WO1996042035A1 - Photosensitive paste, plasma display, and process for the production thereof - Google Patents
Photosensitive paste, plasma display, and process for the production thereof Download PDFInfo
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- WO1996042035A1 WO1996042035A1 PCT/JP1996/001596 JP9601596W WO9642035A1 WO 1996042035 A1 WO1996042035 A1 WO 1996042035A1 JP 9601596 W JP9601596 W JP 9601596W WO 9642035 A1 WO9642035 A1 WO 9642035A1
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- weight
- fine particles
- photosensitive paste
- photosensitive
- glass
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
- H01J9/22—Applying luminescent coatings
- H01J9/227—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines
- H01J9/2271—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines by photographic processes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
- C08F290/046—Polymers of unsaturated carboxylic acids or derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/001—Phase modulating patterns, e.g. refractive index patterns
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Definitions
- the present invention relates to a novel photosensitive paste, a plasma display using the paste, and a method for manufacturing the same.
- the photosensitive base of the present invention is used for pattern processing of various displays including a plasma display, a plasma addressed liquid crystal display, and a circuit material.
- the plasma display can be used for a large television / computer monitor.
- a material capable of patterning an inorganic material such as glass with high accuracy and a high aspect ratio is desired for forming partition walls which are partitions of each element of a plasma display panel.
- US Pat. No. 5,209,688 discloses a method in which a photosensitive paste is coated on transfer paper, and then a transfer film is transferred onto a glass substrate to form partition walls.
- Japanese Patent Application Laid-Open No. 7-138 proposes a method of forming a partition by filling a groove of a photoresist layer with a dielectric paste.
- US Pat. No. 5,116,271 proposes a method of forming a partition using a photosensitive organic film.
- these methods have a problem in that the number of steps is increased because a transfer film, a photoresist or an organic film is required. Further, it has not been possible to obtain a partition wall having a high definition / high aspect ratio.
- the present invention controls the refractive index of the organic component and the inorganic component in the photosensitive paste, thereby reducing reflection and scattering at the interface between the organic component and the inorganic component, and achieving a high aspect ratio and
- An object of the present invention is to provide a photosensitive paste that enables high-precision pattern processing. Another object is to provide a high-definition plasma display and a method for manufacturing the same.
- An object of the present invention is a photosensitive paste containing an organic component containing inorganic fine particles and a photosensitive compound as an essential component, wherein the average refractive index N1 of the inorganic fine particles and the average refractive index N2 of the photosensitive organic component are different. This is achieved by a photosensitive paste characterized by satisfying the following expression.
- an object of the present invention is to use a light-sensitive paste containing an inorganic component and an organic component containing a photosensitive compound as essential components, and to use inorganic fine particles having an average refractive index in the range of 1.5 to 1.7.
- a photosensitive paste characterized by the following.
- the present invention is achieved by a plasma display and a method of manufacturing the same, characterized in that after applying the paste on a glass substrate, barriers are formed through respective steps of exposure, development, and baking.
- the photosensitive paste of the present invention is composed of an organic component containing inorganic particles and a photosensitive compound, and is baked after forming a pattern using photolithography using the photosensitive organic component, thereby obtaining an inorganic paste. Create a pattern.
- the content of the inorganic fine particles in the paste is preferably from 50 to 95% by weight, and more preferably from 70 to 95% by weight, since the shrinkage during firing is small and the change in shape due to firing is small.
- the inventors have found that the difference between the average refractive index of the organic component and the average refractive index of the inorganic fine particles is set to 0.1 or less, more preferably 0.07 or less, so that a high aspect ratio can be obtained. Turns have been found to be easy to get.
- a high-aspect ratio pattern can be formed with high accuracy by satisfying the following equation, where the average refractive index N1 of the inorganic fine particles in the photosensitive paste and the average refractive index of the photosensitive organic component] 2 satisfy the following formula. can do.
- a pattern having a higher aspect ratio is formed by satisfying the following expression.
- a pattern having a high aspect ratio can be formed by satisfying the following expression for the refractive index N 3 after the organic component is polymerized by light irradiation and the average refractive index N 1 of the inorganic fine particles.
- the inorganic fine particles are not particularly limited as long as they are general ones. Glass, ceramics (alumina, cordierite, etc.), metals (gold, platinum, silver, copper, nickel, palladium, tungsten, ruthenium oxide and alloys thereof) can be used. Glass and ceramics containing boron oxide or aluminum oxide as an essential component are preferred. These are insulators and are preferably used for forming insulating patterns, particularly for forming partition walls of plasma displays and plasma-less liquid crystal displays.
- the particle size of the inorganic fine particles is selected in consideration of the shape of the pattern to be produced.
- the weight percent particle size is 0.1 to 10 // m, the 10 weight percent particle size is 0.4 to 2 ⁇ m, and the 90 weight percent particle size is 4 to 10 m. It is preferable to use inorganic fine particles having a specific surface area of 0.2 to 3 m 2 / g for pattern formation.
- the sphericity is preferably at least 80% by number. More preferably, the average particle size is 1.5 to 4 ⁇ m, the specific surface area is 0.5 to 1.5 m 2 / g, and the sphericity is 90% by number or more.
- the sphericity is the ratio of particles having a spherical or elliptical shape when observed under a microscope, and is observed as a circle or an ellipse under an optical microscope.
- a more accurate pattern can be obtained by using fine glass particles obtained by grinding glass with a total light transmittance (50 mm or more) of 50% or more at a wavelength of 436 nm. .
