TWI242581B - Resin-sealed electronic electrical component and manufacture thereof - Google Patents
Resin-sealed electronic electrical component and manufacture thereof Download PDFInfo
- Publication number
- TWI242581B TWI242581B TW88119015A TW88119015A TWI242581B TW I242581 B TWI242581 B TW I242581B TW 88119015 A TW88119015 A TW 88119015A TW 88119015 A TW88119015 A TW 88119015A TW I242581 B TWI242581 B TW I242581B
- Authority
- TW
- Taiwan
- Prior art keywords
- flame retardant
- resin
- flame
- epoxy resin
- layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000003063 flame retardant Substances 0.000 claims abstract description 71
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000003822 epoxy resin Substances 0.000 claims abstract description 58
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 58
- 239000010410 layer Substances 0.000 claims abstract description 46
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000843 powder Substances 0.000 claims abstract description 27
- 239000011247 coating layer Substances 0.000 claims abstract description 21
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 18
- 239000011574 phosphorus Substances 0.000 claims abstract description 16
- 239000000347 magnesium hydroxide Substances 0.000 claims abstract description 9
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims abstract description 9
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 claims abstract description 8
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims abstract description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 7
- WMWXXXSCZVGQAR-UHFFFAOYSA-N dialuminum;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3] WMWXXXSCZVGQAR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 29
- 239000004848 polyfunctional curative Substances 0.000 claims description 25
- 239000004593 Epoxy Substances 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 13
- 150000008064 anhydrides Chemical class 0.000 claims description 11
- 230000002079 cooperative effect Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 238000011049 filling Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims 1
- 150000002632 lipids Chemical class 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 abstract description 10
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052736 halogen Inorganic materials 0.000 abstract description 8
- 150000002367 halogens Chemical class 0.000 abstract description 8
- 239000003973 paint Substances 0.000 abstract 1
- 230000037452 priming Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 17
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 13
- -1 resistor networks Substances 0.000 description 13
- 239000011342 resin composition Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 9
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 239000003985 ceramic capacitor Substances 0.000 description 7
- 239000000565 sealant Substances 0.000 description 7
- 239000000945 filler Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000004922 lacquer Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 4
- 229910052794 bromium Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 description 4
- 125000004437 phosphorous atom Chemical group 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 235000013824 polyphenols Nutrition 0.000 description 4
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- HCITUYXHCZGFEO-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.N=C1NC(=N)NC(=N)N1 HCITUYXHCZGFEO-UHFFFAOYSA-N 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- 229940098465 tincture Drugs 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical compound COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- UALAKBZSBJIXBP-UHFFFAOYSA-N 1-phenylethane-1,1,2,2-tetrol Chemical compound OC(O)C(O)(O)C1=CC=CC=C1 UALAKBZSBJIXBP-UHFFFAOYSA-N 0.000 description 1
- UESLHKIFNWZPBP-UHFFFAOYSA-N 2-(methylamino)propanedinitrile Chemical compound C(#N)C(NC)C#N UESLHKIFNWZPBP-UHFFFAOYSA-N 0.000 description 1
- FJNLCHNQVJVCPY-UHFFFAOYSA-N 2-n-methoxy-2-n-methyl-4-n,6-n-dipropyl-1,3,5-triazine-2,4,6-triamine Chemical group CCCNC1=NC(NCCC)=NC(N(C)OC)=N1 FJNLCHNQVJVCPY-UHFFFAOYSA-N 0.000 description 1
- TWWAWPHAOPTQEU-UHFFFAOYSA-N 4-methyl-2-benzofuran-1,3-dione Chemical compound CC1=CC=CC2=C1C(=O)OC2=O TWWAWPHAOPTQEU-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-N Diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(O)OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Natural products OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- SQPVQGHHSGWUEP-UHFFFAOYSA-N O.[P] Chemical compound O.[P] SQPVQGHHSGWUEP-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- PZBFGYYEXUXCOF-UHFFFAOYSA-N TCEP Chemical compound OC(=O)CCP(CCC(O)=O)CCC(O)=O PZBFGYYEXUXCOF-UHFFFAOYSA-N 0.000 description 1
- ZDHCISRTKQQPGT-UHFFFAOYSA-J [OH-].[Mg+2].O.[Ca+2].[OH-].[OH-].[OH-] Chemical compound [OH-].[Mg+2].O.[Ca+2].[OH-].[OH-].[OH-] ZDHCISRTKQQPGT-UHFFFAOYSA-J 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021488 crystalline silicon dioxide Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- UJSSNDKVUQJEGE-UHFFFAOYSA-N dichloro propyl phosphate Chemical compound CCCOP(=O)(OCl)OCl UJSSNDKVUQJEGE-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910001922 gold oxide Inorganic materials 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- GVLGAFRNYJVHBC-UHFFFAOYSA-N hydrate;hydrobromide Chemical compound O.Br GVLGAFRNYJVHBC-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- KZNNRLXBDAAMDZ-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane trihydrate Chemical compound O.O.O.O=[Al]O[Al]=O KZNNRLXBDAAMDZ-UHFFFAOYSA-N 0.000 description 1
- CCDXIADKBDSBJU-UHFFFAOYSA-N phenylmethanetriol Chemical compound OC(O)(O)C1=CC=CC=C1 CCDXIADKBDSBJU-UHFFFAOYSA-N 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003971 tillage Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- 150000004684 trihydrates Chemical class 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Paints Or Removers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
