WO2000051075A1 - Carte a circuit integre et plaque terminale pour carte a circuit integre - Google Patents

Carte a circuit integre et plaque terminale pour carte a circuit integre Download PDF

Info

Publication number
WO2000051075A1
WO2000051075A1 PCT/JP2000/001083 JP0001083W WO0051075A1 WO 2000051075 A1 WO2000051075 A1 WO 2000051075A1 JP 0001083 W JP0001083 W JP 0001083W WO 0051075 A1 WO0051075 A1 WO 0051075A1
Authority
WO
WIPO (PCT)
Prior art keywords
card
terminal
terminal plate
nickel
stainless steel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2000/001083
Other languages
English (en)
Japanese (ja)
Inventor
Shinji Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of WO2000051075A1 publication Critical patent/WO2000051075A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to an IC card, and more particularly to a terminal board for external devices to access the IC. More specifically, the present invention relates to a terminal board for an IC card which has improved bonding properties for connection with the IC, and an IC card using the same.
  • a conventional IC card is configured using a printed wiring board 100 for an IC card having the structure illustrated in FIG.
  • the printed wiring board 100 for IC cards shown in Fig. 3 is basically a substrate with a stainless steel foil 102 attached on one side of the glass epoxy base material 101 and a copper foil 103 attached on the other side. It is configured. A recess 104 is formed in a part of the surface of the copper foil 103 (the lower side in Fig. 3), and the IC 105 is stored therein.
  • the surface of copper foil 103 is coated with nickel-gold plating 106.
  • the nickel-gold plating surface 106 is connected to the IC 105 by a force bonding wire 107.
  • a through hole 108 penetrating the front and back is formed in Galepo ## 101.
  • the through-holes 108 are filled with the conductive paste 109, thereby establishing electrical continuity between the stainless steel foil 102 and the copper foil 103.
  • the lower end of the through hole 108 in FIG. 3 is sealed with the conductive paste 109 by the overcoat agent 110.
  • the printed circuit board for IC card 100 in Fig. 3 is made into an IC card by bonding a card 3 ⁇ 4W such as a PVC board to the lower side of the state shown in Fig. 3. In that state, the external device can access the IC 105 via the stainless steel foil 102 to read and write data. In other words, the stainless steel foil 102 is an external connection terminal for accessing the IC 105 from outside.
  • the IC card using the IC card printed wiring board 100 shown in FIG. 3 described above had a problem that the manufacturing process was complicated. This is because the printed wiring board for IC cards has a complicated structure in which through-holes 108 are formed in the glass epoxy substrate 101. In order to form this through hole 108, processes such as drilling, filling with paste, and sealing were required.
  • the stainless steel foil 102 which is the external connection terminal, frequently comes into contact with the terminal of the external TO, so that it must have appropriate strength and corrosion resistance in the atmosphere.
  • stainless steel is used as the material.
  • the corrosion resistance of stainless steel is due to the passivation of a thin but stable oxide formed on the surface. For this reason, the passivation film hinders the adhesion.
  • the connection with the bonding wire 107 is made not on the stainless steel foil 102 but on the nickel-gold plated surface 106 of the copper foil 103 and the stainless steel foil. It is necessary to have a through hole 108 for conducting the conduction between 102 and the copper foil 103.
  • the present invention has been made to solve the above-mentioned problems of the conventional technology.
  • the challenge is to provide a terminal board for IC cards that not only has the corrosion resistance in the air, which is necessary to frequently communicate with external terminals, but also has excellent bonding properties that allow direct connection of bonding wires.
  • this is to simplify the structure and manufacturing process of the IC card.
  • An IC card terminal plate made to solve this problem is a plate material having a bonding surface for connection to an IC and an external terminal surface for external connection.
  • the main material is a conductive plate material that forms a passivation film on the surface in air, and the conductive film is formed on one surface of a main material that does not form a passivation film on the surface in air.
  • the other surface of the main material is the external terminal surface.
  • the external terminal surface is the main material itself and is covered with a passive film. Therefore, it is extremely stable in the air, and there is no problem in contact with external equipment.
  • the bonding surface the main material does not come into direct contact with the atmosphere. Therefore, the bonding surface is not covered with the passivation film, and the wire for connection with the IC can be easily bonded. Can be In this way, one surface is the external terminal surface and the other surface can be directly wire-bonded. For this reason, the use of this IC card terminal plate makes it possible to realize an IC card with a simple structure, and the manufacturing process is simple.