- glass with a thermal softening temperature (T s) of 350 to 600 ° C is used as inorganic fine particles to form a pattern on a glass substrate with a low thermal softening point. It is preferable to use the fine particles in an amount of 60% by weight or more.
- silicon oxide is blended in the range of 3 to 60% by weight, and if less than 3% by weight, the denseness, strength and stability of the glass layer are reduced, and The thermal expansion coefficient deviates from the desired value, easily causing a mismatch with the glass substrate.By setting the content to 60% by weight or less, the thermal softening point is lowered, and baking on the glass substrate becomes possible.
- boron oxide in the range of 5 to 50% by weight, electrical, mechanical and thermal properties such as electrical insulation, strength, thermal expansion coefficient, and denseness of the insulating layer can be improved. If it exceeds 50% by weight, the stability of the glass will be reduced.
- glass microparticles containing at least one of bismuth oxide, lead oxide, lithium oxide, sodium oxide, and lithium oxide at 5 to 50% by weight it has a temperature characteristic that can be patterned on a glass substrate.
- a glass paste can be obtained. If it exceeds 50% by weight, the heat-resistant temperature of the glass will be too low and it will be difficult to bake it on a glass substrate.
- the use of glass containing 5 to 50% by weight of bismuth oxide has advantages such as long pot life of the paste.
- the glass composition containing bismuth oxide is expressed in terms of oxide.
- Silicon oxide 3 to 60% by weight
- glass generally used as an insulator has a refractive index of about 1.5 to 1.9.
- the average refractive index of the organic component is significantly different from the average refractive index of the inorganic fine particles, reflection and scattering at the interface between the inorganic fine particles and the photosensitive organic component are increased, and a fine pattern cannot be obtained.
- the refractive index of general organic components is 1.445 to 1.7
- the refractive index of inorganic fine particles and that of organic components are matched by setting the average refractive index of inorganic fine particles to 1.5 to 1.7. It can be done.
- the refractive index is 1.55 to 1.65, there is an advantage that the range of selection of the organic component is widened.
- glass fine particles containing a total of 3 to 20% by weight of oxides of alkali metal such as lithium oxide, sodium oxide, and oxidizing lithium it is easy to control the thermal softening temperature and thermal expansion coefficient. As much as possible, the average refractive index of glass can be lowered, so that it becomes easier to reduce the difference in refractive index from organic materials.
- the amount of the metal oxide is preferably 20% by weight or less, more preferably 15% by weight or less, in order to improve the stability of the base.
- the use of lithium oxide makes it possible to relatively increase the stability of the paste, and the use of potassium oxide has the advantage that the refractive index can be controlled with a relatively small amount of addition. For this reason, among the alkali metal oxides, addition of lithium oxide and oxidizing lime is effective.
- thermo softening temperature that can be baked on a glass substrate, can have an average refractive index of 1.5 to 1.7, and can easily reduce the refractive index difference from the organic component.
- Glass containing lead oxide or bismuth oxide is preferred from the viewpoint of improving the heat softening temperature and water resistance.
- glass fine particles containing at least 10% by weight of lead oxide and bismuth oxide have a refractive index of at least 1.6. Many. For this reason, lithium metal, sodium oxide, oxidizing power By using a group oxide and lead oxide or bismuth oxide together, it becomes easy to control the thermal softening temperature, thermal expansion coefficient, water resistance and refractive index.
- the content is preferably 40% by weight or less, more preferably 30% by weight or less, And the sum of these contents is 50% by weight or less.
- glass fine particles or ceramic fine particles having a thermal softening point of 600 to 900 ° C. to the paste used in the present invention in a range of 40% by weight or less, shrinkage during firing is suppressed. Rate can be suppressed.
- the difference in the refractive index of the inorganic fine particles used in this case is 0.1 or less, and more preferably 0.05 or less for accurate pattern formation.
- a circuit material especially a glass material for use in a multi-layer substrate
- a ceramic other than a glass so that the heat softening temperature does not need to be 600 ° C. or less.
- the content of aluminum oxide By setting the content of aluminum oxide to about 25 to 75% by weight as a material, it is possible to form a substrate having higher strength.
- the measurement of the refractive index of the inorganic fine particles in the present invention can be performed by the Becke method. It is accurate to confirm the effect by measuring the wavelength of the light to be measured at the wavelength of the light to be exposed after applying the paste. In particular, it is preferable to measure with light having a wavelength in the range of 350 to 65 nm. Further, it is preferable to measure the refractive index at the i-line (365 nm) or the g-line (436 nm).
- the pattern after firing can be colored.
- a black pattern can be formed by including 1 to 10% by weight of a black metal oxide in the photosensitive paste.
- Blackening is possible by including at least one, and preferably three or more of Cr, Fe, Co, Mn, and Cu oxides as black metal oxides used in this case. become.
- a blacker pattern can be formed by containing 0.5% by weight or more of each of the oxides of Fe and Mn.
- inorganic fine particles used in the present invention fine particles having different components can be used in combination.
- glass fine particles or ceramic fine particles having different thermal softening points the shrinkage during firing can be suppressed.
- the difference in refractive index between the inorganic fine particles having different components used in this case is 0.1 or less, and further, 0.05 or less in order to form a pattern with high accuracy.
- the organic component used in the present invention is an organic component (a part obtained by removing an inorganic component from the paste) in a paste containing a photosensitive organic substance.
- the content of the photosensitive component is preferably 10% by weight or more, more preferably 30% by weight or more in the organic component in terms of sensitivity to light.