1242581 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(1 ) 發明所屬的技術領域 本發明係以具有熱循環耐久性、高溫負載耐久性及耐 燃性之樹脂組成物所封合的電子•電氣零件及其製造方法· ’更詳細而言係有關以不含有成爲環境污染之原因的鹵素 系耐燃劑或銻系耐燃劑類之有害物質的樹脂組成物所封合 的具有熱循環耐久性、高溫負載耐久性及耐燃性之樹脂封 合型電子•電氣零件及其製造方法。 習知技術 陶瓷電容器、電阻網路、複合積體電路、感應器線圈 等的電子•電氣零件,通常爲賦與耐濕性、耐熱性、耐藥 品性等,係利用由熱固性樹脂組成物而成的絕緣性封合劑 予以封合。 然而,對此封合劑,係被要求需爲與半導體元件間之 接著性、耐燃性、耐濕電氣可靠性、耐腐蝕性等優越者, 利用流動浸漬法或靜電流動浸漬法等可予容易的形成指定 的層厚,主要以環氧樹脂爲主的粉體塗料大多被採用著。 因此’至於此種以运氧樹脂爲主的粉體塗料,至目前 爲止已知有環氧樹脂、聚羧酸酐系硬化劑、三苯基膦及無 機塡充劑而成者(日本特開昭6 1 — 8 9 2 7 1號公報) 〇 另一方面,至於絕緣性封合劑,爲防止電子•電氣零 件在使用時發生火災’被要求需具有耐燃性,因此以配合… 鹵系或銻系耐燃劑予以耐燃化乃爲通常所採用的。 (請先閱讀背面之注意事項>^寫本頁) 裝 i線· 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) 4 1242581 A7 B7 五、發明說明(2 ) 然而,最近鹵素系耐燃劑係成爲臭氧層破壞之原因, 或燃燒時發生有害的氣體並成爲環境污染之原因,其使用 即在受限制的方向上,及銻系耐燃劑亦被指定成廢水環境 基準之受監視物質,減少使用量即成爲被要求的項目,故 可取代此等耐燃劑者即令人期待的。 至於不含有鹵素或銻之環氧樹脂系電子•電氣零件封 合劑,至目前爲止,含有環氧樹脂、硬化劑、無機質塡充 劑及耐燃劑之環氧樹脂組成物中用作耐燃劑者,正被提出 有:採用聚磷酸三聚氰胺類磷化合物者,或以酚醛樹脂及 矽烷化合物或矽烷化合物被覆的紅磷合倂使用者(日本特 開平1 0 — 1 8 2 9 4 0號公報)或以一分子中具有二個 以上的ί哀氧基之環氧樹脂,一分子中具有二個以上的酹性 羥基之化合物、環狀磷酸肌酸(phosphogen )化合物及無 機質塡充劑爲必須成分之組成物(日本特開平 10 — 259292號公報)等。 經濟部智慧財產局員工消費合作社印製 --------------装---„ (請先閱讀背面之注意事項^^|?寫本頁) 線. 然而,此等電子•電氣零件封合劑,在耐燃性之點, 即使顯示出與至目前爲止的鹵素系或銻系耐燃劑相近的性 能,配合此案的樹脂組成物在熱循環耐久性及高溫負載耐 久性係不足的,採用該組成物而得的電子•電氣零件不能 說一定具有可滿足的性能者。 發明欲解決的課頴 本發明係克服採用非爲習用的鹵素系或非爲銻系之耐 燃劑的封合劑之電子•電氣零件之缺點,以提供具有與採 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) •5- 1242581 A7 B7 五、發明說明(3 ) 用鹵素系或銻系耐燃劑之情形可匹敵的性能,亦即耐燃性 同時熱循環耐久性及高溫負載耐久性之不含鹵素或銻之樹 脂封合型電子•電氣零件爲目的者。 解決課題而採的手段 本發明人者,爲開發採用非爲鹵素系且非爲銻系封合 劑之樹脂封合型電子•電氣零件,經精心硏究的結果,在 不以單一種的封合劑層被覆電子•電氣零件下,首先以熱 循環耐久性及高溫負載耐久性之優越的向下拉曳層被覆電 子·電氣零件表面,再於其上藉由具有耐燃性之層被覆, 發現可得耐燃性,同時兼具熱循環耐久性及高溫負載耐久 性之樹脂封合型電子·電氣零件,基於此見解以至完成本 發明。 經濟部智慧財產局員工消費合作社印製 亦即,本發明係介由使非耐燃性環氧樹脂系粉體塗料 熱硬化且形成的具有熱循環耐久性及高溫負載耐久性之向 下拉曳層(A ),使含有由氫氧化鋁、氧化鋁水合物、氫 氧化鎂、鋁酸鈣水合物、磷系耐燃劑及氮系耐燃劑之中選 出的至少一種耐燃劑的環氧樹脂系粉體塗料熱硬化並予形 成的耐燃性被覆層(B )予以封合爲特徵之樹脂封合型電 子·電氣零件’及於電子•電氣零件表面上,被覆以非耐 燃性環氧樹脂系粉體塗料至少至〇 · 1 m m之厚度爲止, 其次在其上被覆以包含由氫氧化鋁、氧化鋁水合物、氫氧 化鎂、銘酸錦水合物、磷系耐燃劑及氮系耐燃劑之中選出 的至少一種耐燃劑之環氧樹脂系粉體塗料至至少〇 · 1 -6 - --------------裝---^ (請先閱讀背面之注意事項寫本頁) 線- 本紙張尺度適用中國國家標準(CNS)A4規格(210x 297公爱) 1242581 A7 _ B7 五、發明說明(4 ) mm之厚度爲止後,藉由使此等被覆層熱硬化,以由具有 熱循環耐久性及高溫負載耐久性之向向拉曳層(A )及耐 燃性被覆層(B )而成的全層厚度〇 · 3〜1 · 〇 m m之 電氣絕緣性樹脂層予以封合爲特徵的樹脂封合型電子•電 氣零件之製造方法。 發明之實施形熊 於本發明,形成向下拉曳層(A )之環氧樹脂系粉體 塗料,係實質上不含耐燃劑之非耐燃性者,含有(甲)固 態狀環氧樹脂及(乙)聚羧酸酐系硬化劑。(甲)成分之 固態狀環氧樹脂係於室溫亦即2 5 °C爲固態狀之環氧樹脂 ,每一分子中具有環氧基二個以上者即可,並未予特別限 制。 在此,實質上不含耐燃劑之非耐燃性,對塗料經予熱 硬化的試片(1 2 7 m m X 1 2 · 7 m m X 1 m m ),依 耐燃性試驗法標準U L - 9 4進行試驗時,係意指不合於 基準條件V —〇者。 經濟部智慧財產局員工消費合作社印製 裝---; (請先閱讀背面之注意事項寫本頁) 線- 較宜的環氧樹脂,係熔點5 0〜1 5 0 °C者。若採用 熔點未滿5 0 °C者時,則粉體塗料變成容易固結,又熔點 亦較1 5 0 °C高時,則粉體塗料在熔融時之黏度會變高, 未能獲得平滑的被覆層。 至於此種環氧樹脂,例如具有熔點5 〇〜1 5 0 °C之 雙酚A型環氧樹脂、雙酚F型環氧樹脂等二縮水甘油醚型 環氧樹脂、酚醛酚醛淸漆型環氧樹脂、甲酚酚醛淸漆型環 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) 1242581 A7 B7 五、發明說明(5 ) 氧樹脂等酚醛淸漆型環氧樹脂 再者,若舉具體例時,可 基醚型環氧樹脂、酚醛酚醛淸 醛縮水甘油基醚等的多官能性 甘油基醚型環氧樹脂、雙酚A 脂、甘油之縮水甘油基醚型環 甘油基醚型環氧樹脂、二元酸 、間苯二甲酸之縮水甘油基酯 丁二烯環氧化的環氧樹脂等。 。又,即使在常溫顯示液狀之 環氧樹脂混合物的熔點限於在 亦可任意使用。 其次,對用作(乙 例如式 舉出有:雙 漆縮水甘油 環氧系樹脂 D之縮水甘 氧樹脂、聚 之縮水甘油 型環氧樹脂 此等者可以 環氧樹脂, 5 0 〜1 5 酚A之 基醚、 、雙酚 油基醚 環氧院 基酯型 、以過 單獨或 已添加 0 t:之 縮水甘油 正甲酚酚 F之縮水 型環氧樹 基之縮水 環氧樹脂 醋酸使聚 混合使用 此樹脂之 範圍,均 )成分之聚羧酸酐系硬化劑,計有1242581 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (1) Technical field to which the invention belongs The present invention is sealed with a resin composition having thermal cycle durability, high-temperature load durability, and flame resistance Electronic and electrical parts and manufacturing method thereof · 'More specifically, it relates to a heat cycle durability sealed with a resin composition that does not contain harmful substances such as halogen-based flame retardants or antimony-based flame retardants that cause environmental pollution. Resin-sealed electronic and electrical parts with high performance, high-temperature load durability, and flame resistance, and a method for manufacturing the same. Electronic and electrical parts such as ceramic capacitors, resistor networks, composite integrated circuits, inductor coils, etc. are generally made of thermosetting resin composition to impart moisture resistance, heat resistance, and chemical resistance. Sealed with an insulating sealant. However, this sealant is required to have excellent adhesion to semiconductor devices, flame resistance, moisture resistance, electrical reliability, and corrosion resistance, and it is easy to use a flow immersion method or an electrostatic flow immersion method. In order to form a specified layer thickness, powder coatings mainly composed of epoxy resin are mostly used. Therefore, as for powder coatings mainly containing oxygen-transporting resins, epoxy resins, polycarboxylic anhydride-based hardeners, triphenylphosphine, and inorganic fillers have been known to date (Japanese Patent Laid-Open 6 1 — 8 9 2 7 1) 〇 On the other hand, as for the insulating sealant, in order to prevent fire in the use of electronic and electrical parts, it is required to have flame resistance. It is common to use flame retardants for flame resistance. (Please read the Precautions on the back first &^; write this page) i-line installation · This paper size is applicable to China National Standard (CNS) A4 (210 x 297 mm) 4 1242581 A7 B7 V. Description of the invention (2) However Recently, halogen-based flame retardants have caused the destruction of the ozone layer, or harmful gases occurred during combustion and have caused environmental pollution. Their use is in a restricted direction, and antimony-based flame retardants have also been designated as wastewater environmental standards. It is expected that reduction of the amount of monitored substances will become a required item, and it is expected that these flame retardants can be replaced. As for epoxy resin-based electronic and electrical component sealants that do not contain halogen or antimony, so far, those who have used epoxy resins in epoxy resin compositions containing epoxy resins, hardeners, inorganic fillers and flame retardants have Is being proposed: those who use melamine phosphorous phosphate compounds, or red phosphorus compound users who are covered with phenolic resins and silane compounds or silane compounds (Japanese Patent Application Laid-Open No. 10-1 8 2 9 4 0) or An epoxy resin having two or more hydroxyoxy groups in one molecule, a compound having two or more hydroxy groups in one molecule, a cyclic phosphogen compound, and an inorganic filler are essential components. (Japanese Unexamined Patent Publication No. 10-259292). Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -------------- Installation ----- (Please read the precautions on the back ^^ |? Write this page) line. However, this For electronic and electrical parts sealants, even if they show similar performance to conventional halogen-based or antimony-based flame retardants at the point of flame resistance, the resin composition used in this case has durability in thermal cycling and high-temperature load durability. If the system is insufficient, the electronic and electrical parts obtained by using the composition cannot be said to have satisfactory performance. Lessons to be Solved by the Invention The present invention overcomes the use of non-conventional halogen-based or non-antimony-based flame retardants. Disadvantages of electronic and electrical parts of the sealant to provide Chinese papers (CNS) A4 specifications (210 X 297 mm) applicable to the size of the paper used • 5- 1242581 A7 B7 V. Description of the invention (3) Use of halogens In the case of flame retardants based on antimony or antimony, they are comparable in performance, that is, flame-resistant, heat-cycle durability, and high-temperature load durability, halogen- or antimony-free resin-sealed electronic and electrical parts for the purpose. Means of the invention In order to develop a resin-sealed electronic / electrical component using a non-halogen-based or antimony-based sealing agent, the result of careful research is that, first, the electronic / electrical component is not covered with a single type of sealing agent layer. Cover the surface of electronic and electrical parts with a superior pull-down layer with thermal cycle durability and high-temperature load durability, and then cover it with a layer with flame resistance. It was found that flame resistance was obtained, and it also had thermal cycle durability. Based on this knowledge, the resin-sealed electronic and electrical parts with high-temperature load durability have completed the present invention. