SG68614A1 - Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices - Google Patents

Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices

Info

Publication number
SG68614A1
SG68614A1 SG1997001318A SG1997001318A SG68614A1 SG 68614 A1 SG68614 A1 SG 68614A1 SG 1997001318 A SG1997001318 A SG 1997001318A SG 1997001318 A SG1997001318 A SG 1997001318A SG 68614 A1 SG68614 A1 SG 68614A1
Authority
SG
Singapore
Prior art keywords
composition
semiconductor chip
electrically conductive
substrate
silicone elastomer
Prior art date
Application number
SG1997001318A
Other languages
English (en)
Inventor
Katsutoshi Mine
Osamu Mitani
Kazumi Nakayoshi
Rikako Tazawa
Original Assignee
Dow Corning Toray Silicone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP13143596A priority Critical patent/JP3950493B2/ja
Priority to US08/840,475 priority patent/US5872170A/en
Priority to EP19970302790 priority patent/EP0803542B1/de
Application filed by Dow Corning Toray Silicone filed Critical Dow Corning Toray Silicone
Priority to SG1997001318A priority patent/SG68614A1/en
Publication of SG68614A1 publication Critical patent/SG68614A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG1997001318A 1996-04-26 1997-08-18 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices SG68614A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP13143596A JP3950493B2 (ja) 1996-04-26 1996-04-26 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置
US08/840,475 US5872170A (en) 1996-04-26 1997-04-21 Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices
EP19970302790 EP0803542B1 (de) 1996-04-26 1997-04-24 Elektrisch leitfähige Silikonkautschukzusammensetzung und ihre Anwendung zur Herstellung von Halbleiteranordnungen
SG1997001318A SG68614A1 (en) 1996-04-26 1997-08-18 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13143596A JP3950493B2 (ja) 1996-04-26 1996-04-26 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置
SG1997001318A SG68614A1 (en) 1996-04-26 1997-08-18 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
SG68614A1 true SG68614A1 (en) 1999-11-16

Family

ID=26466272

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997001318A SG68614A1 (en) 1996-04-26 1997-08-18 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices

Country Status (4)

Country Link
US (1) US5872170A (de)
EP (1) EP0803542B1 (de)
JP (1) JP3950493B2 (de)
SG (1) SG68614A1 (de)