  • the conductive film forming the bonding surface is in direct contact with the material constituting the main material without interposing a passivation film between the material and the main material. If a passivation film of the main material is interposed between them, the adhesion of the conductive film is poor and the conductive film is easily peeled off. Another reason is that the electrical resistance between the conductive film and the main material increases. Therefore, when forming the conductive film, a process that removes the passivation film of the main material and forms the conductive film without forming the passivation film again should be used.
  • a material suitable for use as a main material includes stainless steel.
  • gold plating or nickel plating is suitable for use as the conductive film.
  • the plating may be a multilayer plating of gold and nickel or an alloy plating.
  • a plating layer can be formed on the surface of a stainless steel sheet without interposing a passivation film.
  • an IC card includes a terminal plate formed of stainless steel and having one surface plated with gold or nickel, an IC, and an IC card attached to one surface of the terminal plate.
  • the terminal board, the base material holding the IC and the wire, and the other side of the terminal board is exposed to the outside to form an external terminal surface for contact with the external TO. It is something.
  • wires for connection to the IC are directly connected to the back surface (one surface) of the terminal plate, one surface of which (the other surface) forms the external terminal surface. For this reason, the structure is simple and it can be manufactured by a simple manufacturing process.
  • FIG. 1 is a cross-sectional view showing the structure of the IC card according to the embodiment
  • FIG. 2 is a process diagram showing a plating procedure on the back surface of the terminal board.
  • FIG. 3 is a cross-sectional view showing the structure of a conventional IC card. BEST MODE FOR CARRYING OUT THE INVENTION
  • This embodiment is an IC card using a stainless steel plate plated on one side as a terminal plate.
  • the IC card 1 according to the present embodiment has a structure shown in the cross-sectional view of FIG.
  • the IC card 1 shown in FIG. 1 is configured around the IC 10.
  • the IC card 1 has this strength, the terminal plate 11 holding the IC 10 and the glass epoxy substrate 12, the bonding wire 14 connecting the IC 10 and the terminal plate 11, and occupies most of the external appearance. It has a card base material 20 and a cover film 21.
  • the terminal plate 11 is a thin plate made of stainless steel, and one surface (lower surface in Fig. 1) 11A is coated with nickel-gold plating described later. However, the opposite surface 11 B is an unplated bare surface.
  • the terminal plate 11 serves as an external connection terminal for external devices to access the IC 10, so that the surface 11 B is exposed to the outside and appropriately patterned. Have been.
  • the glass epoxy S # l 2 in the state of Fig. 1 is bonded to the terminal plate 11.
  • a hole 12A for accommodating IC10 and a hole 12B for bonding wire 14 are formed.
  • One end of the bonding wire 14 is attached to the pin of the IC 10, and the other end is directly connected to the nickel-plated surface 11 A of the terminal plate 11 through the hole 12 B of the glass epoxy substrate 12. ⁇ is attached.
  • IC card 1 The entire back surface of IC card 1 (the lower side in Fig. 1) is covered with force base material 20.
  • the front side of the IC card 1 (upper side in Fig. 1) is covered with a cover film 21 except for the portion occupied by the terminal board 11.
  • the IC 10 and the bonding wires 14 are sealed with a sealing resin 15.
  • Such an IC card 1 is generally manufactured by the following procedure. First, a hole 12A and a hole 12B are formed in a glass epoxy substrate 12 with a single-sided adhesive. At this time, the holes 12B through which the bonding wires 14 pass must be through holes.
  • the hole 12 A for accommodating I C 10 is a through hole in Fig. 1, but may be a bottomed hole. When using a hole with a bottom, process from the non-adhesive side. In this case, it is not necessary to use a glass epoxy substrate 12 to which a conductive foil such as copper foil is adhered.
  • this glass epoxy substrate 12 has a terminal plate 1 1 A with nickel-gold plating on one side 11 A.
  • the nickel-gold plating surface 11A of the terminal plate 11 and the adhesive surface of the glass epoxy base material 12 should face each other.
  • the terminal plate 11 is subjected to pattern etching.
  • the IC 10 is stored and fixed in the hole 12A.
  • the IC 10 and the terminal plate 11 are connected by the bonding wire 14.
  • one end of the bonding wire 14 is directly attached to the nickel-plated surface 11A of the terminal plate 11 through the hole 12B of the glass epoxy S # 12. Therefore, complicated work such as forming a plating film on the inner surface or filling with conductive paste is not required for the hole 12B.
  • the IC 10 and the bonding wires 14 are assembled with the card base material 20 and the cover film 21 while being sealed with the sealing resin 15.
  • an IC card 1 is manufactured.