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, that is, the present invention is made of non-flammable epoxy resin powder. The body coating is thermally hardened and forms a pull-down layer (A) having thermal cycle durability and high-temperature load durability, so that it contains aluminum hydroxide, aluminum oxide hydrate, magnesium hydroxide, calcium aluminate hydrate, and phosphorus It is characterized in that the epoxy resin powder coating material of at least one flame retardant selected from the flame retardants and nitrogen flame retardants is thermally cured and the flame retardant coating layer (B) formed is sealed. Resin-sealed electronic and electrical parts' and the surface of electronic and electrical parts are coated with a non-flammable epoxy-based powder coating to a thickness of at least 0.1 mm, and then coated with a solution containing hydroxide Epoxy resin powder coatings of at least one flame retardant selected from aluminum, alumina hydrate, magnesium hydroxide, ming acid bromide hydrate, phosphorous flame retardant, and nitrogen flame retardant to at least 0. 1 -6- -------------- Installation --- ^ (Please read the notes on the back to write this page first) Thread-This paper size applies to China National Standard (CNS) A4 (210x 297) ) 1242581 A7 _ B7 V. Description of the invention After the thickness of (4) mm, the coating layer is thermally hardened to pull the layer (A) and A method for manufacturing a resin-sealed electronic / electrical part characterized by sealing an electrical insulating resin layer having a total thickness of 0.3 to 1 mm from a flame-resistant coating layer (B). Embodiments of the invention In the present invention, an epoxy-based powder coating that forms a downwardly-pulling layer (A) is a non-flammable material that does not substantially contain a flame retardant, and contains (a) solid epoxy resin and ( B) Polycarboxylic anhydride-based hardener. (A) The solid epoxy resin of the component is a solid epoxy resin at room temperature, that is, 25 ° C, and one having two or more epoxy groups in each molecule is not particularly limited. Here, the non-flammability resistance of the flame retardant is not included. The test piece (12 7 mm X 1 2 · 7 mm X 1 mm) that has been pre-heat-hardened is tested in accordance with the flame resistance test method standard UL-9 4 Time means those who do not meet the reference condition V-0. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs --- (Please read the notes on the back to write this page first) Line-a more suitable epoxy resin, the melting point of 50 ~ 150 ° C. If the melting point is less than 50 ° C, the powder coating becomes easy to consolidate, and when the melting point is higher than 150 ° C, the viscosity of the powder coating when melting will become higher, and smoothness will not be obtained. Coating. As for this type of epoxy resin, for example, diglycidyl ether type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins having a melting point of 50 to 150 ° C, phenolic novolac lacquer type rings Oxygen resin, cresol novolac lacquer type ring This paper is applicable to Chinese National Standard (CNS) A4 specification (210 X 297 public love) 1242581 A7 B7 V. Description of the invention (5) Novolac lacquer type epoxy resin such as oxygen resin For specific examples, polyfunctional glyceryl ether epoxy resins such as ketyl ether epoxy resins, phenol novolacs, glycidyl ethers, bisphenol A lipids, and glycidyl ether ring of glycerol. Glyceryl ether type epoxy resin, dibasic acid, glycidyl ester of isophthalic acid, butadiene epoxidized epoxy resin, and the like. . In addition, the melting point of the epoxy resin mixture which is liquid at normal temperature can be used arbitrarily. Secondly, for example, a glycidyl resin based on a double lacquer glycidyl epoxy resin D, a polyglycidyl epoxy resin, etc. can be used as epoxy resin, 50 to 1 5 phenol A-based ether, bisphenol oleyl ether epoxy resin-based ester type, or glycidol epoxy resin based on shrinkable epoxy resin acetic acid made of 0 t: glycidol n-cresol phenol F to polymerize Polycarboxylic anhydride-based hardeners in the range of this resin mixed, all)
0 0 \\ II coch2ch2oc0 0 \\ II coch2ch2oc
----------------- (請先閱讀背面之注意事項寫本頁) 訂·- 線- 經濟部智慧財產局員工消費合作社印製 表示的雙偏苯三酸乙二醇酯,式 〇 ch3 〇 c----------------- (Please read the notes on the back first to write this page) Order--Line-Bistrimethylene printed on the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives Glycolic acid ester, formula 0ch3 0c
0 表不的甲基環苯二竣酸酐,式 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -8 - 1242581 Δ7 ____ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(6 )0 Methacrylic acid shown in table, this paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) -8-1242581 Δ7 ____ B7 Printed by the Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs Description of the invention (6)
表示的均苯四甲酸酐,式Pyromellitic anhydride represented by the formula
表示的二苯酮四羧酸酐等。 此等酸酐因係多官能性,故與環氧樹脂間之反應,與 四氫苯二甲酸酐、四氯苯二甲酸酐等一般的低官能性之酸 酐相較,可生成密度高的交聯,在耐濕性方向帶來良好的 傾向。 此等的多元羧酐,係採用具有其9 0重量%以上爲 2〇0 //m以下,宜爲9 5重量%以上爲1 5 0//m以下 的粒徑之粉體。 此等多元羧酐係對(甲)成分之固態狀環氧樹脂之每 一當量環氧基採用0.4〜1.0當量,宜爲0.45〜 0 · 9當量之比例。若較此比例少時,則在高溫負載下的 耐久性降低,若較此比例高時則熱循環耐久性會降低。 於使含有此等成分之粉體塗料熱硬化而得的本發明之 向下拉曳層(A ),在熱循環耐久性及高溫負載耐久性優 越,而且對電子•電氣零件之附著性優越。 其次,至於形成耐燃性被覆層(B )之粉體塗料所用 的環氧樹脂(丙),可由舉例成前述之(甲)成分之例者 --------------裝---; (請先閱讀背面之注意事項寫本頁) --線· 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) -9- 1242581 Λ7 B7 五、發明説明(7 ) 中任意選擇。 又,此(丙)成分,如通常般,與環氧樹脂用硬化劑 (丁)組合使用,惟此(丁)成分若在常濕亦即2 5 °C爲 固態之環氧樹脂用硬化劑時即可,並未予特別限制。至於 此種硬北劑,可舉出有:二苯酮四羧酸酐、雙偏苯三酸乙 二醇酯等芳香族酸酐、四氫苯二甲酸酐、琥珀酸烯基酐等 的環狀脂肪族酸酐、聚己二酸酐、聚壬二酸酐、聚癸二酸 酐等的脂肪族酸酐類多種酸酐、酚、甲酚等酚類及醛類之 反應生成物的酚醛淸漆型酚醛樹脂,上述的酚類及芳烷基 醚類之反應生成物的芳烷基型酚樹脂、雙酚A、雙酚F、 三羥基苯基甲烷、四羥基苯基乙烷、肆酚類多元酚類、二 氰二醯胺、咪唑衍生物、二醯肼等。 於本發明,形成耐燃性被覆層(B )而用的粉體塗料 ’需採用由氫氧化銘(戊)、氧化銘水合物(己)、氫氧 化鎂(庚)、鋁酸鈣水合物(辛)、磷系耐燃劑(壬)及 氮系耐燃劑(癸)之中選出的至少一種。 此等的耐燃劑,係平均粒徑0 · 5〜6 0 // m,宜爲 採用1 . 0〜3 0 // m之粉末爲佳。 又,至於磷系耐燃劑(壬),例如可舉出:紅磷、磷 酸銨、磷酸三甲酚酯(T C P )、磷酸三乙酯(τ E P ) 、磷酸參(/3 —氯乙基)酯(TCEP)、磷酸參二氯丙 基酯(CRP)、磷酸甲酚二苯基酯、(CDP)、磷酸 二甲苯基二苯基酯(X D P )、酸性磷酸酯、及含氮磷化 合物等。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) —' '一 -10- (請先閱讀背面之注意事項再填頁) 裝. 訂 經濟部智慧財產局員工消費合作社印製 1242581 Α7 ^^ Β7 五、發明説明() 8 氧化鋁水合物(己)之代表性者,爲三水合化α -氧 化金呂。 又,至於氮系耐燃劑(癸),例如可舉出有:三聚氰 胺三聚氰酸酯、三聚氰胺磷酸酯等。 此等耐燃劑(戊)〜(癸)係可各自單獨使用,亦可 組合二種以上使用。 將僅屬於耐燃劑(戊)〜(辛)之耐燃劑(稱作Μ型 耐燃劑)單獨使用或組合二種以上使用之情形,以採用耐 燃性被覆層(Β )之3 0重量%以上的比例,宜爲以4 0 〜6 5重量%之比例即可。 單獨採用磷系耐燃劑(壬)或單獨採用氮系耐燃劑( 癸)之情形,對耐燃性被覆層(Β )採用以使磷原子含有 量或氮原子含有量成爲10重量%以上之比率即可。 採用Μ型耐燃劑及磷系耐燃劑(壬)之情形,採用μ 型耐燃劑及氮系耐燃劑(癸)之情形,或Μ型耐燃劑及磷 系耐燃劑(壬)與氮系耐燃劑(癸)之情形,對耐燃性被 覆層(Β ) ,Μ型耐燃劑成爲3 0重量%以上之比率,採 經濟部智慧財產局員工消費合作社印製 用至使磷原子含有量,氮原子含有量或磷原子及氮原子之 總含有量成爲2重量%以上之比率即可。 採用磷系耐燃劑(壬)及氮系耐燃劑(癸)之情形, 對耐燃性被覆層(Β ) ’採用至使磷原子及氮原子之總含 有量成爲10重量%以上之比率即可。 於此耐燃性被覆層(Β ),可使含有其他無機系耐燃 劑,例如氧化錫、氫氧化锆、偏硼酸鋇等。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ29?公釐) - -11 . 1242581 A7 B7 五、發明説明( 經濟部智慧財產局員工消費合作社印製 9 於形成本發明之向下拉曳層(A )或 B )的環氧樹脂系粉體塗料內,加入前述 期待的’可添加電子•電氣零件用封合劑 二氧化矽、熔融二氧化矽、碳酸鈣等無機 平滑劑、熱循環耐久性提高劑、偶合劑、 、著色劑、雷射發色劑等。 於本發明,供形成向下拉曳層(A ) (B )用之環氧樹脂系粉體塗料,例如對 質塡充劑施以利用揑練機等的熔融混合處 擠壓機等之熔融混合處理後,冷却固化混 於此粗粉碎物內乾式混合硬化劑、硬化促 ,對此混合物施以熔融混合處理後,冷却 粉碎後,分級,藉由調整成平均粒徑2 0 得。 第1圖爲本發明之樹脂封合型電子· 的部分平面圖。亦即對本發明之已樹脂封 ,部分外部收容的樹脂封合層之平面圖。 第2圖爲第1圖之例的Y—Y截面圖。 於此等圖,使電極2,2 /固著至圓板形陶瓷電容器 原體(介電體元件)1之兩側面上,由此等電極,介由軟 焊3,3 /拉出導線4,4 /,於該等的全表面(除導線 之部分外)上形成著向下拉曳層5及耐燃性被覆層6。 此向下拉曳層5及耐燃性被覆層6之形成在利用流動 浸漬法方面係較有利的,惟亦可採用其他的被覆法’例如 耐燃性被覆層( 的成分,因應所 所慣用的結晶性 質塡充劑、表面 耐燃助劑、觸媒 及耐燃性被覆層 環氧樹脂及無機 理、或施以利用 合物、粗粉碎, 進劑及補助成分 固化混合物、微 〜2 Ο Ο β m而 電氣零件之1例 合的陶瓷電容器 請 先 閲 讀 背 之 注 意 事 項Benzophenone tetracarboxylic anhydride and the like. Because these anhydrides are polyfunctional, they react with epoxy resins to form high-density cross-links compared to general low-functional anhydrides such as tetrahydrophthalic anhydride and tetrachlorophthalic anhydride. It brings a good tendency in the direction of moisture resistance. These polybasic carboxylic anhydrides are powders having a particle size of 90% by weight or more and 200 / m or less, preferably 95% by weight or more and 150 // m or less. These polycarboxylic anhydrides use 0.4 to 1.0 equivalents per epoxy equivalent of the solid epoxy resin of the component (a), preferably a ratio of 0.45 to 0.99 equivalents. If the ratio is smaller, the durability under a high-temperature load is lowered, and when the ratio is higher, the thermal cycle durability is lowered. The pull-down layer (A) of the present invention, which is obtained by thermally hardening a powder coating containing these components, is superior in thermal cycle durability and high-temperature load durability, and has excellent adhesion to electronic and electrical parts. Secondly, as for the epoxy resin (c) used in the powder coating for forming the flame-resistant coating layer (B), the above-mentioned (a) component can be exemplified -------------- Packing ---; (Please read the notes on the back to write this page first) --Line · This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) -9- 1242581 Λ7 B7 V. Description of the invention (7) Any choice. In addition, this (c) component is usually used in combination with a hardener for epoxy resin (butyl) as usual, but if the (butyl) component is a solid hardener for epoxy resin at 25 ° C under normal humidity, Any time, it is not particularly limited. Examples of such a hard northern agent include cyclic fats such as aromatic anhydrides such as benzophenone tetracarboxylic anhydride and ethylene glycol trimellitic acid, tetrahydrophthalic anhydride, and alkenyl succinic anhydride. Phenolic lacquer-type phenolic resins of reaction products of aliphatic acid anhydrides such as family acid anhydrides, polyadipic anhydride, polyazelaic anhydride, polysebacic anhydride, and various anhydrides, phenols, cresols, and aldehydes Aralkyl-type phenol resins, reaction products of phenols and aralkyl ethers, bisphenol A, bisphenol F, trihydroxyphenylmethane, tetrahydroxyphenylethane, polyphenols, dicyano Dimethylamine, imidazole derivatives, dihydrazine and the like. In the present invention, the powder coating used to form the flame-resistant coating layer (B) needs to be composed of a hydroxide hydroxide (pentium), an oxide hydroxide hydrate (hex), magnesium hydroxide (heptane), and calcium aluminate hydrate ( At least one selected from the group consisting of phosphorus), phosphorus-based flame retardant (non), and nitrogen-based flame retardant (dec). These flame retardants have an average particle diameter of 0 · 5 ~ 6 0 // m, preferably powders of 1.0 ~ 3 0 // m. Examples of the phosphorus-based flame retardant (non) include red phosphorus, ammonium phosphate, tricresol phosphate (TCP), triethyl phosphate (τ EP), and ginseng phosphate (/ 3-chloroethyl) ester. (TCEP), ginseng dichloropropyl phosphate (CRP), cresol phosphate diphenyl ester, (CDP), xylyl diphenyl phosphate (XDP), acid phosphate, and nitrogen-containing phosphorus compounds. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) — '' 一 -10- (Please read the notes on the back before filling in the page). Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives for printing 1242581 Α7 ^^ B7 V. Description of the Invention (8) A representative example of alumina hydrate (hex) is trihydrate α-gold oxide. Examples of the nitrogen-based flame retardant (dec) include melamine melamine, melamine phosphate, and the like. These flame retardants (E) to (Dec) can be used individually or in combination of two or more kinds. In the case of using a flame retardant (referred to as an M-type flame retardant) that belongs to flame retardants (penta) to (octane) alone or in combination of two or more, 30% by weight or more of the flame retardant coating (B) is used. The proportion is preferably 40 to 65% by weight. When a phosphorus-based flame retardant (non) is used alone or a nitrogen-based flame retardant (decane) is used alone, the flame-resistant coating layer (B) is used so that the phosphorus atom content or nitrogen atom content becomes 10% by weight or more. can. When M-type flame retardant and phosphorus-based flame retardant (non) are used, when μ-type flame retardant and nitrogen-based flame retardant (dec) are used, or M-type flame retardant and phosphorus-based flame retardant (non) and nitrogen-based flame retardant (Dec) In the case of the flame-resistant coating (B), the M-type flame retardant becomes a ratio of 30% by weight or more. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to make the phosphorus atom content and nitrogen atom content. The amount or the total content of the phosphorus atom and the nitrogen atom may be a ratio of 2% by weight or more. When a phosphorus-based flame retardant (non) and a nitrogen-based flame retardant (dec) are used, the ratio of the total content of phosphorus atoms and nitrogen atoms to the flame-resistant coating layer (B) 'may be 10% by weight or more. The flame-resistant coating layer (B) may contain other inorganic-based flame retardants such as tin oxide, zirconium hydroxide, and barium metaborate. This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 29? Mm)--11. 