TW312749B - - Google Patents

Download PDF

Info

Publication number: TW312749B
Authority: TW; Taiwan
Prior art keywords: inspection; unit; loading; section; patent application
Prior art date: 1994-07-26

Application number

TW084107691A

Other languages

English (en)

Chinese (zh)

Original Assignee

Tokyo Electron Co Ltd

Tel Yamanishi Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1994-07-26

Filing date

1995-07-25

Publication date

1997-08-11

1994-07-26 Priority claimed from JP6193691A external-priority patent/JPH0843485A/ja

1994-08-16 Priority claimed from JP21531494A external-priority patent/JP3080845B2/ja

1995-07-25 Application filed by Tokyo Electron Co Ltd, Tel Yamanishi Kk filed Critical Tokyo Electron Co Ltd

1997-08-11 Application granted granted Critical

1997-08-11 Publication of TW312749B publication Critical patent/TW312749B/zh

Links

238000007689 inspection Methods 0.000 claims description 206
239000004065 semiconductor Substances 0.000 claims description 56
238000000034 method Methods 0.000 claims description 35
230000007723 transport mechanism Effects 0.000 claims description 35
230000008569 process Effects 0.000 claims description 23
230000007246 mechanism Effects 0.000 claims description 22
238000012360 testing method Methods 0.000 claims description 20
230000032258 transport Effects 0.000 claims description 20
239000000523 sample Substances 0.000 claims description 16
238000012546 transfer Methods 0.000 claims description 8
229910000746 Structural steel Inorganic materials 0.000 claims description 7
230000002079 cooperative effect Effects 0.000 claims description 3
PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
238000004148 unit process Methods 0.000 claims 1
238000010438 heat treatment Methods 0.000 description 11
230000002950 deficient Effects 0.000 description 3
238000003780 insertion Methods 0.000 description 3
230000037431 insertion Effects 0.000 description 3
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
230000008878 coupling Effects 0.000 description 2
238000010168 coupling process Methods 0.000 description 2
238000005859 coupling reaction Methods 0.000 description 2
230000006872 improvement Effects 0.000 description 2
238000002360 preparation method Methods 0.000 description 2
238000004904 shortening Methods 0.000 description 2
230000005540 biological transmission Effects 0.000 description 1
230000000875 corresponding effect Effects 0.000 description 1
238000009434 installation Methods 0.000 description 1
235000000396 iron Nutrition 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
General Engineering & Computer Science (AREA)
Environmental & Geological Engineering (AREA)
Testing Of Individual Semiconductor Devices (AREA)

TW084107691A 1994-07-26 1995-07-25 TW312749B (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP6193691A JPH0843485A (ja)	1994-07-26	1994-07-26	半導体デバイスの検査装置及び検査方法
JP21531494A JP3080845B2 (ja)	1994-08-16	1994-08-16	検査装置及びその方法

Publications (1)

Publication Number	Publication Date
TW312749B true TW312749B (de)	1997-08-11

Family

ID=26508024

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW084107691A TW312749B (de)	1994-07-26	1995-07-25

Country Status (3)

