TW293942B - - Google Patents

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Publication number
TW293942B
TW293942B TW083111913A TW83111913A TW293942B TW 293942 B TW293942 B TW 293942B TW 083111913 A TW083111913 A TW 083111913A TW 83111913 A TW83111913 A TW 83111913A TW 293942 B TW293942 B TW 293942B
Authority
TW
Taiwan
Prior art keywords
lead frame
support
plating
rods
sides
Prior art date
Application number
TW083111913A
Other languages
English (en)
Chinese (zh)
Original Assignee
Fuji Plant Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Plant Kogyo Kk filed Critical Fuji Plant Kogyo Kk
Application granted granted Critical
Publication of TW293942B publication Critical patent/TW293942B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW083111913A 1993-12-20 1994-12-20 TW293942B (th)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5345308A JP2551531B2 (ja) 1993-12-20 1993-12-20 部分メッキ方法、および部分メッキ装置

Publications (1)

Publication Number Publication Date
TW293942B true TW293942B (th) 1996-12-21

Family

ID=18375721

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111913A TW293942B (th) 1993-12-20 1994-12-20

Country Status (3)

Country Link
JP (1) JP2551531B2 (th)
KR (1) KR100251245B1 (th)
TW (1) TW293942B (th)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100724068B1 (ko) * 2006-08-07 2007-06-07 대성하이피(주) 분할식 부분 전기도금장치
KR101149158B1 (ko) 2009-05-26 2012-06-01 현대제철 주식회사 프레스 성형품의 국부도금방법 및 그에 이용되는 금형

Also Published As

Publication number Publication date
KR950018680A (ko) 1995-07-22
JP2551531B2 (ja) 1996-11-06
JPH07173670A (ja) 1995-07-11
KR100251245B1 (ko) 2000-04-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees