TWI832490B - 配線裝置 - Google Patents

配線裝置 Download PDF

Info

Publication number
TWI832490B
TWI832490B TW111138911A TW111138911A TWI832490B TW I832490 B TWI832490 B TW I832490B TW 111138911 A TW111138911 A TW 111138911A TW 111138911 A TW111138911 A TW 111138911A TW I832490 B TWI832490 B TW I832490B
Authority
TW
Taiwan
Prior art keywords
pressing
substrate
row
covered wire
guide
Prior art date
Application number
TW111138911A
Other languages
English (en)
Chinese (zh)
Other versions
TW202329776A (zh
Inventor
松岡墾基
黄民
Original Assignee
日商海上股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商海上股份有限公司 filed Critical 日商海上股份有限公司
Publication of TW202329776A publication Critical patent/TW202329776A/zh
Application granted granted Critical
Publication of TWI832490B publication Critical patent/TWI832490B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW111138911A 2022-01-06 2022-10-13 配線裝置 TWI832490B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/000205 WO2023132025A1 (ja) 2022-01-06 2022-01-06 配線装置
WOPCT/JP2022/000205 2022-01-06

Publications (2)

Publication Number Publication Date
TW202329776A TW202329776A (zh) 2023-07-16
TWI832490B true TWI832490B (zh) 2024-02-11

Family

ID=83444678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111138911A TWI832490B (zh) 2022-01-06 2022-10-13 配線裝置

Country Status (6)

Country Link
JP (1) JP7143554B1 (de)
KR (1) KR102724252B1 (de)
CN (1) CN116724383A (de)
AT (1) AT526808B1 (de)
TW (1) TWI832490B (de)
WO (1) WO2023132025A1 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000199161A (ja) * 1999-01-11 2000-07-18 Kanebo Ltd 不織布吸音材及びその製造方法
CN101208576A (zh) * 2004-07-01 2008-06-25 阿威德热合金有限公司 用于电子部件的包含流体的冷却板
CN105802345A (zh) * 2014-12-30 2016-07-27 深圳Tcl工业研究院有限公司 纳米金属导电油墨及其制备方法和印制线路板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057699B2 (ja) * 1979-10-30 1985-12-16 富士通株式会社 ワイヤ−ボンダの制御方法
JPS58137221A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd ワイヤボンデイング装置
JPS58192688A (ja) * 1982-04-30 1983-11-10 Chiyouonpa Kogyo Kk ワイヤボンデイング装置におけるワイヤル−プ整形方法
JPS6057699A (ja) 1983-09-09 1985-04-03 株式会社日立製作所 基板表面凹凸の平坦平滑化方法
JPH05144867A (ja) * 1991-11-19 1993-06-11 Hitachi Ltd 電子装置およびワイヤボンデイング方法ならびにワイヤボンデイング装置
JP2783125B2 (ja) * 1993-07-23 1998-08-06 株式会社デンソー ワイヤボンディング方法
JPH09321074A (ja) * 1996-05-31 1997-12-12 Toyota Motor Corp ワイヤボンディング装置
JP3856532B2 (ja) * 1997-06-12 2006-12-13 株式会社カイジョー ワイヤボンダー用ボール形成装置
US7946465B2 (en) * 2007-09-25 2011-05-24 Silverbrook Research Pty Ltd Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards
US7597235B2 (en) * 2007-11-15 2009-10-06 Infineon Technologies Ag Apparatus and method for producing a bonding connection
JP2010118400A (ja) * 2008-11-11 2010-05-27 Renesas Technology Corp 半導体装置及びその製造方法
DE102013201868B4 (de) * 2012-02-07 2022-12-15 Kulicke And Soffa Industries, Inc. Draht-Bondsystem und Verfahren zum Bilden eines Draht-Loop

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000199161A (ja) * 1999-01-11 2000-07-18 Kanebo Ltd 不織布吸音材及びその製造方法
CN101208576A (zh) * 2004-07-01 2008-06-25 阿威德热合金有限公司 用于电子部件的包含流体的冷却板
CN105802345A (zh) * 2014-12-30 2016-07-27 深圳Tcl工业研究院有限公司 纳米金属导电油墨及其制备方法和印制线路板

Also Published As

Publication number Publication date
WO2023132025A1 (ja) 2023-07-13
AT526808A3 (de) 2024-12-15
KR102724252B1 (ko) 2024-11-01
KR20230107790A (ko) 2023-07-18
AT526808A2 (de) 2024-07-15
JPWO2023132025A1 (de) 2023-07-13
JP7143554B1 (ja) 2022-09-28
AT526808B1 (de) 2025-06-15
CN116724383A (zh) 2023-09-08
TW202329776A (zh) 2023-07-16

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