1242581 A7 B7 V. Description of the invention (printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 9 (A) or B) The epoxy resin powder coating material is added with the aforementioned "can be added sealant for electronic and electrical parts, silicon dioxide, fused silica, calcium carbonate and other inorganic smoothing agents, thermal cycle durability. Enhancers, coupling agents, colorants, laser colorants, etc. In the present invention, the epoxy-based powder coating for forming the pull-down layer (A) (B) is, for example, a melt-mixing treatment such as an extruder using a kneading machine, etc., for a mass filler. After that, the mixture is cooled and solidified and mixed with the dry-type hardener in the coarsely pulverized material to promote dry hardening. After the mixture is melt-mixed, the mixture is cooled and pulverized, classified, and adjusted to an average particle diameter of 20. FIG. 1 is a partial plan view of a resin-sealed electronics of the present invention. That is, a plan view of the resin-sealed layer of the present invention and a part of the externally-sealed resin-sealed layer. Fig. 2 is a Y-Y sectional view of the example of Fig. 1; In these figures, the electrodes 2, 2 / are fixed to both sides of the disc-shaped ceramic capacitor body (dielectric element) 1, and the electrodes are soldered 3/3 through the lead 4. 4 /, a pull-down layer 5 and a flame-resistant coating layer 6 are formed on the entire surface (except for the part of the wire). The formation of the pull-down layer 5 and the flame-resistant coating layer 6 is more advantageous in terms of using the flow dipping method, but other coating methods such as the composition of the flame-resistant coating layer (according to the crystalline properties that are commonly used can also be used.塡 Fillers, surface flame retardant additives, catalysts and flame retardant coatings, epoxy resins and non-mechanical, or use of compounds, coarse pulverization, solidifying mixture of additives and auxiliary components, micro ~ 2 〇 〇 β m and electrical Please read the precautions on the back of the ceramic capacitor for one case
訂 線 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -12 1242581 A7 B7 五、發明説明() 10 靜電流動槽法、靜電噴布法等。在樹脂封合之際,通常在 1 2 0〜1 7 0°C事先預熱著被封合體之電子•電氣零件 ,重複至可得所期望的厚度之樹脂爲止使附著樹脂組成物 0 其後,利用加熱處理使樹脂層充分熱硬化。其加熱處 理,通常在1 2 0〜1 7 0°C藉由加熱1〜2小時予以進 行。 於本發明方法,使於電子•電氣零件表面上形成向下 拉曳層5及耐燃性被覆層6之情形,各自的塗層係以粉體 塗料被覆成至少0·1mm之厚度。各自的被覆層之厚度 若過薄時,則較難形成良好狀態之樹脂封合層,於經予熱 硬化的情形會容易生成針孔,並不合適。 又,向下拉曳層5及耐燃性被覆層6之全部層厚爲 〇· 3〜1 · 〇mm。全部層厚若過薄時,則在經予熱硬 化的情形,較難形成具有良好的熱循環耐久性、高溫負載 耐久性及耐燃性之電氣絕緣性封合層,並不合適。全層厚 度若過厚時,則並未發現有配合厚度之特性的提高,加上 形成堆積高度,在實用上作爲電子•電氣零件並不合適。 發明之功效 本發明係最適合於即使供耐濕性、耐熱性、耐藥品性 、樹脂封合層之接著強度、熱循環耐久性或電容器類之維 護性試驗的情形亦不破壞的封合層之物性被要求的電子· 電氣零件(混成I C、電容器類、可變電阻、熱敏電阻等 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐1 一 -13- 裝-- (請先閱讀背面之注意事項再填頁) 訂 線 經濟部智慧財產局員工消費合作社印製 1242581 A7 B7 五、發明説明( 11 ),惟亦可應用在其他電子•電氣零件方面。 實施例 其次,利用實施例再詳細說明本:^日月。 且,於各例之物性的評估係依下述方法進行。 (1 )熱循環耐久性 將額定電壓2 kV、靜電容量4 7 0 p F之陶瓷電容 器元件於1 5 0 °C預熱,於此元件之上利用流動浸漬法使 粉體塗料附著至樹脂層之厚度爲〇 . 7mm,在1 5 0°C 加熱6 0分鐘並使硬化以製作試片。此時之樹脂層係向下 拉曳層用樹脂組成物或耐燃層用樹脂組成物單獨一層被覆 ,或由兩樹脂組成物之二層被覆(合計層厚〇 · 7mm) 。又’供對照試驗’製作出利用包含溴系耐燃劑及三氧化 二銻之兩者的耐燃性環氧樹脂之經予被覆一層的試片。 其次,將此等試片安裝於熱循環試驗機,於一 4 0 °C 保持3 0分鐘後,立即升溫至1 2 5 °C並於同溫度保持 3 ◦分鐘的處理作爲1循環,重複進行該熱循環處理,利 用目視觀察記錄於樹脂層上生成龜裂爲止的循環數。在此 試驗對各自的製備條件之試片製作各2 0個,以其全部均 在顯示3 0 0循環以上的耐久性之情形爲〇(良),此外 則判定成X (不良)。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) (請先閱讀背面之注意事項再填頁) -裝· 訂 經濟部智慧財產局員工消費合作社印製 -14 - 經濟部智慧財產局員工消費合作社印製 1242581 A7 B7 五、發明説明() 12 (2 )高溫負載耐久性 與(1 )同法製作試片° 對此試片,於已保持1 2 5 °C之恆溫烘箱中’施加額 定電壓之1 · 5倍的直流電壓3 k V ’測定至引起介電破 壞爲止的時間。在此試驗對各自的製備條件之試片製作各 2 0個,以其全部均顯示5 0 0小時以上的耐久性之情形 爲〇(良),此外則判定成X (不良)。 (3 )耐燃性 (i ) U L - 9 4 對各粉體塗料經予熱硬化而得的試片(1 2 7 m m X 1 2 . 7 m m x 1 m m ),依耐燃性試驗法標準U L - 9 4規定進行試驗,符合基準條件V -〇者判定成〇(良 )’不合格者則判定成X (不良)。 (1 1 ) U L - 1 4 1 4 對與(1 )同法製作的二層被覆之試片,依耐燃性試 驗法標準u L - 1 4 1 4規定進行試驗,符合耐燃性標準 者判定成〇(良),不合格者則判定成X (不良)。 參考例1〜1 7 製備具有表1及表2所示的組成之粉體塗料,採用此 塗料製作試片,對各試片評估物性。其結果示於表1及表 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)Threading This paper is in accordance with China National Standard (CNS) A4 specification (210 × 297 mm) -12 1242581 A7 B7 V. Description of the invention (10) Electrostatic flow cell method, electrostatic spray method, etc. In the case of resin sealing, the electronic and electrical parts of the sealed body are usually preheated in advance at 120 to 170 ° C, and the resin composition is adhered to the desired thickness of the resin. , The resin layer is sufficiently thermally hardened by heat treatment. The heat treatment is usually performed by heating at 120 to 170 ° C for 1 to 2 hours. In the method of the present invention, when the pull-down layer 5 and the flame-resistant coating layer 6 are formed on the surface of the electronic and electrical parts, the respective coating layers are coated with a powder coating to a thickness of at least 0 · 1 mm. When the thickness of each coating layer is too thin, it is difficult to form a resin sealing layer in a good state, and pinholes are easily formed in the case of pre-heat curing, which is not suitable. Further, the total thickness of the pull-down layer 5 and the flame-resistant coating layer 6 is 0.3 to 1 mm. If the total layer thickness is too thin, it is difficult to form an electrically insulating sealing layer having good thermal cycle durability, high-temperature load durability, and flame resistance in the case of pre-heat hardening, which is not suitable. If the thickness of the entire layer is too thick, no improvement in the characteristics of the combined thickness is observed, and the formation of a build-up height makes it unsuitable for practical use as electronic and electrical parts. EFFECTS OF THE INVENTION The present invention is a sealing layer which is most suitable for a case where it does not break even in the case of moisture resistance, heat resistance, chemical resistance, adhesion strength of resin sealing layer, thermal cycle durability, or maintenance of capacitors. Electronic and electrical parts (hybrid ICs, capacitors, variable resistors, thermistors, etc.) whose physical properties are required. This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm 1 -13-pack-(please Please read the notes on the back before filling in the page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed 1242581 A7 B7 V. Description of the invention (11), but it can also be applied to other electronic and electrical parts. Example Second, use The examples will explain this in more detail: ^ Sun and Moon. In addition, the evaluation of the physical properties in each case was performed according to the following methods. (1) Thermal cycle durability Ceramic capacitors with a rated voltage of 2 kV and a capacitance of 47 0 p F The element was preheated at 150 ° C, and the powder coating was adhered to the resin layer with a thickness of 0.7 mm by a flow dipping method on the element, and heated at 150 ° C for 60 