) HK56592A (de)
SG (1) SG58992G (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2612697B1 (fr) * 1987-03-20 1989-06-16 Thomson Csf Jonction entre une ligne triplaque et une ligne microruban et applications
JPS63258046A (ja) * 1987-04-15 1988-10-25 Toshiba Corp 半導体集積回路装置
JP2507476B2 (ja) * 1987-09-28 1996-06-12 株式会社東芝 半導体集積回路装置
JP2580674B2 (ja) * 1988-02-08 1997-02-12 三菱電機株式会社 高周波用モールド型パッケージ
FR2630261B1 (fr) * 1988-04-15 1990-08-17 Trt Telecom Radio Electr Circuit utilisable dans le domaine des hyperfrequences
US5136271A (en) * 1989-01-09 1992-08-04 Mitsubishi Denki Kabushiki Kaisha Microwave integrated circuit mountings
US5157477A (en) * 1990-01-10 1992-10-20 International Business Machines Corporation Matched impedance vertical conductors in multilevel dielectric laminated wiring
JPH0716100B2 (ja) * 1990-01-10 1995-02-22 インターナショナル・ビジネス・マシーンズ・コーポレーション 多層配線モジュール
US5065227A (en) * 1990-06-04 1991-11-12 International Business Machines Corporation Integrated circuit packaging using flexible substrate
EP0468379B1 (de) * 1990-07-21 1999-11-17 Mitsui Chemicals, Inc. Halbleiteranordnung mit einer Packung
US5065124A (en) * 1990-09-04 1991-11-12 Watkins-Johnson Company DC-40 GHz module interface
JPH0766949B2 (ja) * 1990-09-28 1995-07-19 富士通株式会社 Ｉｃパッケージ
US5132613A (en) * 1990-11-30 1992-07-21 International Business Machines Corporation Low inductance side mount decoupling test structure
US5184095A (en) * 1991-07-31 1993-02-02 Hughes Aircraft Company Constant impedance transition between transmission structures of different dimensions
EP0563873B1 (de) * 1992-04-03 1998-06-03 Matsushita Electric Industrial Co., Ltd. Keramisches Mehrschicht-Substrat für hohe Frequenzen
US5376909A (en) * 1992-05-29 1994-12-27 Texas Instruments Incorporated Device packaging
FR2695514B1 (fr) * 1992-09-10 1994-10-21 Alcatel Telspace Dispositif hyperfréquence comprenant un filtre triplaque réalisé dans une semelle conductrice d'électricité recouverte d'un matériau diélectrique.
US5338970A (en) * 1993-03-24 1994-08-16 Intergraph Corporation Multi-layered integrated circuit package with improved high frequency performance
US6271579B1 (en) * 1993-10-08 2001-08-07 Stratedge Corporation High-frequency passband microelectronics package
EP0764393B1 (de) * 1995-03-02 2001-07-04 Circuit Components, Incorporated Kostengünstiges hochleistungsgehäuse für mikrowellenschaltungen im 90 ghz-bereich mit bga ein/ausgangsformat und keramischer substrattechnologie
GB2298957A (en) * 1995-03-16 1996-09-18 Oxley Dev Co Ltd Microstrip microwave package
DE19534309C1 (de) * 1995-09-15 1997-03-27 Siemens Ag Anordnung zum Übertragen von Signalen über Triplate-Leitungen
FR2739492B1 (fr) * 1995-10-03 1997-11-07 Dassault Electronique Circuit hyperfrequence multi-couches a elements actifs integres
FR2739496B1 (fr) * 1995-10-03 1998-01-30 Dassault Electronique Circuit hyperfrequence multicouches a elements actifs integres
US5952709A (en) * 1995-12-28 1999-09-14 Kyocera Corporation High-frequency semiconductor device and mounted structure thereof
EP0795907A1 (de) * 1996-03-14 1997-09-17 Dassault Electronique Mehrlagige Hochfrequenzschaltung mit integrierten aktiven Elementen
US6018283A (en) * 1996-12-18 2000-01-25 Texas Instruments Incorporated Ultrawide bandwidth Z-axis interconnect
US6687842B1 (en) * 1997-04-02 2004-02-03 Tessera, Inc. Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6261872B1 (en) * 1997-09-18 2001-07-17 Trw Inc. Method of producing an advanced RF electronic package
US5923234A (en) * 1997-10-27 1999-07-13 Lockheed Martin Corp. Hermetic feedthrough using three-via transmission lines
US6057600A (en) * 1997-11-27 2000-05-02 Kyocera Corporation Structure for mounting a high-frequency package
KR100563122B1 (ko) * 1998-01-30 2006-03-21 다이요 유덴 가부시키가이샤 하이브리드 모듈 및 그 제조방법 및 그 설치방법
US6225690B1 (en) * 1999-12-10 2001-05-01 Lsi Logic Corporation Plastic ball grid array package with strip line configuration
JP2001308547A (ja) * 2000-04-27 2001-11-02 Sharp Corp 高周波多層回路基板
TW452953B (en) * 2000-05-22 2001-09-01 Via Tech Inc BGA chip package capable of decreasing its impedance when operating at high frequency
WO2001095425A1 (en) * 2000-06-09 2001-12-13 Synergy Microwave Corporation Multi-layer microwave circuits and methods of manufacture
JP3487283B2 (ja) * 2000-10-31 2004-01-13 三菱電機株式会社 差動ストリップ線路垂直変換器および光モジュール
JP4462758B2 (ja) * 2000-12-27 2010-05-12 京セラ株式会社 高周波用配線基板
FR2826780A1 (fr) * 2001-06-28 2003-01-03 St Microelectronics Sa Dispositif semi-conducteur a structure hyperfrequence
DE10212769A1 (de) * 2002-03-22 2003-10-02 Dystar Textilfarben Gmbh & Co Farbstoffmischungen von faserreaktiven Azofarbstoffen, ihre Herstellung und ihre Verwendung
JP2005086603A (ja) 2003-09-10 2005-03-31 Tdk Corp 電子部品モジュールおよびその製造方法
US7630188B2 (en) 2005-03-01 2009-12-08 X2Y Attenuators, Llc Conditioner with coplanar conductors
US8159832B2 (en) * 2007-09-21 2012-04-17 Nokia Corporation Electromagnetic band gap structures and method for making same
US8081045B1 (en) * 2008-08-08 2011-12-20 Lockheed Martin Corporation Beamformer power divider/combiner with transmission lines distributed between MMIC and associated PC board
JP5636834B2 (ja) * 2010-09-10 2014-12-10 富士通株式会社 高周波回路用パッケージ及び高周波回路装置
US10062972B1 (en) * 2013-04-23 2018-08-28 National Technology & Engineering Solutions Of Sandia, Llc Antenna array with low Rx and Tx sidelobe levels
US11289814B2 (en) 2017-11-10 2022-03-29 Raytheon Company Spiral antenna and related fabrication techniques
US11121474B2 (en) 2017-11-10 2021-09-14 Raytheon Company Additive manufacturing technology (AMT) low profile radiator
WO2019094600A1 (en) 2017-11-10 2019-05-16 Raytheon Company Additive manufacturing technology (amt) faraday boundaries in radio frequency circuits
EP3707774B1 (de) 2017-11-10 2025-03-26 Raytheon Company Millimeterwellenübertragungsleitungsarchitektur
US20190150296A1 (en) * 2017-11-10 2019-05-16 Raytheon Company Additive manufacturing technology microwave vertical launch
IL275262B2 (en) 2018-02-28 2024-09-01 Raytheon Co Additive manufacturing technology (amt) low profile signal divider
AU2019228500B2 (en) 2018-02-28 2023-07-20 Raytheon Company Snap-RF interconnections

