SG63637A1 - Apparatus and method for cleaning semiconductor wafers - Google Patents

Apparatus and method for cleaning semiconductor wafers

Info

Publication number
SG63637A1
SG63637A1 SG1996009199A SG1996009199A SG63637A1 SG 63637 A1 SG63637 A1 SG 63637A1 SG 1996009199 A SG1996009199 A SG 1996009199A SG 1996009199 A SG1996009199 A SG 1996009199A SG 63637 A1 SG63637 A1 SG 63637A1
Authority
SG
Singapore
Prior art keywords
semiconductor wafers
cleaning semiconductor
cleaning
wafers
semiconductor
Prior art date
Application number
SG1996009199A
Other languages
English (en)
Inventor
Eugene Robert Hollander
Henry F Erk
Jing Chai
Ronald Dean Bartram
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Publication of SG63637A1 publication Critical patent/SG63637A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
SG1996009199A 1995-04-19 1996-04-17 Apparatus and method for cleaning semiconductor wafers SG63637A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/424,904 US5593505A (en) 1995-04-19 1995-04-19 Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface

Publications (1)

Publication Number Publication Date
SG63637A1 true SG63637A1 (en) 1999-03-30

Family

ID=23684361

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996009199A SG63637A1 (en) 1995-04-19 1996-04-17 Apparatus and method for cleaning semiconductor wafers

Country Status (8)

Country Link
US (2) US5593505A (fr)
EP (1) EP0740331A3 (fr)
JP (1) JPH08293478A (fr)
KR (1) KR960039177A (fr)
CN (1) CN1139292A (fr)
MY (1) MY133617A (fr)
SG (1) SG63637A1 (fr)
TW (1) TW358219B (fr)

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US20050211379A1 (en) * 2004-03-29 2005-09-29 Hung-Wen Su Apparatus and method for removing metal from wafer edge
JP4854236B2 (ja) * 2005-08-26 2012-01-18 東京エレクトロン株式会社 洗浄装置および洗浄方法、ならびにコンピュータ読取可能な記憶媒体
JP4762822B2 (ja) 2006-08-03 2011-08-31 東京エレクトロン株式会社 薬液混合方法および薬液混合装置
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KR20120081513A (ko) * 2011-01-11 2012-07-19 삼성모바일디스플레이주식회사 마스크 세정 장치
JP5696491B2 (ja) * 2011-01-20 2015-04-08 株式会社Sumco ウェーハ洗浄装置及び洗浄方法
JP2012178458A (ja) * 2011-02-25 2012-09-13 Fujitsu Ltd 半導体装置の製造方法及び半導体基板の洗浄方法
CN102430543B (zh) * 2011-12-30 2016-06-01 上海集成电路研发中心有限公司 晶圆的清洗装置及清洗方法
JP6161236B2 (ja) * 2012-03-29 2017-07-12 三菱重工業株式会社 原子力用多孔板の洗浄装置
CN102737982B (zh) * 2012-06-18 2015-10-28 中国电子科技集团公司第四十八研究所 一种硅片运动式制绒装置
CN102969226B (zh) * 2012-11-01 2017-06-23 上海集成电路研发中心有限公司 晶圆边缘的处理装置和系统
CN103212551A (zh) * 2013-04-02 2013-07-24 苏州海铂晶体有限公司 一种用于晶片的超声波清洗装置
US9562291B2 (en) 2014-01-14 2017-02-07 Mei, Llc Metal etch system
CN105355580B (zh) * 2015-12-15 2018-08-14 天津津芯微电子科技有限公司 用于浸泡片状物品的治具
CN109473373B (zh) * 2017-09-08 2024-05-03 Tcl环鑫半导体(天津)有限公司 一种用于挖沟槽的硅片旋转装置
CN109759937A (zh) * 2019-01-30 2019-05-17 西安奕斯伟硅片技术有限公司 一种硅片的处理方法和装置
CN110238122B (zh) * 2019-07-18 2024-11-29 陕西科技大学 一种石英晶片清洗装置及清洗方法
CN110660662B (zh) * 2019-10-08 2021-02-02 江苏晟驰微电子有限公司 一种新型硅腐蚀工艺
CN111540704B (zh) * 2020-07-10 2020-09-25 清华大学 晶圆偏转装置和晶圆处理装备
CN112775099A (zh) * 2021-01-27 2021-05-11 南京工业职业技术大学 一种新能源汽车生产用零部件清洗装置

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Also Published As

Publication number Publication date
EP0740331A2 (fr) 1996-10-30
KR960039177A (ko) 1996-11-21
TW358219B (en) 1999-05-11
MY133617A (en) 2007-11-30
US5593505A (en) 1997-01-14
EP0740331A3 (fr) 1997-07-30
JPH08293478A (ja) 1996-11-05
US5626159A (en) 1997-05-06
CN1139292A (zh) 1997-01-01

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