Country	Link
US (1)	US5801527A (de)
KR (1)	KR100297283B1 (de)
TW (1)	TW312749B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3503860B2 (ja) *	1997-03-18	2004-03-08	株式会社アドバンテスト	Ｉｃ試験方法およびこの方法を実施する装置
TW432221B (en) *	1998-05-29	2001-05-01	Advantest Corp	Tray for electronic device, the transporting apparatus of tray for electronic device and testing apparatus for electronic device
FR2810571A1 (fr) *	2000-06-27	2001-12-28	Eca	Dispositif et machine de prehension d'objets de petites dimensions
JP3480925B2 (ja) *	2000-09-12	2003-12-22	株式会社双晶テック	ディスプレイパネル又はプローブブロックの支持枠体
KR100491720B1 (ko) *	2001-11-06	2005-05-27	세크론 주식회사	엘씨디 글라스의 양부 판정을 위한 검사설비 배열방법
KR20030055809A (ko) *	2001-12-27	2003-07-04	주식회사 효성	폴리아미드 수지조성물의 제조방법
JP4043339B2 (ja) *	2002-10-22	2008-02-06	川崎マイクロエレクトロニクス株式会社	試験方法および試験装置
US6971793B2 (en) *	2003-03-21	2005-12-06	Asm Assembly Automation Ltd.	Test handler temperature monitoring system
JPWO2005053015A1 (ja) *	2003-11-26	2007-06-21	平田機工株式会社	ワークハンドリング装置
EP1832886B1 (de) *	2006-03-08	2015-04-01	Rasco GmbH	Vorrichtung und Verfahren zum Testen von elektronischen Bauteilen
CN100498355C (zh) *	2006-05-30	2009-06-10	鸿劲科技股份有限公司	记忆卡检测机
US9373533B2 (en) *	2012-12-31	2016-06-21	Cascade Microtech, Inc.	Systems and methods for providing wafer access in a wafer processing system
KR102496930B1 (ko) *	2020-10-06	2023-02-07	주식회사 쎄믹스	웨이퍼 테스트 장치
KR102410310B1 (ko) *	2021-05-03	2022-06-22	(주) 엔지온	검출 유니트 및 이를 구비하는 반도체 필름층 검사 장치 및 이를 이용한 검사 방법
US12000866B2 (en)	2022-04-20	2024-06-04	Envigth Co., Ltd.	Detection unit, semiconductor film layer inspection apparatus including the same, and semiconductor film layer inspection method using the same
US12337467B2 (en)	2022-12-09	2025-06-24	Formfactor, Inc.	Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0833433B2 (ja) *	1987-11-30	1996-03-29	東京エレクトロン株式会社	プローブ装置
US4844565A (en) *	1988-01-11	1989-07-04	Unisys Corporation	Quick-release spacer-latching-connector assembly
KR0152260B1 (ko) *	1988-07-08	1998-12-15	고다까 토시오	프로우브 장치
US5196993A (en) *	1989-03-06	1993-03-23	Unisys Corp.	Removable stand alone display for laptop computer
JPH02272470A (ja) *	1989-04-13	1990-11-07	Seiko Epson Corp	画像形成装置
JP2921937B2 (ja) *	1990-07-18	1999-07-19	東京エレクトロン株式会社	Ｉｃ検査装置
JPH0498167A (ja) *	1990-08-16	1992-03-30	Tokyo Electron Ltd	Ｉｃ検査装置
JPH04330753A (ja) *	1991-01-16	1992-11-18	Tokyo Electron Ltd	半導体検査装置及び半導体検査方法
JPH05136218A (ja) *	1991-02-19	1993-06-01	Tokyo Electron Yamanashi Kk	検査装置

1995
- 1995-07-25 TW TW084107691A patent/TW312749B/zh active
- 1995-07-25 US US08/506,819 patent/US5801527A/en not_active Expired - Fee Related
- 1995-07-26 KR KR1019950022244A patent/KR100297283B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
KR960005920A (ko)	1996-02-23
US5801527A (en)	1998-09-01
KR100297283B1 (ko)	2001-10-24

Publication	Publication Date	Title
TW312749B (de)	1997-08-11
JP2921937B2 (ja)	1999-07-19	Ｉｃ検査装置
KR100857911B1 (ko)	2008-09-10	반도체 소자 테스트 핸들러용 소팅장치 및 소팅방법
JP6887332B2 (ja)	2021-06-16	検査システム
TW484013B (en)	2002-04-21	A method for testing electronic device and electronic testing device
CN103934224B (zh)	2016-09-21	测试盘旋转装置以及直列式测试分选机
CN101149396A (zh)	2008-03-26	电子部件试验装置用接口装置
CN110211889B (zh)	2023-07-21	检查系统
JPH11297791A (ja)	1999-10-29	トレイ移送アーム及びこれを用いたトレイの移載装置、ｉｃ試験装置並びにトレイの取り廻し方法
US5151651A (en)	1992-09-29	Apparatus for testing IC elements
CN101826476A (zh)	2010-09-08	视觉检测仪器
CN114035009B (zh)	2024-10-18	电子部件处理装置及电子部件试验装置
JPH08248095A (ja)	1996-09-27	検査装置
CN113960386B (zh)	2024-08-16	电子部件处理装置以及电子部件试验装置
JP3376784B2 (ja)	2003-02-10	Ｉｃ試験装置
JP4222442B2 (ja)	2009-02-12	電子部品試験装置用インサート
JPWO2002063322A1 (ja)	2004-06-10	部材の受け渡し装置、部材の受け渡し装置の制御方法、ｉｃ検査方法、ｉｃハンドラ及びｉｃ検査装置
KR20100052564A (ko)	2010-05-19	인서트, 트레이 및 전자부품 시험장치
JP2001033518A (ja)	2001-02-09	電子部品試験装置用インサート
KR20010098361A (ko)	2001-11-08	테스트 핸들러
JP2831853B2 (ja)	1998-12-02	Ｉｃの位置決め装置
JPWO1996007201A1 (ja)	1996-10-29	Ｉｃの位置決め装置
JP3080845B2 (ja)	2000-08-28	検査装置及びその方法
JPH10185995A (ja)	1998-07-14	半導体装置用のハンドラ装置
KR101104291B1 (ko)	2012-01-12	트레이 반송장치 및 이를 구비한 전자부품 시험장치