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KR20010023087A (ko) * 1997-08-21 2001-03-26 유진 에프. 밀러 이중 경화 실리콘 조성물
US5977226A (en) * 1998-05-04 1999-11-02 Dow Corning Corporation Vacuum dispensable silicone compositions
AU4215299A (en) 1998-06-01 1999-12-20 Loctite Corporation Flame-retardant uv curable silicone compositions
US6323253B1 (en) * 1998-06-01 2001-11-27 Loctite Corporation Flame-retardant UV and UV/moisture curable silicone compositions
US6017587A (en) * 1998-07-09 2000-01-25 Dow Corning Corporation Electrically conductive silicone compositions
US6908770B1 (en) * 1998-07-16 2005-06-21 Board Of Regents, The University Of Texas System Fluid based analysis of multiple analytes by a sensor array
US7022517B1 (en) 1999-07-16 2006-04-04 Board Of Regents, The University Of Texas System Method and apparatus for the delivery of samples to a chemical sensor array
CA2379130A1 (en) 1999-07-16 2001-01-25 Board Of Regents, The University Of Texas System Method and apparatus for the delivery of samples to a chemical sensor array
EP1073138B1 (de) * 1999-07-26 2012-05-02 Tigers Polymer Corporation Dichtungsanordnung für Brennstoffzelle und Verfahren zum Formen der Abdichtung aus Kautschuk
ATE403145T1 (de) * 2000-01-31 2008-08-15 Univ Texas Tragbare vorrichtung mit einer sensor-array- anordnung
JP2001226658A (ja) * 2000-02-18 2001-08-21 Toppan Forms Co Ltd Ｉｃチップ実装用導電性接着物質
JP3887814B2 (ja) * 2000-03-17 2007-02-28 株式会社スリーボンド シリコーンゲル組成物
CA2437558A1 (en) * 2001-01-31 2002-08-08 The Board Of Regents Of The University Of Texas System Method and apparatus for the confinement of materials in a micromachined chemical sensor array
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JP2003051487A (ja) * 2001-08-07 2003-02-21 Tokuyama Corp イオンミリング装置
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EP1695082A2 (de) * 2003-12-11 2006-08-30 Board of Regents, The University of Texas System Verfahren und vorrichtung für die analyse von speichel unter verwendung eines sensorarrays
US8105849B2 (en) * 2004-02-27 2012-01-31 Board Of Regents, The University Of Texas System Integration of fluids and reagents into self-contained cartridges containing sensor elements
US8101431B2 (en) * 2004-02-27 2012-01-24 Board Of Regents, The University Of Texas System Integration of fluids and reagents into self-contained cartridges containing sensor elements and reagent delivery systems
DE102004036573A1 (de) * 2004-07-28 2006-03-23 Ge Bayer Silicones Gmbh & Co. Kg Verwendung lichtaktivierbarer, härtbarer Silikonzusammensetzungen zur Herstellung von dickwandigen Formartikeln oder dickwandigen Beschichtungen
US8377398B2 (en) 2005-05-31 2013-02-19 The Board Of Regents Of The University Of Texas System Methods and compositions related to determination and use of white blood cell counts
AU2006261953B2 (en) * 2005-06-24 2012-02-23 Board Of Regents, The University Of Texas System Systems and methods including self-contained cartridges with detection systems and fluid delivery systems
US20090215646A1 (en) * 2005-07-01 2009-08-27 The Board Of Regents Of The University Of Texas Sy System and method of analyte detection using differential receptors
GB2444189B (en) 2005-08-02 2011-09-21 World Properties Inc Silicone compositions, methods of manufacture, and articles formed therefrom
US7410704B2 (en) * 2006-04-14 2008-08-12 3M Innovative Properties Company Composition containing fluoroalkyl hydrosilicone
US7834083B2 (en) * 2006-10-11 2010-11-16 Samsung Electro-Mechanics Co., Ltd. Nanocomposite composition comprising transparent nanoparticles
WO2008064068A2 (en) * 2006-11-17 2008-05-29 3M Innovative Properties Company Planarized led with optical extractor
EP2092576A1 (de) * 2006-11-17 2009-08-26 3M Innovative Properties Company Optische verbindungszusammensetzung für led-lichtquelle
US8013345B2 (en) * 2006-11-20 2011-09-06 3M Innovative Properties Company Optical bonding composition for LED light source
JP4561732B2 (ja) * 2006-11-20 2010-10-13 トヨタ自動車株式会社 移動体位置測位装置
CA2697357A1 (en) * 2007-04-16 2008-10-30 John T. Mcdevitt Cardibioindex/cardibioscore and utility of salivary proteome in cardiovascular diagnostics
DE102008043316A1 (de) * 2008-10-30 2010-05-06 Wacker Chemie Ag Verfahren zur Herstellung von Siliconformkörpern aus durch Licht vernetzbaren Siliconmischungen
US9520314B2 (en) * 2008-12-19 2016-12-13 Applied Materials, Inc. High temperature electrostatic chuck bonding adhesive
JP5735446B2 (ja) * 2012-03-27 2015-06-17 信越化学工業株式会社 オルガノポリシロキサン組成物、該オルガノポリシロキサン組成物の硬化方法、及び発光ダイオード
KR102385489B1 (ko) * 2014-04-09 2022-04-14 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 오르가노폴리실록산 조성물 및 전기·전자 부품의 보호제 또는 접착제 조성물
FR3045641B1 (fr) * 2015-12-22 2021-04-30 Bluestar Silicones France Utilisation d'un systeme photoamorceur de type ii pour la reticulation de compositions silicones
JP6754318B2 (ja) * 2017-05-10 2020-09-09 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物、ダイボンド材及び光半導体装置
KR102458743B1 (ko) * 2017-06-22 2022-10-24 엘켐 실리콘즈 프랑스 에스에이에스 자유-라디칼 광개시제 및 실리콘 조성물에서 이의 용도
JP7003029B2 (ja) * 2018-11-16 2022-01-20 信越化学工業株式会社 導電性シリコーン組成物、硬化物、積層体、及び、電子回路
JP7003075B2 (ja) * 2019-02-15 2022-01-20 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物及び該組成物を用いたウェハーレベル光半導体デバイス
EP4089147B1 (de) * 2020-01-10 2026-02-04 Shin-Etsu Chemical Co., Ltd. Härtbare zusammensetzung und tinte für tintenstrahldruck
US12043748B2 (en) * 2020-09-24 2024-07-23 Rtx Corporation Photo-curable liquid composition for additive manufacturing of ceramic
JP7748345B2 (ja) * 2022-08-29 2025-10-02 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び半導体装置用ダイアタッチ材
JP7790306B2 (ja) * 2022-09-28 2025-12-23 信越化学工業株式会社 熱および光硬化型シリコーン組成物ならびにその硬化物の製造方法
JP7790307B2 (ja) * 2022-09-28 2025-12-23 信越化学工業株式会社 光および熱硬化型シリコーン組成物ならびにその硬化物の製造方法
CN115418192B (zh) * 2022-10-15 2023-06-23 江苏矽时代材料科技有限公司 一种加成型室温固化高粘接强度灌封胶及其制备方法和应用
CN120391113A (zh) * 2023-11-28 2025-07-29 京东方科技集团股份有限公司 量子点组合物、显示器件和量子点膜层的图案化方法

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Also Published As

Publication number Publication date
US5872170A (en) 1999-02-16
EP0803542B1 (de) 2002-09-18
EP0803542A2 (de) 1997-10-29
JPH09296113A (ja) 1997-11-18
EP0803542A3 (de) 1998-04-15
JP3950493B2 (ja) 2007-08-01

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