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715635A (en) * 1971-06-25 1973-02-06 Bendix Corp High frequency matched impedance microcircuit holder
GB1501500A (en) * 1975-06-20 1978-02-15 Int Computers Ltd Multilayer printed circuit boards
GB2007911B (en) * 1977-10-12 1982-03-24 Secr Defence Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages
US4259684A (en) * 1978-10-13 1981-03-31 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Packages for microwave integrated circuits
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
GB2078845A (en) * 1980-06-23 1982-01-13 Electronic Locks Sweden Ab Lock system for storage units
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
CA1246755A (en) * 1985-03-30 1988-12-13 Akira Miyauchi Semiconductor device
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing

Also Published As

Publication number Publication date
DE3682101D1 (de) 1991-11-28
JPH0812887B2 (ja) 1996-02-07
HK56592A (en) 1992-08-07
CA1246170A (en) 1988-12-06
EP0198698A2 (de) 1986-10-22
EP0198698A3 (en) 1988-08-03
US4875087A (en) 1989-10-17
JPS61239650A (ja) 1986-10-24
ATE68915T1 (de) 1991-11-15
EP0198698B1 (de) 1991-10-23

Similar Documents

Publication Publication Date Title
SG58992G (en) Integrated circuit device having strip line structure therein
EP0198621B1 (de) Halbleiteranordnung
US4918571A (en) Chip carrier with energy storage means
KR850005158A (ko) 반도체 집적회로 장치
ATE61696T1 (de) Integrierte schaltungsanordnung mit gestapelten leiterschichten zum verbinden von schaltungselementen.
TW347582B (en) Chip package board having utility rings
EP0337686A3 (de) Halbleiterchipmodul
TW429560B (en) Heatspreader for a flip chip device, and method for connecting the heatspreader
EP0377932A3 (de) Baugruppe von integrierten Halbleiterschaltungen
ES464959A1 (es) Perfeccionamientos introducidos en un paquete ceramico meta-lizado para circuitos de alta velocidad.
GB1362136A (en) Transistor package
IL102269A (en) Integrated socket-type package for flip chip semiconductor devices and circuits
EP0299768A3 (de) Filmträger für Halbleiterchips
KR880011914A (ko) 전기 도전 캐리어 플레이트를 포함하는 집적회로
EP0354708A3 (de) Allgemeine dreidimensionale Packung
KR860002143A (ko) 지역 접합용 테이프
SE9801988L (sv) Integrerad mikrovåghybridkrets
ES8602307A1 (es) Un dispositivo conectador activo con capacidad de tratamiento de senales electricas
TW373312B (en) Semiconductor device, circuit board and combination of semiconductor device and circuit board
EP0221496A3 (de) Integrierte Schaltungspackung
ES295772U (es) Un encapsulado plano para pastillas de memoria de circuito integrado, de aplicacion especial a circuitos de aviacion
JPS57180155A (en) Vessel for electronic circuit
EP0213864A3 (de) Symmetrierschaltungen
MY126632A (en) Electronic circuit interconnection system using virtual mirror packages
SE9303142D0 (sv) Mikrovågskrets