TWI526302B - The copper foil of the attached carrier and the copper-clad laminate with the attached copper foil - Google Patents

The copper foil of the attached carrier and the copper-clad laminate with the attached copper foil Download PDF

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Publication number
TWI526302B
TWI526302B TW102135232A TW102135232A TWI526302B TW I526302 B TWI526302 B TW I526302B TW 102135232 A TW102135232 A TW 102135232A TW 102135232 A TW102135232 A TW 102135232A TW I526302 B TWI526302 B TW I526302B
Authority
TW
Taiwan
Prior art keywords
layer
amount
total
copper foil
carrier
Prior art date
Application number
TW102135232A
Other languages
English (en)
Chinese (zh)
Other versions
TW201422423A (zh
Inventor
森山晃正
永浦友太
新井英太
三木敦史
Original Assignee
Ｊｘ日鑛日石金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ日鑛日石金屬股份有限公司 filed Critical Ｊｘ日鑛日石金屬股份有限公司
Publication of TW201422423A publication Critical patent/TW201422423A/zh
Application granted granted Critical
Publication of TWI526302B publication Critical patent/TWI526302B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
TW102135232A 2012-09-28 2013-09-27 The copper foil of the attached carrier and the copper-clad laminate with the attached copper foil TWI526302B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012215584 2012-09-28

Publications (2)

Publication Number Publication Date
TW201422423A TW201422423A (zh) 2014-06-16
TWI526302B true TWI526302B (zh) 2016-03-21

Family

ID=50388512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102135232A TWI526302B (zh) 2012-09-28 2013-09-27 The copper foil of the attached carrier and the copper-clad laminate with the attached copper foil

Country Status (5)

Country Link
JP (2) JP6236009B2 (ko)
KR (2) KR102030911B1 (ko)
CN (1) CN104685109B (ko)
TW (1) TWI526302B (ko)
WO (1) WO2014051123A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6570430B2 (ja) * 2015-11-12 2019-09-04 Ｊｘ金属株式会社 キャリア付銅箔の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6471140B2 (ja) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法
JP7409760B2 (ja) * 2016-12-05 2024-01-09 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52145769A (en) 1976-05-31 1977-12-05 Nippon Mining Co Method of surface treating printed circuit copper foil
JPH0682486B2 (ja) 1986-06-20 1994-10-19 松下電器産業株式会社 回転磁気シ−ト装置
JPH0650795B2 (ja) 1989-05-02 1994-06-29 日鉱グールド・フォイル株式会社 印刷回路用銅箔の処理方法
JPH0650794B2 (ja) 1989-05-02 1994-06-29 日鉱グールド・フォイル株式会社 印刷回路用銅箔の処理方法
JPH0654831A (ja) 1992-08-10 1994-03-01 Hitachi Ltd 磁気共鳴機能イメージング装置
JP2849059B2 (ja) 1995-09-28 1999-01-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔の処理方法
JP4241098B2 (ja) * 2002-03-05 2009-03-18 日立化成工業株式会社 金属張積層板、これを用いたプリント配線板およびその製造方法
WO2004005588A1 (ja) 2002-07-04 2004-01-15 Mitsui Mining & Smelting Co.,Ltd. キャリア箔付電解銅箔
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP5512273B2 (ja) * 2007-09-28 2014-06-04 Ｊｘ日鉱日石金属株式会社 印刷回路用銅箔及び銅張積層板
JP2009214308A (ja) * 2008-03-07 2009-09-24 Furukawa Electric Co Ltd:The キャリア付き銅箔
MY150825A (en) * 2008-11-25 2014-02-28 Jx Nippon Mining & Metals Corp Copper foil for printed circuit
KR20130054447A (ko) * 2009-03-27 2013-05-24 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 프린트 배선판용 동박 및 그 제조 방법
WO2011138876A1 (ja) * 2010-05-07 2011-11-10 Jx日鉱日石金属株式会社 印刷回路用銅箔
WO2012132577A1 (ja) * 2011-03-30 2012-10-04 Jx日鉱日石金属株式会社 印刷回路用銅箔

Also Published As

Publication number Publication date
WO2014051123A1 (ja) 2014-04-03
TW201422423A (zh) 2014-06-16
KR20170077280A (ko) 2017-07-05
JP2017053034A (ja) 2017-03-16
CN104685109B (zh) 2017-12-05
JP6236009B2 (ja) 2017-11-22
KR20150060940A (ko) 2015-06-03
JPWO2014051123A1 (ja) 2016-08-25
JP6396967B2 (ja) 2018-09-26
CN104685109A (zh) 2015-06-03
KR102030911B1 (ko) 2019-10-10

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees