TW367652B - Piezoelectric harmonic oscillator - Google Patents

Piezoelectric harmonic oscillator

Info

Publication number
TW367652B
TW367652B TW086104637A TW86104637A TW367652B TW 367652 B TW367652 B TW 367652B TW 086104637 A TW086104637 A TW 086104637A TW 86104637 A TW86104637 A TW 86104637A TW 367652 B TW367652 B TW 367652B
Authority
TW
Taiwan
Prior art keywords
piezoelectric
casing
ceramic
board
harmonic oscillator
Prior art date
Application number
TW086104637A
Other languages
English (en)
Inventor
Takashi Tsutsui
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Application granted granted Critical
Publication of TW367652B publication Critical patent/TW367652B/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0528—Holders or supports for bulk acoustic wave devices consisting of clips
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1028—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being held between spring terminals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
TW086104637A 1996-04-12 1997-04-11 Piezoelectric harmonic oscillator TW367652B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8091462A JPH09284083A (ja) 1996-04-12 1996-04-12 セラミック共振子

Publications (1)

Publication Number Publication Date
TW367652B true TW367652B (en) 1999-08-21

Family

ID=14027049

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104637A TW367652B (en) 1996-04-12 1997-04-11 Piezoelectric harmonic oscillator

Country Status (5)

Country Link
US (1) US6081066A (zh)
JP (1) JPH09284083A (zh)
KR (1) KR970072655A (zh)
CN (1) CN1168025A (zh)
TW (1) TW367652B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3428484B2 (ja) * 1999-02-25 2003-07-22 株式会社村田製作所 圧電部品の設計方法
US6800986B2 (en) * 2002-01-23 2004-10-05 Tdk Corporation Piezoelectric sensor
JP2008084957A (ja) * 2006-09-26 2008-04-10 Olympus Corp アクチュエータの実装構造及び実装方法
TWI620920B (zh) * 2015-09-23 2018-04-11 中原大學 多軸向壓電應力感測元件、多軸向壓電應力感測元件極化之方法及其壓電感應偵測系統
CN106849900B (zh) * 2016-12-15 2020-10-02 北京无线电计量测试研究所 一种用于安装石英晶片的基座

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1619854A (en) * 1926-02-26 1927-03-08 Wired Radio Inc Piezo-electric-crystal apparatus
US1766036A (en) * 1927-04-14 1930-06-24 Fed Telegraph Co Piezo-electric crystal apparatus
US2139998A (en) * 1937-06-30 1938-12-13 Rca Corp Apparatus for mounting piezo-electric crystals
US2626363A (en) * 1949-03-04 1953-01-20 James Knights Company Piezoelectric crystal and method of making it
US2505121A (en) * 1949-03-04 1950-04-25 James Knights Company Method of finishing crystals
JPS60137112A (ja) * 1983-12-26 1985-07-20 Murata Mfg Co Ltd 圧電振動子
JPS61199313A (ja) * 1985-02-28 1986-09-03 Matsushita Electric Ind Co Ltd セラミツク共振子
JPH0640612B2 (ja) * 1986-03-31 1994-05-25 朝日電波株式会社 圧電振動子
JP2875312B2 (ja) * 1989-12-12 1999-03-31 株式会社アマダ Ｎｃ装置の加工時間の短縮方法
JPH06334472A (ja) * 1993-05-19 1994-12-02 Tdk Corp 圧電共振部品

Also Published As

Publication number Publication date
CN1168025A (zh) 1997-12-17
US6081066A (en) 2000-06-27
JPH09284083A (ja) 1997-10-31
KR970072655A (ko) 1997-11-07

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