TWI264121B - A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device - Google Patents

A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device

Info

Publication number: TWI264121B
Authority: TW; Taiwan
Prior art keywords: manufacturing; layer; display device; curved surface; peeled
Prior art date: 2001-11-30

Application number

TW091133983A

Other languages

English (en)

Other versions

TW200300610A (en

Inventor

Toru Takayama

Junya Maruyama

Yuugo Goto

Hideaki Kuwabara

Shunpei Yamazaki

Original Assignee

Semiconductor Energy Lab

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-11-30

Filing date

2002-11-21

Publication date

2006-10-11

2002-11-21 Application filed by Semiconductor Energy Lab filed Critical Semiconductor Energy Lab

2003-06-01 Publication of TW200300610A publication Critical patent/TW200300610A/zh

2006-10-11 Application granted granted Critical

2006-10-11 Publication of TWI264121B publication Critical patent/TWI264121B/zh

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/19—Preparing inhomogeneous wafers
- H10P90/1904—Preparing vertically inhomogeneous wafers
- H10P90/1906—Preparing SOI wafers
- H10P90/1914—Preparing SOI wafers using bonding
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
- B60R11/02—Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
- B60R11/0229—Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the like; Arrangement of controls thereof for displays, e.g. cathodic tubes
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
- B60R11/04—Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
- B60R2011/0001—Arrangements for holding or mounting articles, not otherwise provided for characterised by position
- B60R2011/004—Arrangements for holding or mounting articles, not otherwise provided for characterised by position outside the vehicle
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R2300/00—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle
- B60R2300/20—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the type of display used
- B60R2300/202—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the type of display used displaying a blind spot scene on the vehicle part responsible for the blind spot
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R2300/00—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle
- B60R2300/80—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the intended use of the viewing arrangement
- B60R2300/802—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the intended use of the viewing arrangement for monitoring and displaying vehicle exterior blind spot views
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7426—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
- H10P72/7442—Separation by peeling
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Thin Film Transistor (AREA)
Electroluminescent Light Sources (AREA)
Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Multimedia (AREA)
Recrystallisation Techniques (AREA)
Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
Instrument Panels (AREA)
Liquid Crystal (AREA)

TW091133983A 2001-11-30 2002-11-21 A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device TWI264121B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2001367412		2001-11-30

Publications (2)

Publication Number	Publication Date
TW200300610A TW200300610A (en)	2003-06-01
TWI264121B true TWI264121B (en)	2006-10-11

Family

ID=19177159

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW091133983A TWI264121B (en)	2001-11-30	2002-11-21	A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device

Country Status (5)

Country	Link
US (6)	US7335573B2 (zh)
JP (13)	JP5020370B2 (zh)
KR (10)	KR100944887B1 (zh)
CN (4)	CN1430192A (zh)
TW (1)	TWI264121B (zh)

Families Citing this family (368)

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Publication number	Publication date
JP5842033B2 (ja)	2016-01-13
KR100929129B1 (ko)	2009-12-01
US20170125454A1 (en)	2017-05-04
CN103258839B (zh)	2016-01-20
US20080049437A1 (en)	2008-02-28
US20200312891A1 (en)	2020-10-01
JP6101324B2 (ja)	2017-03-22
KR20070120080A (ko)	2007-12-21
CN101685829B (zh)	2014-03-05
US10957723B2 (en)	2021-03-23
CN101685829A (zh)	2010-03-31
JP6010582B2 (ja)	2016-10-19
JP5020370B2 (ja)	2012-09-05
KR20090076883A (ko)	2009-07-13
KR20100109541A (ko)	2010-10-08
KR20090118902A (ko)	2009-11-18
JP2018128680A (ja)	2018-08-16
US9493119B2 (en)	2016-11-15
KR101095294B1 (ko)	2011-12-16
KR20030044840A (ko)	2003-06-09
JP6437680B2 (ja)	2018-12-12
JP2017191338A (ja)	2017-10-19
KR20090122170A (ko)	2009-11-26
KR100944887B1 (ko)	2010-03-03
KR101098781B1 (ko)	2011-12-26
KR20110130374A (ko)	2011-12-05
CN1430192A (zh)	2003-07-16
TW200300610A (en)	2003-06-01
KR101219070B1 (ko)	2013-01-21
US7335573B2 (en)	2008-02-26
KR20090075784A (ko)	2009-07-09
KR101142313B1 (ko)	2012-05-17
US20030162312A1 (en)	2003-08-28
JP2020170169A (ja)	2020-10-15
KR100952320B1 (ko)	2010-04-09
JP2012190025A (ja)	2012-10-04
JP6163587B2 (ja)	2017-07-12
KR100929127B1 (ko)	2009-11-27
JP2016027408A (ja)	2016-02-18
JP2013122598A (ja)	2013-06-20
JP2014206745A (ja)	2014-10-30
JP2018066999A (ja)	2018-04-26
US20140347490A1 (en)	2014-11-27
JP2016189470A (ja)	2016-11-04
JP5521026B2 (ja)	2014-06-11
JP2014222659A (ja)	2014-11-27
CN103258839A (zh)	2013-08-21
KR20120100879A (ko)	2012-09-12
KR101243622B1 (ko)	2013-03-14
US10325940B2 (en)	2019-06-18
KR100929128B1 (ko)	2009-12-01
JP2019082729A (ja)	2019-05-30
US10629637B2 (en)	2020-04-21
JP2016130857A (ja)	2016-07-21
JP2011063263A (ja)	2011-03-31
CN101685796B (zh)	2016-08-03
KR20080006507A (ko)	2008-01-16
JP6273398B1 (ja)	2018-01-31
US20190371831A1 (en)	2019-12-05
CN101685796A (zh)	2010-03-31

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