- the organic component contains a photosensitive component selected from at least one of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer, and further includes a binder, a photopolymerization initiator, an ultraviolet absorber, and a sensitizer, if necessary.
- Additives such as chemicals, sensitization aids, polymerization inhibitors, plasticizers, thickeners, organic solvents, antioxidants, dispersants, organic or inorganic suspending agents, and leveling agents. Will be
- the photosensitive component there are a photo-insolubilized type and a photo-solubilized type.
- (A) contains a functional monomer, oligomer, or polymer having at least one unsaturated group in the molecule
- diazo resin such as a condensate of a diazoamine and formaldehyde.
- a suitable polymer binder e.g. There are naphthoquinone-1,2-diazido-5-sulfonate of borak resin.
- the photosensitive component used in the present invention all of the above can be used.
- the photosensitive component which can be simply used by being mixed with inorganic fine particles is preferably (A).
- the photosensitive monomer is a compound containing a carbon-carbon unsaturated bond. Specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopyryl acrylate, and n-propyl acrylate.
- the developability after exposure can be improved by adding an unsaturated acid such as an unsaturated carboxylic acid.
- unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl diacid, and anhydrides of these acids.
- binder examples include polyvinyl alcohol, polyvinyl butyral, methacrylate ester polymer, acrylate ester polymer, acrylate-methacrylate copolymer, ⁇ -methylstyrene polymer, and butyl methacrylate. Resin. Further, an oligomer and a polymer obtained by polymerizing at least one of the compounds having a carbon-carbon double bond described above can be used.
- these monomers can be copolymerized with other photosensitive monomers so that the content of these monomers is at least 10% by weight, more preferably at least 35% by weight.
- the developability after exposure can be improved by copolymerizing an unsaturated acid such as an unsaturated carboxylic acid.
- unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.
- the acid value (AV) of the thus obtained polymer or oligomer having an acidic group such as a carboxyl group in the side chain is preferably from 50 to 180, more preferably from 70 to 140.
- the acid value is less than 50, the allowable development width becomes narrow.
- the acid value exceeds 180, the solubility of the unexposed portion in the developer decreases, so that when the concentration of the developer is increased, peeling occurs even in the exposed portion. It is difficult to obtain high-definition patterns.
- a photoreactive group By adding a photoreactive group to the side chain or molecular terminal of the polymer or oligomer described above, it can be used as a photosensitive polymer or photosensitive oligomer having photosensitivity.
- Preferred photoreactive groups are those having an ethylenically unsaturated group.
- examples of the ethylenically unsaturated group include a vinyl group, an aryl group, an acryl group, and a methacryl group.
- a method of adding such a side group to the polymer is to use an ethylenically unsaturated compound having a glycidyl group or an isocyanate group with respect to a mercapto group, an amino group, a hydroxyl group or a carboxyl group in the polymer.
- diacrylic acid chloride, methacrylic acid chloride or acrylic chloride is subjected to an addition reaction.
- Examples of the ethylenically unsaturated compound having a dalicidyl group include dalicidyl acrylate, glycidyl methacrylate, aryl glycidyl ether, glycidyl ethyl acrylate, crotonyl daricidyl ether, glycidyl ether crotonate, and isocrotin. And glycidyl tonate.
- Examples of the ethylenically unsaturated compound having an isocyanate group include (meth) acryloylyl succinate and (meth) acryloylethyl isocyanate.
- ethylenically unsaturated compounds having a glycidyl group or an isocyanate group such as acrylic acid chloride, methacrylic acid chloride or aryl chloride, are capable of reacting with mercapto, amino, hydroxyl, and carboxyl groups in the polymer. It is preferable to add 0.05 to 1 molar equivalent.
- the photopolymerization initiator examples include benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamine) benzophenone, and 4,4-bis (getylamino) benzophenone.
- 4 dicyclomouth benzophenone 4 1-benzoyl 4-methyl diphenyl ketone, dibenzyl ketone, fluorenone, 2, 2-diethoxy acetophenone, 2, 2- dimethoxy ethoxy 2- 2-phenyl 2- phenylacetophenone, 2- Hydroxy-1 2-methylpropiophenone, p-t-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, getylthioxanthone , Benzyl, benzyl dimethyl ketone, benzyl methacrylate Benzoin, benzoin methyl ether,
- Luan Traquinone Anthrone, Benzanthrone, Dibenzosuberone, Methyleneanthrone, 4-Azidobenzalacetophenonone, 2,6—Bis ( ⁇ -azidobenzylidene) cyclohexanone, 2,6—Bis ( ⁇ -azidobenzylidene) 1-4-methylcyclohexanone, 2-phenyl 1,2 _butadione 1-2 — ( ⁇ — methoxycarbonyl) oxime, 1 — phenyl-propanedione 1-2 — ( ⁇ -ethoxycarbonyl ) Oxime, 1, 3-diphenyllooproprion triol-2-( ⁇ -ethoxycarbonyl) oxime, 1-feniru 3 _ ethoxy-propane triion-2-( ⁇ -benzoyl) oxime, mi hilaketon, 2-Methyl- [4- (methylthio) phenyl: L-n
- the photopolymerization initiator is added in the range of 0.05 to 10% by weight, more preferably 0.1 to 5% by weight, based on the light-sensitive component. If the amount of the polymerization initiator is too small, the photosensitivity becomes poor, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion may be too small.
- an ultraviolet absorber By adding a compound having a high ultraviolet absorption effect, a high aspect ratio, high definition and high resolution can be obtained.
- an organic dye or an organic pigment in particular, a red organic dye having a high UV absorption coefficient in a wavelength range of 350 to 450 nm is preferably used.
- azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, aminoketone dyes, anthraquinones, benzoph: I: non, diphenyl cyanoacrylate Rate, triazine and p-aminobenzoic acid dyes can be used.
- an organic dye is added as a light absorbing agent, it is preferable because the deterioration of the insulating film characteristics due to the light absorbing agent can be reduced without remaining in the insulating film after firing.
- azo and benzofunnon dyes are preferred.
- the addition amount of the organic dye is preferably 0.05 to 5 parts by weight. If the content is less than 0.05% by weight, the effect of adding the ultraviolet absorber is reduced, and if it exceeds 5% by weight, the properties of the insulating film after sintering deteriorate, which is not preferable. More preferably 0.05 to 1% by weight. You.
- An example of a method of adding an ultraviolet light absorber composed of an organic dye is as follows.In addition to a method of preparing a solution in which an organic dye is dissolved in an organic solvent in advance and kneading the solution at the time of preparing a paste, an inorganic fine particle is added to the organic solvent. After mixing, drying may be used. By this method, so-called capsule-shaped fine particles in which an organic film is coated on the surface of each of the inorganic fine particles can be produced.
- metals and oxides such as Pb, Fe, Cd, Mn, Co, and Mg contained in the inorganic fine particles react with the photosensitive components contained in the paste to shorten the paste for a short time. It may cause gelation and make application impossible.
- a stabilizer it is preferable to add a stabilizer to prevent gelation.
- a triazole compound is preferably used.
- a benzotriazole derivative is preferably used. Among them, benzotriazole works particularly effectively.
- a predetermined amount of benzotriazole is applied to inorganic fine particles by adding methyl benzoate, ethyl acetate, ethyl alcohol, methyl alcohol, etc. After dissolving in these organic solvents, immerse in the solution for 1 to 24 hours so that these fine particles can be sufficiently immersed. After immersion, the particles are naturally dried, preferably at 20 to 30 ° C., and the solvent is evaporated to produce triazole-treated fine particles.
- the ratio of the stabilizer used (stabilizer inorganic fine particles) is preferably 0.05 to 5% by weight.
- a sensitizer is added to improve the sensitivity.
- Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-dimethylaminobenzal) cyclopenone, and 2,6-bis (4-dimethylamidibenzal) cyclo Hexanone, 2,6-bis (4-dimethylaminobenzal) 1,4-methylcyclohexanone, Michler's ketone, 4,4-bis (getylamino) benzophenone, 4,4-bis (dimethylamino) chalcone, 4, 4-Bis (getylamino) chalcone, p-dimethylaminocinnamilideneindanone, p-dimethylaminobenzylideneindanone, 2- (p-dimethylaminophenylvinylidene) -isonaphthothiazole, 1,3-bis (4 1-Dimethylaminobenzal
- the addition amount is usually from 0.05 to 10% by weight, more preferably from 0.1 to 10% by weight, based on the photosensitive component. ⁇ If the amount of the sensitizer is too small, the effect of improving the photosensitivity will not be exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed area may be too small.
- the polymerization inhibitor is added to improve the thermal stability during storage.
- Specific examples of the polymerization inhibitor include hydroquinone, monoesterified hydroquinone, N-ditrosodiphenylamine, phenothiazine, p-t-butylcatechol, N-phenylnaphthylamine, 2 , 6-di-tert-butyl-p-methylphenol, chloranil, pyrogallol, etc.
- a polymerization inhibitor When a polymerization inhibitor is added, its amount is usually 0.001-1% by weight in the photosensitive paste.
- plasticizer examples include dibutyl phthalate, octyl phthalate, polyethylene render glycol, glycerin and the like.
- Antioxidants are added to prevent oxidation of the acrylic copolymer during storage.
- Specific examples of antioxidants include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-14-ethylphenol, 2,2-methylene-bis ( 4-methyl-6-t-butylphenol, 2,2-methylene-bis (4-ethyl-6-t-butylphenol), 4,4-bis- (3-methyl-6-t-butylphenol), 1 , 1,3, tris (2-methyl-6-t-butylphenol), 1,1,3, tris (2, methyl-4-hydroxyt-butylphenyl) butane, bis [3,3— Bis- (4-hydroxy-3-t-butylphenyl) butyl acid] glycol ester, dilaurylthiodipropionate, triphenylphosphite and the like.
- the antioxidant is added, the amount of the antioxidant is usually 0.001 to 1% by weight in the paste.
- an organic solvent may be added to the photosensitive paste of the present invention.
- the organic solvent used at this time include methyl sorb, ethyl sorb, butyl sorb, methyl ethyl ketone, Dioxane, Acetone, Cyclohexanone, Cyclopentanone, Isobutyl Alcohol, Isopropyl Alcohol, Tetrahydrofuran, Dimethyl Rusulfoxide, 7-butyrolactone, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, and chlorobenzoic acid, and an organic solvent mixture containing at least one of these are used.
- the refractive index of the organic component refers to the refractive index of the organic component in the paste at the time when the photosensitive component is exposed to light.
- it means the refractive index of the organic component in the paste after the drying step.
- the paste is applied on a glass substrate, dried at 50 to 100 ° C. for 1 to 30 minutes, and the refractive index is measured.
- the measurement of the refractive index is preferably performed by an ellipsometry method or a V-block method, which is generally performed, and it is accurate to perform the measurement at the wavelength of light to be exposed in order to confirm the effect.
- the refractive index after the organic component is polymerized by light irradiation it can be measured by irradiating only the organic component with the same light as when irradiating the paste with light.
- Glass particles containing 10% by weight or more of bismuth oxide or lead oxide that can be baked on a glass substrate may have a refractive index of 1.6 or more. In this case, the refractive index of an organic substance is increased. There is a need.
- a high refractive index component it is necessary to introduce a high refractive index component into the organic component, and a compound having a sulfur atom, a bromine atom, an iodine atom, a naphthalene ring, a biphenyl ring, an anthracene ring, and a carbazole ring in the organic component is 10% by weight. % Or more is effective for increasing the refractive index. Further, by containing 20% by weight or more of a benzene ring, a high refractive index can be obtained.
- the refractive index of an organic component can be increased more in tuna feces.
- the content is 60% by weight or more, a problem occurs in that the photosensitivity is reduced. Therefore, the total content of the sulfur atom and the naphthalene ring is preferably in the range of 10 to 60% by weight.
- a method for introducing a sulfur atom, a bromine atom and a naphthalene ring into an organic component it is effective to use a compound having a sulfur atom and a naphthalene ring in a photosensitive monomer or a binder.
- the monomer having a sulfur atom in the molecule ⁇ include a compound represented by the following general formula (a), (b) or (c).
- R in the structural formula represents a hydrogen atom or a methyl group.
- the sensitizer one having absorption at the exposure wavelength is used.
- the organic component can be added by adding a large amount of the sensitizer.
- the sensitizer may be added in an amount of 0.5 to 10% by weight in the paste. More preferably, it is 1 to 6% by weight.
- Photosensitive pastes are usually prepared by mixing various components such as inorganic fine particles, ultraviolet absorbers, photosensitive polymers, photosensitive monomers, photopolymerization initiators, glass frit and solvents so that they have the specified composition. It is made by mixing and dispersing homogeneously with three rollers and a kneader.
- the viscosity of the paste is appropriately adjusted depending on the proportion of inorganic fine particles, thickener, organic solvent, plasticizer, suspending agent, etc., but the range is from 200 to 200,000 cps (cm ).
- the thickness is preferably from 200 to 500 cps.
- the thickness is preferably 50,000 to 200,000 cps.
- 100 to 20000 cps is preferable.
- a photosensitive base is applied entirely or partially on a glass substrate, a ceramic substrate, or a polymer film.
- Application methods include screen printing, bar Common methods such as a coater, a mouthcoater, a die coater, and a blade coater can be used.
- the coating thickness can be adjusted by selecting the number of coatings, the gap of the coater, the mesh of the screen, and the viscosity of the paste.
- the surface of the substrate can be subjected to a surface treatment in order to enhance the adhesion between the substrate and the coating film.
- the surface treatment liquid include silane coupling agents such as vinyl trichlorosilane, vinyl trimethoxy silane, vinyl triethoxy silane, tris (2-methoxyethoxy) vinyl silane, argysidoxypropyl trimethoxy silane, and 7- (methacryloxypropyl).
- a silane coupling agent or an organic metal diluted with an organic solvent such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl alcohol, ethyl alcohol, propyl alcohol, butyl alcohol, etc. to a concentration of 0.1 to 5%. Used.
- the surface treatment liquid can be applied uniformly on a substrate with a spinner or the like, and then dried at 80 to 140 ° C for 10 to 60 minutes to perform surface treatment.
- the film when applied on a film, the film is dried on the film and then subjected to the next exposure step, or the method is performed after the film is pasted on a glass or ceramic substrate and the exposure step is performed.
- a photosensitive material used for a circuit material or a display can be obtained.
- a photosensitive paste layer having a uniform thickness can be formed.
- Exposure is generally performed by a mask exposure using a photomask, as in the case of ordinary photolithography. Depending on the type of the photosensitive organic component, either a negative type or a positive type is selected as the mask to be used.
- a method of drawing directly with a red or blue visible laser beam, an Ar ion laser or the like without using a photomask may be used.
- a stepper exposure device As the exposure device, a stepper exposure device, a proximity exposure device, or the like can be used. When exposing a large area, apply a photosensitive paste on a substrate such as a glass substrate. Later, by carrying out exposure while transporting, a large area can be exposed with an exposure machine with a small exposure area.
- the active light source used in this case includes, for example, visible light, near-ultraviolet light, ultraviolet light, electron beam, X-ray, laser light, etc. Among them, ultraviolet light is preferable.
- high pressure mercury lamp, ultra-high pressure mercury lamp, a halogen lamp, etc. germicidal lamp is suitable ultra-high pressure mercury lamp c of these usable.
- Exposure conditions vary depending on the coating thickness, but exposure is performed for 0.5 to 30 minutes using an ultrahigh pressure mercury lamp having an output of 1 to 100 mW / cm 2 .
- the oxygen shielding film include films such as PVA and cellulose, and films such as polyester.
- the PVA film is formed by uniformly applying an aqueous solution having a concentration of 0.5 to 5% by weight on a substrate using a spinner or the like, and then drying it at 70 to 90 ° C for 10 to 60 minutes. Perform by evaporating the water. Also, it is preferable to add a small amount of alcohol to the aqueous solution, since the coatability with the insulating film is improved and the evaporation is facilitated. A more preferred solution concentration of PVA is 1-3% by weight. Within this range, the sensitivity is further improved. The reason why the sensitivity is improved by the application of PVA is presumed to be as follows.