  • the nickel-gold plated surface 11A of the stainless steel plate with single plating (hereinafter referred to as “sample”), which is the terminal plate 11, is directly connected to the surface of the material stainless steel without intervening passivation 3 ⁇ 4.
  • This plating is performed according to the procedure shown in Fig. 2.
  • solvent degreasing is performed (# 1). This can be achieved by immersing the sample in an organic solvent such as acetone or alcohols, and performing ordinary solvent degreasing by vibrating with an ultrasonic shaker.
  • force sword electrolytic cleaning is performed (# 2). That is, the sample is immersed in an alkaline bath and energized so that the sample becomes a force source.
  • a 10% aqueous solution of sodium hydroxide and a 10% aqueous solution of sodium phosphate may be used as an alkaline bath and energized at a current density of 100 mAZcm 2 for 2 minutes.
  • This solvent degreasing and force sword electrolytic cleaning completely removes oils and fats adhering to the sample surface. After this, wash thoroughly with distilled water.
  • pickling is performed (# 3). That is, the oxide (passive film) on the surface of the sample is removed with an acid. For example, soak the sample in 50% hydrochloric acid for 10 seconds and wash thoroughly with distilled water. This dissolves and removes the passive film.
  • nickel strike plating is performed (# 4). A so-called wood bath of nickel chloride hexahydrate 100 gZL and hydrochloric acid 18 OmLZL can be used as the plating solution. With this plating solution, a current of 20 mA / cm 2 for about 30 seconds may be applied. By this strike plating, a thin Nigel film is formed before the passivation film is regenerated, and the adhesion of the plating film formed later is ensured.
  • main nickel plating is performed (# 5).
  • a so-called Watt bath of nickel sulfate 150 g / L, nickel chloride 5 g ZL, and boric acid 10 g / L can be used as the plating solution.
  • a current of 2.5 mA / cm 2 for about 5 minutes may be applied to this plating solution. This allows the primary nickel A plating layer is formed. After this, wash thoroughly with distilled water.
  • gold plating is performed (# 6).
  • a gold citrate plating bath of 20 g / L of potassium gold cyanide, 75 g / L of ammonium citrate, and pH 6 can be used.
  • this plating solution it is only necessary to apply 2.5 mA / cm 2 for about 38 minutes while keeping the bath temperature at 25 to 30 ° C.
  • a plating layer is formed.
  • finish in the order of still water washing, running water washing, distilled water washing, and drying finish in the order of still water washing, running water washing, distilled water washing, and drying.
  • the nickel-gold plating layer 11 ⁇ directly on the surface of the stainless steel sheet without interposing a passivation film.
  • the terminal board 11 has a firmly adhered layer on one side. Therefore, in the terminal board 11, the adhesion of the nickel-gold plating layer 11A is good. In addition, since no passivation film is formed on the surface of the nickel-gold plating layer 11A, the bonding wire 14 has good ironability.
  • the opposite surface 11 B of the terminal plate 11 is a surface of ordinary stainless steel, so it has excellent corrosion resistance in the air and wear resistance to withstand repeated use of external equipment terminals. have.
  • a more dense coating film can be obtained by using a pulse current that repeatedly turns on and off the current at the time of # 5 main nickel plating and # 6 gold plating.
  • the terminal plate 11 is obtained by forming the nickel-gold plating layer 11A on one surface of a stainless steel sheet without interposing a passivation film.
  • the terminal plate 11 is realized, in which the unplated surface 11B has the corrosion resistance and wear resistance of ordinary stainless steel, and the back surface 11A can be directly wire-bonded.
  • a wire bonding layer such as copper foil can be prepared on the back surface of the glass epoxy substrate 12 (the lower surface in Fig. 1), and the holes 12B can be specially formed.
  • the IC card 1 can be obtained without having to use a through hole in the process. As a result, an IC card 1 with a simple structure and manufacturing process that can be manufactured at low cost has been realized.
  • the present invention can be variously improved and modified without departing from the gist thereof.
  • the nickel-gold plating layer 11A only needs to be formed directly on the stainless steel sheet without any intervening passivation film. There may be. Also, it is not essential to have two layers of nickel and gold, and it is only necessary to ensure a surface condition that facilitates the connection when connecting to the IC.
  • a means for ironing a bonding wire to an IC or a terminal plate is employed.
  • a means for welding the bonding wire itself that is, a so-called wire bonding is also possible.
  • one surface has the corrosion resistance in the air necessary for frequent contact with external terminals, and the other surface directly connects the bonding wire.
  • IC card terminal boards have been provided that have excellent electrical connection reliability and easiness as much as possible. This simplifies the structure and manufacturing process of the IC card.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