minutes and hardened to produce a test sample. At this time The resin layer is covered with a single layer of the resin composition for the pull-down layer or the resin composition for the flame-resistant layer, or is covered with two layers of the two resin compositions (total layer thickness: 0.7 mm). It is also produced for use as a "control test". A coated test piece of a flame-resistant epoxy resin containing both a bromine-based flame retardant and antimony trioxide. Next, these test pieces were installed in a thermal cycle tester and maintained at 40 ° C for 3 hours. After 0 minutes, the temperature was immediately raised to 125 ° C and maintained at the same temperature for 3 ◦ minutes. The cycle was repeated as one cycle, and the number of cycles until cracks were formed on the resin layer was visually recorded. In this test, 20 test pieces were prepared for each of the preparation conditions, and all of them were 0 (good) when the durability was shown to be 300 cycles or more, and it was judged to be X (bad). Applicable to China National Standard (CNS) A4 specification (210X 297 mm) (Please read the notes on the back before filling in the page)-Binding and ordering printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-14-Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs consumption Printed by the cooperative 1242581 A7 B7 V. Description of the invention () 12 (2) High-temperature load durability and (1) The same method is used to make a test piece ° For this test piece, the rating is applied in a constant temperature oven that has been maintained at 1 2 5 ° C The DC voltage 3 k V ', which is 1 to 5 times the voltage, was measured until the dielectric breakdown occurred. In this test, 20 test pieces were prepared for each preparation condition, and all of them were displayed for more than 500 hours. The durability is 0 (good), and it is judged to be X (bad). (3) Flame resistance (i) UL-9 4 Test pieces obtained by pre-hardening each powder coating (1 2 7 mm X 1 2. 7 mm x 1 mm), the test is performed in accordance with the flame resistance test method standard UL-94. Those who meet the reference condition V-0 are judged as 0 (good) and those who fail are judged as X (bad). (1 1) UL-1 4 1 4 Two-layer coated test pieces made in the same way as in (1) are tested in accordance with the flame resistance test method standard u L-1 4 1 4 and those who meet the flame resistance standards are judged to be ○ (good), and those who fail are judged as X (bad). Reference Examples 1 to 17 A powder coating material having a composition shown in Tables 1 and 2 was prepared, and test pieces were prepared using the coating material, and physical properties of each test piece were evaluated. The results are shown in Table 1 and the paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm)
-15- A7 B7 I24258l 五、發明説明() 13 2 °且參考例1〜6爲向下拉曳層用樹脂組成物之配合’ 參考例8〜1 7爲耐燃性樹脂層用樹脂組成物之配合,參 考例7爲對照試驗之一層被覆用樹脂組成物之配合。-15- A7 B7 I24258l V. Description of the invention (13) 2 ° and Reference Examples 1 to 6 are the resin composition for the pull-down layer. Reference Examples 8 to 17 are the resin composition for the flame-resistant resin layer Reference Example 7 is a compound of a coating resin composition for a control test.
訂Order
經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Μ規格(210X297公釐) -16- 1242581 A7 B7 s、發明説明(14) 經濟部智慧財產局員工消費合作社印製 表1 1 2 3 4 5 6 7 8 組 成 環氧樹脂(1) 50 50 環氧樹脂(2) 40 40 40 40 40 40 環氧樹脂(3) 60 60 60 60 60 60 環氧樹脂(4) 50 50 環氧樹脂(5) 塡充劑(1) 110 110 110 110 110 110 塡充劑(2) 120 硬化劑(1) 10.2 10.2 7.1 16.3 硬化劑(2) 12.8 硬化劑⑶ 8.3 10.4 10.4 硬化劑⑷ 硬化劑(5) 硬化促進劑⑴ 0.1 0.1 0.1 0.1 0.1 0.2 0.2 0.2 硬化促進劑(2) 氫氧化銘 100 氧化鋁水合物 氫氧化鎂 鋁酸鈣水合物 磷系耐燃劑(1) 6 磷系耐燃劑(2) 氮系耐燃劑 溴系耐燃劑 20 三氧化二銻 10 均展劑 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 矽烷偶合劑 1 1 1 1 1 1 1 1 熱循環耐久性提高劑 5 評 估 熱循環耐久性 〇 〇 〇 〇 〇 〇 〇 X 高溫負載耐久性 〇 〇 X 〇 〇 〇 〇 〇 耐燃性(UL-94) X X X X X X 〇 〇 I---------1衣— (請先閲讀背面之注意事項再填頁) 線. 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -17- 1242581 A7 B7 五、發明説明L ) 15 經濟部智慧財產局員工消費合作社印製 表2 9 10 11 12 13 14 15 16 17 組 環氧樹脂⑴ 50 50 成 環氧樹脂⑵ 50 50 85 85 50 50 環氧樹脂⑶ 35 35 35 35 環氧棚旨⑷ 50 50 50 環氧棚旨⑸ 50 15 15 15 15 15 15 塡充劑⑴ 塡充劑⑵ 20 硬化劑(1) 硬化劑(2) 硬化劑(3) 10.4 10.4 硬化劑⑷ 3 3 3 3 3 3 硬化劑(5) 80 硬化促進劑(1) 0.2 0.2 硬化促進劑⑵ 2 氫氧化鋁 80 200 150 100 氧化鋁水合物 150 氫氧化鎂 180 鋁酸鈣水合物 150 磷系耐燃劑⑴ 磷系耐燃劑⑵ 40 50 100 氮系耐燃劑 40 100 溴系耐燃劑 三氧化二銻 均展劑 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 矽烷偶合劑 1 熱循環耐久性提高劑 評 熱循環耐久性 X X X X X X X X X 價 高溫負載耐久性 〇 X X X X X X X X 耐燃性(UL-94) 〇 〇 〇 〇 〇 〇 〇 〇 〇 — ^-- (請先閱讀背面之注意事項再填 :頁).Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs of the Consumer Cooperatives. The paper size is applicable to the Chinese National Standard (CNS) M specification (210X297 mm) -16- 1242581 A7 B7 s, Invention Description (14) Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economy Table 1 1 2 3 4 5 6 7 8 Composition of epoxy resin (1) 50 50 epoxy resin (2) 40 40 40 40 40 40 epoxy resin (3) 60 60 60 60 60 60 epoxy resin (4) 50 50 Epoxy resin (5) 塡 Filler (1) 110 110 110 110 110 110 塡 Filler (2) 120 Hardener (1) 10.2 10.2 7.1 16.3 Hardener (2) 12.8 Hardener 8.3 10.4 10.4 Hardener ⑷ Hardening agent (5) Hardening accelerator⑴ 0.1 0.1 0.1 0.1 0.1 0.2 0.2 0.2 0.2 Hardening accelerator (2) Ming hydroxide 100 Alumina hydrate Magnesium hydroxide Calcium aluminate hydrate Phosphorus flame retardant (1) 6 Phosphorus flame retardant Agent (2) Nitrogen-based flame retardant Bromine-based flame retardant 20 Antimony trioxide 10 Spreading agent 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Silane coupling agent 1 1 1 1 1 1 1 1 Thermal cycle durability improver 5 Evaluation of thermal cycle durability 0,000,000X High-temperature load durability 0,000,000 0,000,000 Flame resistance (UL-94) XXXXXX 〇〇I-- ------- 1 clothing — (Please read the precautions on the back before filling in the page) Thread. This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) -17- 1242581 A7 B7 V. Invention Note L) 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 2 9 10 11 12 13 14 15 16 17 Group of epoxy resins 50 50 into epoxy resins 50 50 85 85 50 50 Epoxy resins 35 35 35 35 35 Epoxy Shed ⑷ 50 50 50 Epoxy Shed 15 50 15 15 15 15 15 15 塡 Filler ⑴ Filler ⑵ 20 Hardener (1) Hardener (2) Hardener (3) 10.4 10.4 Hardener ⑷ 3 3 3 3 3 3 Hardener (5) 80 Hardener (1) 0.2 0.2 Hardener ⑵ 2 Aluminum hydroxide 80 200 150 100 Alumina hydrate 150 Magnesium hydroxide 18 0 Calcium Aluminate Hydrate 150 Phosphorus Flame Retardant ⑴ Phosphorus Flame Retardant ⑵ 40 50 100 Nitrogen Flame Retardant 40 100 Bromine Flame Retardant Antimony Trioxide Equalizer 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Silane Coupling Agent 1 Thermal cycle durability improving agent evaluation Thermal cycle durability XXXXXXXXX High temperature load durability 〇XXXXXXXX Flame resistance (UL-94) 〇〇〇〇〇〇〇〇〇〇 ^-(Please read the precautions on the back before filling: page).
、1T 線 本纸張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) -18- 1242581 A7 ------ - B7 五、發明説明(u ) 16 且,表內所記載的成分之內容係如下所述。 環氧樹脂(1 ):雙酚A型環氧樹脂、環氧當量 4 7 5 g / m ◦ 1 e ,在 2 5 °C 爲固態,商品名 Epikote 1001,油化Shell (硯殼)epoxy (股)製造 環氧樹脂(2):雙酚A型環氧樹脂、環氧當量 6 5 〇 g/mo 1 e ,在 2 5〇C 爲固態,商品名 Epikote 1 002,油化Shell (硯殼) epoxy (股)製造 環氧樹脂(3):雙酚A型環氧樹脂、環氧當量 925g/mo 1 e ,在 25°C 爲固態,商品名 Epikote 1004,油化Shell (硯殻)epoxy (股)製造 環氧樹脂(4):雙酚A型環氧樹脂、環氧當量 195〇g/mo 1 e ,在25°C爲固態,商品名Epikote 1007,油化Shell (硯殼)epoxy (股)製造 環氧樹脂(5 ):正甲酚酚醛淸漆環氧樹脂、環氧當 量2l3g/mo 1 e ,在25°C爲固態’商品名 E 0 C N 102S,日本化藥(股)製造 經濟部智慧財產局員工消費合作社印製 塡充劑(1 ):熔融二氧化矽,平均粒徑1 5 // m ’ 商品名FUSELEXRD-8,龍森(股)製造 塡充劑(2 ):結晶性二氧化矽,平均粒徑5 // m ’ 商品名CRYSTALITE CMC-6,龍森(股)製造 硬化劑(1 ):二苯酮四羧酸酐,商品名BTDA, ALCO Chemical (化學)公司製造 硬化劑(2 ):雙偏苯三甲酸乙二醇酯’商品名 RIKAACID TMEG-500,新日本理化(股)製造 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公羡) -19- 1242581 A7 _ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明<7 ) 硬化劑(3 ):甲基苯二羧酸酐,商品名EPICLON B-4400 ’大日本油墨(ink )化學工業(股)製造 硬化劑(4) :2,4一二胺基一6 —(2/ —甲基 咪唑基一 1 /)—乙基一對稱一三畊,平均粒徑2 0 //m ’2MZ — A,四國化成(股)製造 硬化劑(5 ):雙酚A、表氯醇縮聚物、環氧樹脂硬 化劑,商品名EPICURE-EK-170,油化硯殼epoxy (股)製 造 硬化促進劑(1 ):二氰基二醯胺,商品名DICY,曰 本碳化物(Carbide)工業(股)製造 硬化促進劑(2 ):酚醛酚醛淸漆樹脂之1 · 8 -二 氮雜雙環(5 · 4 . 0)十一烯一 7鹽,商品名U-CATSA831,San Apro 公司製造 氫氧化鋁:平均粒徑1 7 // m,商品名Η1 g 1111 e Η 3 1 ’ 昭和電工(股)製 氧化鋁水合物:α氧化鋁三水合物 氫氧化鎂:結晶粒子直徑0 · 6〜0 · 8 // m ’商品 名KISUMA 5A,協和化學工業(股)製造 鋁酸鈣水合物:商品名N C A 1 0 3 ’日本輕金屬( 股)製造 磷系耐燃劑(1 ):酚表面處理紅磷,平均粒徑2 5 # m,商品名NOVA RED 120,燐(磷)化學工業(股)製 造 磷系耐燃劑(2 ) ••三聚氰胺被覆聚磷酸銨’商品名 (請先閱讀背面之注意事項再本頁)1. The paper size of the 1T line is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -18- 1242581 A7 -------B7 V. Description of the invention (u) 16 And, the records in the table The contents of the components are as follows. Epoxy resin (1): bisphenol A epoxy resin, epoxy equivalent of 4 7 5 g / m ◦ 1 e, solid at 25 ° C, trade name Epikote 1001, oiled shell (砚 壳) epoxy ( (2): epoxy resin (2): bisphenol A epoxy resin, epoxy equivalent of 650 g / mo 1 e, solid at 250 ° C, trade name Epikote 1 002, oiled shell ) Epoxy (3): epoxy resin (3): bisphenol A epoxy resin, epoxy equivalent 925g / mo 1 e, solid at 25 ° C, trade name Epikote 1004, oiled shell epoxy Production of epoxy resin (4): bisphenol A epoxy resin, epoxy equivalent of 1950 g / mo 1 e, solid at 25 ° C, trade name Epikote 1007, oiled shell (pan shell) epoxy Production of epoxy resin (5): n-cresol novolac epoxy resin, epoxy equivalent 2l 3g / mo 1 e, solid at 25 ° C 'trade name E 0 CN 102S, Nippon Kayaku Co., Ltd. Printed tincture charge (1) by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Manufacturing Economy: fused silica, average particle size 1 5 // m 'Trade name FUSELEXRD-8, Longsen (shares) manufacture tincture charge (2) : Crystalline Silicon dioxide, average particle size 5 // m 'Trade name CRYSTALITE CMC-6, hardener made by Longsen (stock): benzophenone tetracarboxylic anhydride, trade name BTDA, hardened by ALCO Chemical Agent (2): bistrimethylene tricarboxylate 'trade name RIKAACID TMEG-500, manufactured by Nippon Physico Chemical Co., Ltd. This paper applies Chinese National Standard (CNS) A4 specifications (210X297 public envy) -19- 1242581 A7 _ B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention < 7) Hardener (3): Methylbenzenedicarboxylic anhydride, trade name EPICLON B-4400 'Danik Ink (ink) Chemical Industry ( (4): Hardener (4): 2,4-diamine group 6 — (2 / —methylimidazolyl 1 /) — ethyl-symmetric-three-tillage, average particle size 2 0 // m '2MZ — A, Shikoku Chemicals Co., Ltd. (5) Hardener (5): Bisphenol A, epichlorohydrin polycondensate, epoxy resin hardener, trade name EPICURE-EK-170. Accelerator (1): Dicyanodiamide, trade name DICY, hardened by Carbide Industrial (Stock) Agent (2): No. 1-8-diazabicyclo (5.4.0) undecene-7 salt of phenolic novolac lacquer resin, trade name U-CATSA831, aluminum hydroxide manufactured by San Apro: average particle size Diameter 1 7 // m, trade name Η1 g 1111 e Η 3 1 ′ Alumina hydrate made by Showa Denko Corporation: α alumina trihydrate magnesium hydroxide: Crystal particle diameter 0 · 6 ~ 0 · 8 // m 'Brand name KISUMA 5A, manufactured by Kyowa Chemical Industry Co., Ltd. calcium aluminate hydrate: trade name NCA 1 0 3' Phosphorous flame retardant (1) manufactured by Japan Light Metal (stock): phenol surface treatment red phosphorus, average particle size 2 5 # m, trade name NOVA RED 120, phosphorous flame retardant (2) made by 燐 (phosphorus) chemical industry (stock) •• melamine-coated ammonium polyphosphate 'trade name (please read the precautions on the back before this page)
訂: -線· 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)-20 - 1242581 at Β7 18 五、發明説明( (TERRAJU C60 ) ,Chisso (股)製造 請 先 閲 讀 背 面 之 注 意 事 項 氮系耐燃劑:三聚氰胺三聚氰酸酯’平均粒徑1 〇〜 30//m,商品名MC440,日產化學工業(股)製造 溴系耐燃劑:十溴二苯基醚,商品名F R 一 p E,日 寶化學(股)製造 銻系耐燃劑:三氧化銻 均展劑:丙烯酸酯寡聚體’商品名NIKALITEXK 21, 日本碳化物(Carbide )工業(股)製造 矽烷偶合劑:3 -縮水甘油氧基丙基三甲氧基矽烷, 在2 5 t:爲液態,商品名S 5 1 0,Clusso (股)製造 熱循環耐久性提高劑:芯/殻二(B A / S T ) / Μ Μ A橡膠,商品名PARALOID EXL 2655 ),吳羽化學工 業(股)製造 實施例 比較例 對照例 經濟部智慧財產局員工消費合作社印製 將參考例1〜1 7所得的粉末塗料以表3及表4所示 的層厚被層被覆於陶瓷電容器上,評估其物性。其結果示 於表3及表4。且於向下拉曳層及耐燃性被覆層之欄所示 的圓圈數字係參考例之號碼,括弧內之數字爲層厚(πί m 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) -21 - 1242581 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(19 ) 表3 複層特性 ,施例 1 2 3 4 5 6 7 向下拉曳層 ① (0.3) ② (0.3) ⑥ (0.4) ⑥ (0.2) ⑥ (0.5) ⑥ (0.5) ⑥ (0.4) 耐燃性被覆層 ⑧ (0.4) ⑨ (0.4) ⑩ (0.3) ⑪ (0.5) ⑪ (0.2) ⑫ (0.2) ⑬ (0.3) 熱循環耐久性 〇 〇 〇 〇 〇 〇 〇 高溫負載耐久性 〇 〇 〇 〇 〇 〇 〇 耐燃性(UL-1414) 〇 〇 〇 〇 〇 〇 〇 表4 複層特性 : 竇施例 比較1 列 對照 例 ( 10 11 1 2 3 向下拉曳層 ( ( S)( ;0.5)( B) < :0.5)( S) ;0.5) ⑥ (0.5) ⑩ (0.3) ⑧ (0.3) ⑫ (0.3) ⑦ (0.7) 耐燃性被覆層 ( 0)( ;0.2)( ⑤ ( :0.2)丨 〔0.2) ⑰ (0.2) ① (0.4) ⑩ (0.4) ⑬ (0.4) 熱循環耐久性 ( 0 ( 0 < 0 〇 X X X 〇 高溫負載耐久性< 0 ( 0 < 0 〇 X 〇 X 〇 耐燃性 < (UL-1414) 0 < 0 ' 0 〇 X 〇 〇 〇 t--- (請先閱讀背面之注意事項再填 頁) 訂 線 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -22- 1242581 A7 B7 五、發明説明(2。) 圖式之簡單說明 第1圖爲本發明之電子·電氣零件之一例的樹脂封合 型陶瓷電容器之部分缺口平面圖。 第2圖爲第1圖之例的X — Y載面圖。 