- an organic solvent capable of dissolving the organic components in the photosensitive paste can be used.
- water may be added to the organic solvent as long as its solubility is not lost.
- a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, it can be developed with an aqueous alkaline solution.
- an aqueous alkaline solution metallic hydroxide such as sodium hydroxide sodium carbonate, calcium hydroxide aqueous solution, etc.
- an aqueous solution can be used, it is preferable to use an organic aqueous solution because it is easy to remove the alkaline component during firing.
- organic alkali can be used as the organic alkali.
- examples include tramethylammonium hydroxide, trimethylbenzylammonium hydroxide D-xide, monoethanolamine, diethanolamine and the like.
- concentration of the aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the soluble portion is not removed, and if the alkali concentration is too high, the pattern portion may be peeled off and the non-soluble portion may be corroded, which is not preferable.
- the development temperature at the time of development is preferably from 20 to 50 ° C. from the viewpoint of process control.
- firing is performed in a firing furnace.
- the firing atmosphere and temperature vary depending on the type of paste or substrate, but firing is performed in an atmosphere such as air, nitrogen, or hydrogen.
- As the firing furnace a batch type firing furnace or a belt type continuous firing furnace can be used.
- the firing is performed at a temperature of 400-100 ° C.
- baking is performed at a temperature of 52 to 61 ° C. for 10 to 60 minutes.
- a heating step of 50 to 300 ° C. may be introduced for the purpose of drying and preliminary reaction during each of the coating, exposure, development and baking steps.
- the glass substrate having the partition layer obtained by the above steps can be used on the front side or the back side of the plasma display. Further, it can be used as a substrate for discharging an address portion of a plasma address liquid crystal display.
- the glass substrates on the front and rear surfaces are aligned and sealed, and a rare gas such as helium, neon, or xenon is sealed therein, whereby a panel portion of the plasma display can be manufactured.
- a rare gas such as helium, neon, or xenon
- a plasma display can be manufactured by mounting the driving driver Ic.
- the inventors have found that the width of the partition wall can be reduced by using the technique of the present invention.
- high-definition partition walls with a height of 100 to 170 m and a pitch of 100 to 160 m, a high-definition plasma display that can be used for high-definition televisions and computer monitors is realized. Can be provided.
- a photosensitive paste including inorganic fine particles and an organic component was prepared.
- the preparation procedure was as follows. First, each of the organic components and 7-butyrolactone were dissolved while being heated to 80 ° C., and then inorganic fine particles were added and kneaded with a kneader to prepare a paste. The viscosity was adjusted by adjusting the amount of the solvent. The amount of the solvent (7-butyl lactone) was adjusted to be 10 to 40% in the paste.
- the coating thickness is adjusted to 100 m, 150 / zm, and 200 m by multiple applications by screen printing. After the application, it was dried at 80 ° C. for 30 minutes.
- the obtained glass substrate was dried at 80 ° C. for 1 hour, it was baked at a maximum temperature of 560 ° C. or 850 ° C. (a maximum temperature holding time of 30 minutes).
- the refractive index of the organic component was adjusted for only the organic component in the paste, and after coating and drying, measurement was performed on the light with a wavelength of 436 nm at 25 by the ellipsometry method.
- the refractive index of the organic component was adjusted for only the organic component in the paste, and after coating and drying, measurement was performed on the light with a wavelength of 436 nm at 25 by the ellipsometry method.
- a paste was prepared using 75 g of the glass powder A1 in Table 1 and 2 ⁇ g of the organic component of B3.
- the solvent used was 10 g.
- Table 3 shows the results of pattern formation and firing at 560 ° C for 30 minutes.
- a photosensitive silver paste was used on a soda glass substrate (360 mm x 500 mm) (thickness: 2.8 mm) to obtain a line width of 40 ⁇ m, a pitch of 150 m, and a thickness of 10 m.
- the above paste is used to coat the entire surface with a thickness of 200 m, pitch: 150; tim, line width: 20 jum, number of lines: 3
- a photomask having a line length of 80 mm and a line length of 350 mm after exposure, development and baking were performed to form a partition layer.
- baking was performed at 450 ° C. for 20 minutes to produce a back plate of a 23-inch plasma display. By attaching this back plate to the front plate and enclosing the gas, a 23-inch XGA (1024 x 768 pixel) monitor can be manufactured.
- a paste was prepared using 75 g of the glass powder A2 in Table 1 and 25 g of the organic component of B3. The solvent used was 15 g.
- Table 3 shows the results of pattern formation and firing at 560 ° C for 10 minutes.
- a paste was prepared using 70 g of the glass powder A3 in Table 1 and 30 g of the organic component of B4. The solvent used was 15 g.
- Table 3 shows the results of pattern formation and firing at 560 ° C for 10 minutes.
- a paste was prepared using 80 g of the glass powder of A4 in Table 1 and 20 g of the organic component of B4.
- the solvent used was 7 g.
- Table 3 shows the results of pattern formation and firing at 580 ° C for 15 minutes.
- a paste was prepared using 80 g of the glass powder A4 in Table 1 and 20 g of the organic component of B2.
- the solvent used was 11 g.
- Table 3 shows the results of pattern formation and firing at 580 ° C for 15 minutes.
- Table 3 shows the results of pattern formation and firing at 580 ° C for 15 minutes.
- a paste was prepared using 75 g of the glass powder A6 in Table 1 and 25 g of the organic component of B3 (the solvent used was 10 g).