L'invention se rapporte à une plaque terminale pour cartes à circuit, qui comporte une surface terminale externe dotée d'une certaine résistance à la corrosion dans l'air, nécessaire pour un contact fréquent avec une borne de dispositif externe et une surface pour la soudure présentant une fiabilité d'un niveau si élevé et une facilité de connexion à un circuit électrique si grande qu'un fil peut y être directement brasé. L'invention vise également à simplifier la structure d'une carte à circuit intégré et son processus de production. Dans ce but, on produit une plaque terminale en formant une couche de placage en nickel-or directement sur une face d'une feuille en acier inoxydable sans interposer de film de passivation. La face non plaquée de cette plaque terminale constitue une surface terminale externe d'une carte à circuit intégré, et la surface plaquée en nickel-or qui se trouve sur l'arrière de la plaque terminale constitue une surface de microcâblage permettant le raccordement au circuit intégré.
PCT/JP2000/001083 1999-02-26 2000-02-24 Carte a circuit integre et plaque terminale pour carte a circuit integre Ceased WO2000051075A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11049635A JP2000251043A (ja) 1999-02-26 1999-02-26 Ｉｃカードおよびｉｃカード用端子板
JP11/49635 1999-02-26

Publications (1)

Publication Number Publication Date
WO2000051075A1 true WO2000051075A1 (fr) 2000-08-31

Family

ID=12836686

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/001083 Ceased WO2000051075A1 (fr) 1999-02-26 2000-02-24 Carte a circuit integre et plaque terminale pour carte a circuit integre

Country Status (2)

Country Link
JP (1) JP2000251043A (fr)
WO (1) WO2000051075A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3670175A1 (fr) * 2018-12-18 2020-06-24 Heraeus Deutschland GmbH & Co KG Substrat et procédé de fabrication d'un substrat

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473689B (zh) * 2009-08-20 2014-09-17 日本电气株式会社 具有彼此绝缘电源侧和接地侧金属加固部件的半导体器件
DE102015102453A1 (de) 2015-02-20 2016-08-25 Heraeus Deutschland GmbH & Co. KG Bandförmiges Substrat zur Herstellung von Chipkartenmodulen, Chipkartenmodul, elektronische Einrichtung mit einem derartigen Chipkartenmodul und Verfahren zur Herstellung eines Substrates

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135790A (ja) * 1988-11-16 1990-05-24 Ibiden Co Ltd Ｉｃカード用プリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135790A (ja) * 1988-11-16 1990-05-24 Ibiden Co Ltd Ｉｃカード用プリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3670175A1 (fr) * 2018-12-18 2020-06-24 Heraeus Deutschland GmbH & Co KG Substrat et procédé de fabrication d'un substrat

Also Published As

Publication number Publication date
JP2000251043A (ja) 2000-09-14

Similar Documents

Publication Publication Date Title
TWI246753B (en) Package substrate for electrolytic leadless plating and manufacturing method thereof
CN101790903B (zh) 多层印刷线路板以及多层印刷线路板的制造方法
US5173844A (en) Integrated circuit device having a metal substrate
JP2006278774A (ja) 両面配線基板の製造方法、両面配線基板、およびそのベース基板
JPH11330295A (ja) 集積回路アッセンブリおよび集積回路アッセンブリを形成する方法
JP4674120B2 (ja) 配線基板およびその製造方法
KR20050033821A (ko) 반도체장치 및 그 제조 방법
JP4155434B2 (ja) 部分電解メッキ処理されたパッドを有する半導体パッケージ用基板の製造法
JP4129665B2 (ja) 半導体パッケージ用基板の製造方法
CN100481403C (zh) 电子装置用基板及其制造方法以及电子装置制造方法
JP2002198461A (ja) プラスチックパッケージ及びその製造方法
JP2000251043A (ja) Ｉｃカードおよびｉｃカード用端子板
JP4386763B2 (ja) 半導体装置
JP2000252380A (ja) はんだ接続用パッドおよびそのはんだ接続用パッドを用いた半導体搭載用基板
JP4780857B2 (ja) 配線基板の製造方法
JPH02120093A (ja) Ｉｃカード用プリント配線板とその製造方法
JP4113087B2 (ja) 積層メッキの製造方法、及び接続装置の製造方法
JP3465014B2 (ja) パッケージ介挿基板及びその製造方法
JPH07297524A (ja) Ｉｃカード用プリント配線板
JPH1074859A (ja) Ｑｆｎ半導体パッケージ
JP4184540B2 (ja) 配線基板とその製造方法
JP2000216201A (ja) 半導体装置用テ―プキャリア
JPH09331009A (ja) リードフレームとリードフレーム部材、およびこれらを用いた樹脂封止型半導体装置
JP2003023236A (ja) 配線板およびその製造方法
JP2008028069A (ja) 外部接合電極付き基板およびその製造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase