SG82002A1 - Underfill encapsulant compositions for use in electronic devices - Google Patents

Underfill encapsulant compositions for use in electronic devices

Info

Publication number
SG82002A1
SG82002A1 SG9902967A SG1999002967A SG82002A1 SG 82002 A1 SG82002 A1 SG 82002A1 SG 9902967 A SG9902967 A SG 9902967A SG 1999002967 A SG1999002967 A SG 1999002967A SG 82002 A1 SG82002 A1 SG 82002A1
Authority
SG
Singapore
Prior art keywords
electronic devices
underfill encapsulant
encapsulant compositions
maleimide
compounds
Prior art date
Application number
SG9902967A
Other languages
English (en)
Inventor
Ma Bodan
K Tong Quinn
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of SG82002A1 publication Critical patent/SG82002A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/068—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG9902967A 1998-07-02 1999-06-18 Underfill encapsulant compositions for use in electronic devices SG82002A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/110,047 US6063828A (en) 1998-07-02 1998-07-02 Underfill encapsulant compositions for use in electronic devices

Publications (1)

Publication Number Publication Date
SG82002A1 true SG82002A1 (en) 2001-07-24

Family

ID=22330956

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9902967A SG82002A1 (en) 1998-07-02 1999-06-18 Underfill encapsulant compositions for use in electronic devices

Country Status (5)

Country Link
US (1) US6063828A (fr)
EP (1) EP0969060A3 (fr)
JP (1) JP2000053728A (fr)
KR (1) KR20000011415A (fr)
SG (1) SG82002A1 (fr)

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US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
US6194788B1 (en) * 1999-03-10 2001-02-27 Alpha Metals, Inc. Flip chip with integrated flux and underfill
US7547579B1 (en) * 2000-04-06 2009-06-16 Micron Technology, Inc. Underfill process
US6346750B1 (en) * 2000-04-28 2002-02-12 Micron Technology, Inc. Resistance-reducing conductive adhesives for attachment of electronic components
US6573592B2 (en) * 2001-08-21 2003-06-03 Micron Technology, Inc. Semiconductor die packages with standard ball grid array footprint and method for assembling the same
US6551863B2 (en) * 2001-08-30 2003-04-22 Micron Technology, Inc. Flip chip dip coating encapsulant
US20030129438A1 (en) * 2001-12-14 2003-07-10 Becker Kevin Harris Dual cure B-stageable adhesive for die attach
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
US6803406B2 (en) 2002-03-29 2004-10-12 National Starch And Chemical Investmnet Holding Corporation Electron donors, electron acceptors and adhesion promoters containing disulfide
US6798806B1 (en) * 2002-09-03 2004-09-28 Finisar Corporation Hybrid mirror VCSELs
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US7208566B2 (en) * 2003-05-05 2007-04-24 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
WO2010019832A2 (fr) 2008-08-13 2010-02-18 Designer Molecules, Inc. Composés de réticulation à extension d'amide, et leurs procédés d'utilisation
US8513375B2 (en) * 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7166491B2 (en) * 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
US7026376B2 (en) * 2003-06-30 2006-04-11 Intel Corporation Fluxing agent for underfill materials
JP4752178B2 (ja) * 2003-11-20 2011-08-17 富士ゼロックス株式会社 マレイミド基含有架橋ポリマー粒子及びその製造方法
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
MXPA06014053A (es) * 2004-06-04 2007-07-11 Designer Molecules Inc Poliesteres de radicales libres curables y metodos para uso de los mismos.
US20050282976A1 (en) * 2004-06-22 2005-12-22 Gelcore Llc. Silicone epoxy formulations
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US8043534B2 (en) * 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) * 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
WO2008092168A2 (fr) * 2007-01-26 2008-07-31 Designer Molecules, Inc. Procédés pour la préparation d'imides, de maléimides et de composés poly(imide) à terminaison maléimide
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
WO2008130894A1 (fr) * 2007-04-16 2008-10-30 Designer Molecules, Inc. Préparations à base de maléimide et d'acrylate durcissables à basse température et procédés d'utilisation correspondant
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8415812B2 (en) * 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
JP5717452B2 (ja) * 2010-01-15 2015-05-13 日本曹達株式会社 液状ポリブタジエン精製法
US9431274B2 (en) * 2012-12-20 2016-08-30 Intel Corporation Method for reducing underfill filler settling in integrated circuit packages
FR3033793B1 (fr) * 2015-03-20 2018-11-23 Valeo Equipements Electriques Moteur Nouveaux composes bis-maleimides liquides polymerisables, leur procede de preparation et leur procede de mise en oeuvre

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EP0484157A2 (fr) * 1990-10-31 1992-05-06 Kabushiki Kaisha Toshiba Composition de résine maleimide et dispositif semi-conducteur encapsulé en résine préparé à partir de cette composition
EP0507603A1 (fr) * 1991-04-04 1992-10-07 Shin-Etsu Chemical Co., Ltd. Compositions de résines thermodurcissables et leur fabrication
DE4218311A1 (de) * 1991-06-07 1992-12-10 Shinetsu Chemical Co Hitzehaertbare harzmassen
EP0559338A1 (fr) * 1992-02-13 1993-09-08 Shin-Etsu Chemical Co., Ltd. Compositions de résines thermodurcissables
US5290882A (en) * 1991-08-13 1994-03-01 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
US5310830A (en) * 1990-06-28 1994-05-10 Konishi Co., Ltd. Epoxy resin, maleimide and OH- and epoxy-containing compound
WO1998010920A1 (fr) * 1996-09-10 1998-03-19 Quantum Materials, Inc. Formulations contenant de la maleimide et utilisations de ces dernieres

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Publication number Priority date Publication date Assignee Title
EP0390596A2 (fr) * 1989-03-30 1990-10-03 Chemical Research & Licensing Company Procédé combiné d'étherification et d'alcoylation
US5070154A (en) * 1989-09-11 1991-12-03 Shin-Etsu Chemical Co., Ltd. Composition of maleimide and aromatic-double bond epoxy resin
US5310830A (en) * 1990-06-28 1994-05-10 Konishi Co., Ltd. Epoxy resin, maleimide and OH- and epoxy-containing compound
EP0484157A2 (fr) * 1990-10-31 1992-05-06 Kabushiki Kaisha Toshiba Composition de résine maleimide et dispositif semi-conducteur encapsulé en résine préparé à partir de cette composition
EP0507603A1 (fr) * 1991-04-04 1992-10-07 Shin-Etsu Chemical Co., Ltd. Compositions de résines thermodurcissables et leur fabrication
DE4218311A1 (de) * 1991-06-07 1992-12-10 Shinetsu Chemical Co Hitzehaertbare harzmassen
US5290882A (en) * 1991-08-13 1994-03-01 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
EP0559338A1 (fr) * 1992-02-13 1993-09-08 Shin-Etsu Chemical Co., Ltd. Compositions de résines thermodurcissables
WO1998010920A1 (fr) * 1996-09-10 1998-03-19 Quantum Materials, Inc. Formulations contenant de la maleimide et utilisations de ces dernieres

Also Published As

Publication number Publication date
KR20000011415A (ko) 2000-02-25
JP2000053728A (ja) 2000-02-22
EP0969060A3 (fr) 2000-02-23
US6063828A (en) 2000-05-16
EP0969060A2 (fr) 2000-01-05

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