SG68614A1 - Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices - Google Patents

Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices

Info

Publication number
SG68614A1
SG68614A1 SG1997001318A SG1997001318A SG68614A1 SG 68614 A1 SG68614 A1 SG 68614A1 SG 1997001318 A SG1997001318 A SG 1997001318A SG 1997001318 A SG1997001318 A SG 1997001318A SG 68614 A1 SG68614 A1 SG 68614A1
Authority
SG
Singapore
Prior art keywords
composition
semiconductor chip
electrically conductive
substrate
silicone elastomer
Prior art date
Application number
SG1997001318A
Other languages
English (en)
Inventor
Katsutoshi Mine
Osamu Mitani
Kazumi Nakayoshi
Rikako Tazawa
Original Assignee
Dow Corning Toray Silicone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP13143596A priority Critical patent/JP3950493B2/ja
Priority to US08/840,475 priority patent/US5872170A/en
Priority to EP19970302790 priority patent/EP0803542B1/fr
Application filed by Dow Corning Toray Silicone filed Critical Dow Corning Toray Silicone
Priority to SG1997001318A priority patent/SG68614A1/en
Publication of SG68614A1 publication Critical patent/SG68614A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG1997001318A 1996-04-26 1997-08-18 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices SG68614A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP13143596A JP3950493B2 (ja) 1996-04-26 1996-04-26 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置
US08/840,475 US5872170A (en) 1996-04-26 1997-04-21 Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices
EP19970302790 EP0803542B1 (fr) 1996-04-26 1997-04-24 Composition électroconductive de caoutchouc de silicone et leur emploi dans la fabrication de dispositifs semi-conducteurs
SG1997001318A SG68614A1 (en) 1996-04-26 1997-08-18 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13143596A JP3950493B2 (ja) 1996-04-26 1996-04-26 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置
SG1997001318A SG68614A1 (en) 1996-04-26 1997-08-18 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
SG68614A1 true SG68614A1 (en) 1999-11-16

Family

ID=26466272

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997001318A SG68614A1 (en) 1996-04-26 1997-08-18 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices

Country Status (4)

Country Link
US (1) US5872170A (fr)
EP (1) EP0803542B1 (fr)
JP (1) JP3950493B2 (fr)
SG (1) SG68614A1 (fr)

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US5977226A (en) * 1998-05-04 1999-11-02 Dow Corning Corporation Vacuum dispensable silicone compositions
AU4215299A (en) 1998-06-01 1999-12-20 Loctite Corporation Flame-retardant uv curable silicone compositions
US6323253B1 (en) * 1998-06-01 2001-11-27 Loctite Corporation Flame-retardant UV and UV/moisture curable silicone compositions
US6017587A (en) * 1998-07-09 2000-01-25 Dow Corning Corporation Electrically conductive silicone compositions
US6908770B1 (en) * 1998-07-16 2005-06-21 Board Of Regents, The University Of Texas System Fluid based analysis of multiple analytes by a sensor array
US7022517B1 (en) 1999-07-16 2006-04-04 Board Of Regents, The University Of Texas System Method and apparatus for the delivery of samples to a chemical sensor array
AU1325201A (en) 1999-07-16 2001-02-05 Board Of Regents, The University Of Texas System Detection system based on an analyte reactive particle
EP1073138B1 (fr) * 1999-07-26 2012-05-02 Tigers Polymer Corporation Structure d'étanchéité pour pile à combustible et procédé de formation du joint d'étanchéité en caoutchouc
ATE403145T1 (de) * 2000-01-31 2008-08-15 Univ Texas Tragbare vorrichtung mit einer sensor-array- anordnung
JP2001226658A (ja) * 2000-02-18 2001-08-21 Toppan Forms Co Ltd Ｉｃチップ実装用導電性接着物質
JP3887814B2 (ja) * 2000-03-17 2007-02-28 株式会社スリーボンド シリコーンゲル組成物
US20020197622A1 (en) * 2001-01-31 2002-12-26 Mcdevitt John T. Method and apparatus for the confinement of materials in a micromachined chemical sensor array
JP4375968B2 (ja) * 2001-04-06 2009-12-02 ワールド プロパティーズ インク． 導電性シリコーンおよびその製造方法
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EP1695082A2 (fr) * 2003-12-11 2006-08-30 Board of Regents, The University of Texas System Procede et systeme destines a analyser la salive au moyen d'un reseau de capteurs
US8105849B2 (en) * 2004-02-27 2012-01-31 Board Of Regents, The University Of Texas System Integration of fluids and reagents into self-contained cartridges containing sensor elements
US8101431B2 (en) * 2004-02-27 2012-01-24 Board Of Regents, The University Of Texas System Integration of fluids and reagents into self-contained cartridges containing sensor elements and reagent delivery systems
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WO2007053186A2 (fr) 2005-05-31 2007-05-10 Labnow, Inc. Méthodes et compositions en rapport avec la détermination et l’utilisation de la numération de globules blancs
EP1899450A4 (fr) * 2005-06-24 2010-03-24 Univ Texas Systemes et procedes faisant appel a des cartouches autonomes comprenant des systemes de detection et des systemes de distribution de fluides
WO2007005666A2 (fr) * 2005-07-01 2007-01-11 Board Of Regents, The University Of Texas System Systeme et methode de detection d'analytes au moyen de recepteurs differentiels
CN101278011B (zh) 2005-08-02 2012-10-24 环球产权公司 有机硅组合物、其制造方法及其形成的物品
US7410704B2 (en) * 2006-04-14 2008-08-12 3M Innovative Properties Company Composition containing fluoroalkyl hydrosilicone
US7834083B2 (en) * 2006-10-11 2010-11-16 Samsung Electro-Mechanics Co., Ltd. Nanocomposite composition comprising transparent nanoparticles
WO2008064070A1 (fr) * 2006-11-17 2008-05-29 3M Innovative Properties Company Composition de liaison optique pour source lumineuse à diodes électroluminescentes
CN101536201A (zh) * 2006-11-17 2009-09-16 3M创新有限公司 具有光学提取器的平面化发光二极管
JP4561732B2 (ja) * 2006-11-20 2010-10-13 トヨタ自動車株式会社 移動体位置測位装置
JP2010510685A (ja) * 2006-11-20 2010-04-02 スリーエム イノベイティブ プロパティズ カンパニー Ｌｅｄ光源用の光学接着組成物
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JP6944549B2 (ja) * 2017-06-22 2021-10-06 エルケム・シリコーンズ・フランス・エスアエスＥＬＫＥＭ ＳＩＬＩＣＯＮＥＳ Ｆｒａｎｃｅ ＳＡＳ フリーラジカル光開始剤及びシリコーン組成物におけるその使用
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JP7003075B2 (ja) * 2019-02-15 2022-01-20 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物及び該組成物を用いたウェハーレベル光半導体デバイス
EP4089147B1 (fr) * 2020-01-10 2026-02-04 Shin-Etsu Chemical Co., Ltd. Composition durcissable et encre pour impression à jet d'encre
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JP7748345B2 (ja) * 2022-08-29 2025-10-02 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び半導体装置用ダイアタッチ材
JP7790306B2 (ja) * 2022-09-28 2025-12-23 信越化学工業株式会社 熱および光硬化型シリコーン組成物ならびにその硬化物の製造方法
JP7790307B2 (ja) * 2022-09-28 2025-12-23 信越化学工業株式会社 光および熱硬化型シリコーン組成物ならびにその硬化物の製造方法
CN115418192B (zh) * 2022-10-15 2023-06-23 江苏矽时代材料科技有限公司 一种加成型室温固化高粘接强度灌封胶及其制备方法和应用
CN120391113A (zh) * 2023-11-28 2025-07-29 京东方科技集团股份有限公司 量子点组合物、显示器件和量子点膜层的图案化方法

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Also Published As

Publication number Publication date
JP3950493B2 (ja) 2007-08-01
EP0803542A3 (fr) 1998-04-15
JPH09296113A (ja) 1997-11-18
US5872170A (en) 1999-02-16
EP0803542B1 (fr) 2002-09-18
EP0803542A2 (fr) 1997-10-29

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