- Table 3 shows the results of pattern formation and firing at 850 ° C for 15 minutes.
- Table 3 shows the results of pattern formation and firing at 580 ° C for 30 minutes.
- An organic component 2 5 g of glass in Table 1 A 3 powder 7 5 g and B 2, the solvent was c used to prepare a paste was 1 0 g.
- Table 3 shows the results of pattern formation and firing at 560 ° C for 10 minutes.
- An organic component 2 5 g of table glass powder 7 of the first A 4 5 g and B 4, the solvent was c used to prepare a paste was 1 0 g.
- Table 3 shows the results of pattern formation and firing at 580 ° C for 15 minutes.
- Table 1 Composition of glass fine particles used Component Al A2 A3 ⁇ 4 ⁇ 5 ⁇ 6
- TMP TA Trimethylolpropane Triacrylate
- TBPMA Tribromophenyl methacrylate
- the photosensitive paste of the present invention enables high-accuracy pattern processing with a high aspect ratio. This makes it possible to process thick films and high-precision patterns of display and circuit materials, etc., thereby improving the definition and simplifying the process.
- a high-definition plasma display panel can be easily manufactured.
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Glass Compositions (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Materials For Photolithography (AREA)
Description
Claims
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP96917656A EP0775940B2 (en) | 1995-06-12 | 1996-06-12 | Use of a photosensitive paste, method of producing a plasma display and plasma display obtainable thereby |
| DE69607569T DE69607569T3 (de) | 1995-06-12 | 1996-06-12 | Benutzung einer fotoempfindlichen paste, verfahren zur herstellung einer plasmaanzeigetafel, sowie plasmaanzeigetafel, welche nach diesem verfahren herstellbar ist |
| US08/776,878 US6197480B1 (en) | 1995-06-12 | 1996-06-12 | Photosensitive paste, a plasma display, and a method for the production thereof |
| CA002197331A CA2197331C (en) | 1995-06-12 | 1996-06-12 | A photosensitive paste, a plasma display, and a method for the production thereof |
| ES96917656T ES2146884T5 (es) | 1995-06-12 | 1996-06-12 | Pasta fotosensible, visualizador a base de plasma y procedimientos para su fabricacion. |
| CNB2005100849546A CN100474491C (zh) | 1995-06-12 | 1996-06-12 | 等离子体显示器 |
Applications Claiming Priority (16)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14477195 | 1995-06-12 | ||
| JP7/144771 | 1995-06-12 | ||
| JP26452995A JPH09110466A (ja) | 1995-10-12 | 1995-10-12 | 感光性絶縁ガラスペースト |
| JP7/264529 | 1995-10-12 | ||
| JP7/321793 | 1995-12-11 | ||
| JP7/321794 | 1995-12-11 | ||
| JP32179495A JP3716469B2 (ja) | 1995-06-12 | 1995-12-11 | パターン加工用感光性ペースト |
| JP7/321795 | 1995-12-11 | ||
| JP32179595 | 1995-12-11 | ||
| JP32179395 | 1995-12-11 | ||
| JP8/61047 | 1996-03-18 | ||
| JP6104896 | 1996-03-18 | ||
| JP8/61046 | 1996-03-18 | ||
| JP6104696 | 1996-03-18 | ||
| JP8/61048 | 1996-03-18 | ||
| JP06104796A JP3567591B2 (ja) | 1995-06-12 | 1996-03-18 | プラズマディスプレイの製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/448,468 Division US6507148B1 (en) | 1995-06-12 | 1999-11-24 | Photosensitive paste, a plasma display and a method for the production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1996042035A1 true WO1996042035A1 (en) | 1996-12-27 |
Family
ID=27572531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1996/001596 Ceased WO1996042035A1 (en) | 1995-06-12 | 1996-06-12 | Photosensitive paste, plasma display, and process for the production thereof |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0775940B2 (ja) |
| CN (3) | CN1238765C (ja) |
| CA (1) | CA2197331C (ja) |
| DE (1) | DE69607569T3 (ja) |
| ES (1) | ES2146884T5 (ja) |
| WO (1) | WO1996042035A1 (ja) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000284472A (ja) * | 1999-01-27 | 2000-10-13 | Murata Mfg Co Ltd | 感光性絶縁体ペースト及び厚膜多層回路基板 |
| JP3651298B2 (ja) * | 1999-02-17 | 2005-05-25 | 株式会社村田製作所 | 感光性絶縁体ペースト及び厚膜多層回路基板 |
| TW522435B (en) | 2000-05-23 | 2003-03-01 | Toray Industries | Slurry, display component and process for producing the display component |
| JP4043782B2 (ja) * | 2001-12-27 | 2008-02-06 | 東京応化工業株式会社 | プラズマディスプレイパネルの誘電体用組成物、誘電体用積層体、及び誘電体の形成方法 |
| CN1448792A (zh) * | 2002-03-29 | 2003-10-15 | 住友化学工业株式会社 | 光敏膏 |
| JP4211782B2 (ja) | 2003-11-25 | 2009-01-21 | 株式会社村田製作所 | 厚膜パターンの形成方法、電子部品の製造方法 |
| JP4271048B2 (ja) * | 2004-01-28 | 2009-06-03 | 東京応化工業株式会社 | 感光性無機ペースト組成物、これを用いたプラズマディスプレイ前面板製造用シート状未焼成体、および、プラズマディスプレイ前面板の製造方法 |
| JP3938919B2 (ja) * | 2004-02-27 | 2007-06-27 | 東京応化工業株式会社 | 無機ペースト組成物、無機ペースト組成物の製造方法、および、ディスプレイパネル製造用シート状未焼成体 |
| JPWO2006004158A1 (ja) | 2004-07-07 | 2008-04-24 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性樹脂組成物とそれを用いたドライフィルム、及びその硬化物 |
| KR101190921B1 (ko) * | 2004-07-22 | 2012-10-12 | 도레이 카부시키가이샤 | 감광성 페이스트 및 디스플레이 패널용 부재의 제조 방법 |
| JP4215700B2 (ja) * | 2004-10-06 | 2009-01-28 | 東京応化工業株式会社 | プラズマディスプレイパネル用の前面板及び背面板 |
| CN101246315B (zh) * | 2007-02-16 | 2011-05-11 | 明德国际仓储贸易(上海)有限公司 | 光阻剂清洗液组成物及其应用 |
| JP5104852B2 (ja) * | 2007-03-26 | 2012-12-19 | 株式会社村田製作所 | 感光性誘電体ペーストおよびそれを用いた電子部品 |
| CN101226332B (zh) * | 2007-12-26 | 2011-02-16 | 彩虹集团公司 | 一种障壁浆料的制备方法 |
| WO2016017190A1 (ja) * | 2014-07-31 | 2016-02-04 | Jsr株式会社 | 表示素子、感光性組成物およびエレクトロウェッティングディスプレイ |
| CN104614939A (zh) * | 2015-01-09 | 2015-05-13 | 苏州瑞红电子化学品有限公司 | 一种用于gpp工艺中混合玻璃粉用负性光刻胶组合物 |
| CN116514402B (zh) * | 2023-05-06 | 2024-09-27 | 乾宇微纳技术(深圳)有限公司 | 一种应用于负型厚膜光刻浆料的玻璃粉及其制备方法 |
| CN119285240A (zh) * | 2024-12-10 | 2025-01-10 | 江苏日御光伏新材料股份有限公司 | 一种TOPCon电池正面银浆用耐醋酸玻璃粉 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS609124A (ja) * | 1983-06-29 | 1985-01-18 | Hitachi Ltd | パタ−ン形成方法 |
| JPH02223132A (ja) * | 1989-02-22 | 1990-09-05 | Narumi China Corp | プラズマディスプレイパネルとそのパネル用障壁の形成方法 |
| JPH04240854A (ja) * | 1991-01-25 | 1992-08-28 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4192795A (en) * | 1977-09-29 | 1980-03-11 | Sybron Corporation | Barium aluminum silicate filler for U.V. curable composites |
| US4503169A (en) * | 1984-04-19 | 1985-03-05 | Minnesota Mining And Manufacturing Company | Radiopaque, low visual opacity dental composites containing non-vitreous microparticles |
| US4613560A (en) † | 1984-12-28 | 1986-09-23 | E. I. Du Pont De Nemours And Company | Photosensitive ceramic coating composition |
| FI96725C (fi) * | 1986-02-21 | 1996-08-12 | Zenith Electronics Corp | Katodisädeputken etuosayhdistelmä |
| US5260163A (en) * | 1992-05-07 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Photoenhanced diffusion patterning for organic polymer films |
| JP3668978B2 (ja) † | 1993-07-29 | 2005-07-06 | 東レ株式会社 | 感光性絶縁ペースト |
-
1996
- 1996-06-12 CA CA002197331A patent/CA2197331C/en not_active Expired - Lifetime
- 1996-06-12 CN CN 03145058 patent/CN1238765C/zh not_active Expired - Lifetime
- 1996-06-12 ES ES96917656T patent/ES2146884T5/es not_active Expired - Lifetime
- 1996-06-12 DE DE69607569T patent/DE69607569T3/de not_active Expired - Lifetime
- 1996-06-12 WO PCT/JP1996/001596 patent/WO1996042035A1/ja not_active Ceased
- 1996-06-12 CN CN 96190607 patent/CN1119701C/zh not_active Expired - Lifetime
- 1996-06-12 CN CNB2005100849546A patent/CN100474491C/zh not_active Expired - Fee Related
- 1996-06-12 EP EP96917656A patent/EP0775940B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS609124A (ja) * | 1983-06-29 | 1985-01-18 | Hitachi Ltd | パタ−ン形成方法 |
| JPH02223132A (ja) * | 1989-02-22 | 1990-09-05 | Narumi China Corp | プラズマディスプレイパネルとそのパネル用障壁の形成方法 |
| JPH04240854A (ja) * | 1991-01-25 | 1992-08-28 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP0775940A4 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2197331C (en) | 2007-02-27 |
| ES2146884T3 (es) | 2000-08-16 |
| CN100474491C (zh) | 2009-04-01 |
| ES2146884T5 (es) | 2004-09-01 |
| EP0775940B2 (en) | 2004-01-02 |
| CN1707735A (zh) | 2005-12-14 |
| DE69607569T3 (de) | 2004-11-04 |
| EP0775940A4 (en) | 1998-03-04 |
| CA2197331A1 (en) | 1996-12-27 |
| CN1157042A (zh) | 1997-08-13 |
| CN1515962A (zh) | 2004-07-28 |
| DE69607569D1 (de) | 2000-05-11 |
| CN1119701C (zh) | 2003-08-27 |
| EP0775940B1 (en) | 2000-04-05 |
| CN1238765C (zh) | 2006-01-25 |
| DE69607569T2 (de) | 2000-11-02 |
| EP0775940A1 (en) | 1997-05-28 |
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