圖號之說明 1 圓板形陶瓷電容器元件 2,2 / 電極 3,3, 軟焊 4,4 / 導線 5 向下拉曳層 6 耐燃性被覆層 請 先 閱 讀 背 之 注 意 事 項 再 I· 頁 裝 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -23-Order: -line · This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) -20-1242581 at Β7 18 V. Description of the invention ((TERRAJU C60), Chisso (stock) manufacturing Please read the back Precautions for nitrogen-based flame retardants: melamine melamine 'average particle size 10 ~ 30 // m, trade name MC440, bromine-based flame retardant manufactured by Nissan Chemical Industry Co., Ltd .: Decabromodiphenyl ether, product Named FR-p E, Nippon Chemical Co., Ltd. manufactures antimony-based flame retardants: antimony trioxide spreader: acrylate oligomers' trade name NIKALITEXK 21, Japan Carbide Industry (Stock) silane coupling agent : 3 -glycidyloxypropyltrimethoxysilane, at 2 5 t: liquid state, trade name S 5 1 0, manufactured by Clusso (strand), thermal cycle durability improver: core / shell II (BA / ST) / Μ A rubber, trade name PARALOID EXL 2655), Wu Yu Chemical Industry Co., Ltd. Manufacturing Example Comparative Example Comparative Example Intellectual Property Bureau of the Ministry of Economic Affairs Employee Consumer Cooperatives Printed the powder coatings obtained in Reference Examples 1 to 17 as a table Layer thicknesses shown in 3 and Table 4 The coating was coated on a ceramic capacitor, and its physical properties were evaluated. The results are shown in Tables 3 and 4. In addition, the circle numbers shown in the columns of the pull-down layer and the flame-resistant coating layer are the numbers of the reference examples, and the numbers in parentheses are the layer thickness (πί m. This paper size applies the Chinese National Standard (CNS) Α4 specification (210 X 297). (Mm) -21-1242581 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention (19) Table 3 Multilayer characteristics, Example 1 2 3 4 5 6 7 Pull down the layer ① (0.3) ② (0.3) ⑥ (0.4) ⑥ (0.2) ⑥ (0.5) ⑥ (0.5) ⑥ (0.4) Flame-resistant coating ⑧ (0.4) ⑨ (0.4) ⑩ (0.3) ⑪ (0.5) ⑪ (0.2) ⑫ (0.2 ) 0.3 (0.3) Thermal cycling endurance 100,000 high-temperature load endurance 100,000 flammability (UL-1414) 00000000 Table 4 Multilayer characteristics: Example of sinus Compare 1 column of comparative examples (10 11 1 2 3 Pull down the layer ((S) (; 0.5) (B) <: 0.5) (S); 0.5) ⑥ (0.5) ⑩ (0.3) ⑧ (0.3) ⑫ (0.3) ⑦ (0.7) Flame-resistant coating (0) (; 0.2) (⑤ (: 0.2) 丨 〔0.2) ⑰ (0.2) ① (0.4) ⑩ (0.4) ⑬ (0.4) Thermal cycle durability (0 (0 < 0 〇XXX 〇 High temperature load durability < 0 (0 < 0 〇X 〇X 〇 Flame resistance) (UL-1414) 0 < 0 '0 〇X 〇〇〇t --- ( Please read the precautions on the back before filling in the page.) The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) -22- 1242581 A7 B7 V. Description of the invention (2.) Fig. 1 is a partially cutaway plan view of a resin-sealed ceramic capacitor, which is an example of the electronic and electrical parts of the present invention. Fig. 2 is an X-Y plane view of the example of Fig. 1. Explanation of the drawing number 1 Disc-shaped ceramic Capacitor element 2, 2 / electrode 3, 3, soldering 4, 4 / lead wire 5 pull down layer 6 flame retardant coating Please read the precautions on the back before I. Page binding Printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210X297mm) -23-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21807099A JP4201925B2 (en) | 1999-07-30 | 1999-07-30 | Resin-sealed electronic / electrical parts and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI242581B true TWI242581B (en) | 2005-11-01 |
Family
ID=16714186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW88119015A TWI242581B (en) | 1999-07-30 | 1999-11-02 | Resin-sealed electronic electrical component and manufacture thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4201925B2 (en) |
| TW (1) | TWI242581B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2848016B1 (en) * | 2002-11-29 | 2005-01-28 | Nexans | FLAME RETARDANT |
| JP6349836B2 (en) * | 2014-03-25 | 2018-07-04 | 住友ベークライト株式会社 | Epoxy resin powder coating for varistor and varistor |
| JP6902839B2 (en) * | 2016-09-16 | 2021-07-14 | ソマール株式会社 | Powder paint |
| JP7023074B2 (en) * | 2016-09-16 | 2022-02-21 | ソマール株式会社 | Epoxy resin powder paint |
| WO2019087258A1 (en) * | 2017-10-30 | 2019-05-09 | 日立化成株式会社 | Resin composition, cured product, molding and method for producing same, film capacitor and method or producing same |
| CN109233209B (en) * | 2018-09-30 | 2021-03-30 | 陕西生益科技有限公司 | Halogen-containing antimony-free resin composition, prepreg using same, laminated board and printed circuit board |
-
1999
- 1999-07-30 JP JP21807099A patent/JP4201925B2/en not_active Expired - Fee Related
- 1999-11-02 TW TW88119015A patent/TWI242581B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001044338A (en) | 2001-02-16 |
| JP4201925B2 (en) | 2008-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3896529B2 (en) | Epoxy resin casting composition | |
| JP2580444B2 (en) | Flexible epoxy resin composition | |
| TWI242581B (en) | Resin-sealed electronic electrical component and manufacture thereof | |
| JP5324796B2 (en) | Rotating electric machine using insulating sheet and method of manufacturing rotating electric machine | |
| TWI384028B (en) | Epoxy resin hardening composition | |
| JP6349836B2 (en) | Epoxy resin powder coating for varistor and varistor | |
| US5112888A (en) | Epoxy resin composition containing long chain aliphatic diacids and/or diphenylol derivatives | |
| JPH0331738B2 (en) | ||
| US2991326A (en) | Insulation system for electrical apparatus containing liquid dielectrics | |
| JPS60181122A (en) | Powder suitable for applying electric insulating coating on electric wire | |
| TWI301841B (en) | Phosphormodifiziertes epoxidharz | |
| CA1168857A (en) | Corona-resistant resin compositions | |
| JPH05287219A (en) | Epoxy resin powder coating material | |
| JP2004292765A (en) | Flame resistant epoxy resin powder coating material for laser printing | |
| TW201809059A (en) | Composition, curing agent, prepreg and laminated board | |
| JPH055085A (en) | Adhesive composition for flame-retardant flexible copper-clad laminate | |
| KR950005345B1 (en) | Epoxy Resin Powder Coating Composition | |
| JP7826727B2 (en) | powder paint | |
| JPS60115620A (en) | Flame-retarding epoxy resin composition | |
| JPH0360846B2 (en) | ||
| JP2025121153A (en) | powder paint | |
| KR960000973B1 (en) | Thermosetting epoxy resin powder coating composition for electric insulation | |
| TW201127898A (en) | High thermal conductivity, halogen-free flame-retardant resin composition and its pre-impregnated body and coating materials for printed circuit boards | |
| JPH06116514A (en) | Flexible powder coating composition | |
| JPS63150320A (en) | Epoxy resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |