WO2009132005A3 - Appareil et procedes d’utilisation d’une cassette a ruban de polissage - Google Patents

Appareil et procedes d’utilisation d’une cassette a ruban de polissage Download PDF

Info

Publication number
WO2009132005A3
WO2009132005A3 PCT/US2009/041256 US2009041256W WO2009132005A3 WO 2009132005 A3 WO2009132005 A3 WO 2009132005A3 US 2009041256 W US2009041256 W US 2009041256W WO 2009132005 A3 WO2009132005 A3 WO 2009132005A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing tape
methods
tape cassette
head portion
guide walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/041256
Other languages
English (en)
Other versions
WO2009132005A2 (fr
Inventor
Antoine P. Manens
Gary C. Ettinger
Paul D. Butterfield
Shou-Sung Chang
Ricardo Martinez
Eashwer Kollata
Robert A. Ewald
Kuldip Sumbria
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2009132005A2 publication Critical patent/WO2009132005A2/fr
Publication of WO2009132005A3 publication Critical patent/WO2009132005A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

L’invention concerne des procédés et un appareil destiné à contenir un ruban de polissage conçu pour polir un substrat. L’appareil selon l’invention comprend : une cassette constituée d’une partie corps et d’une partie tête, la partie tête comprenant une paire de parois de guidage ; et au moins un rouleau d’acheminement disposé entre les parois de guidage dans la partie tête, les parois de guidage étant conçues pour guider un ruban de polissage contenu dans le corps sur ledit rouleau d’acheminement au moins. L’invention présente également de nombreux autres aspects.
PCT/US2009/041256 2008-04-21 2009-04-21 Appareil et procedes d’utilisation d’une cassette a ruban de polissage Ceased WO2009132005A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4645308P 2008-04-21 2008-04-21
US61/046,453 2008-04-21

Publications (2)

Publication Number Publication Date
WO2009132005A2 WO2009132005A2 (fr) 2009-10-29
WO2009132005A3 true WO2009132005A3 (fr) 2010-03-04

Family

ID=41201494

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/041256 Ceased WO2009132005A2 (fr) 2008-04-21 2009-04-21 Appareil et procedes d’utilisation d’une cassette a ruban de polissage

Country Status (3)

Country Link
US (1) US20090264053A1 (fr)
TW (1) TW201002472A (fr)
WO (1) WO2009132005A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6113960B2 (ja) * 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
JP6223873B2 (ja) * 2014-03-14 2017-11-01 株式会社荏原製作所 研磨装置及び研磨方法
CN105397597B (zh) * 2015-10-26 2017-07-11 长安大学 一种多级一体化全自动金相磨抛机
USD834075S1 (en) 2016-08-05 2018-11-20 Ebara Corporation Pressing member for substrate polishing apparatus
US10416575B2 (en) * 2016-11-16 2019-09-17 Suss Microtec Photomask Equipment Gmbh & Co. Kg Apparatus and method for cleaning a partial area of a substrate
TWI739361B (zh) * 2020-03-26 2021-09-11 南茂科技股份有限公司 清潔裝置及捲帶自動接合封裝結構的製造設備

Citations (5)

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Publication number Priority date Publication date Assignee Title
US5065548A (en) * 1988-06-06 1991-11-19 Speedfam Company, Ltd. Surface treating tape cartridge and surface treating machine
US6309278B1 (en) * 1996-02-27 2001-10-30 The Furukawa Electric Co., Ltd. Method and apparatus for polishing optical connector end faces
US20020098787A1 (en) * 2001-01-09 2002-07-25 Junji Kunisawa Polishing apparatus
US7179154B1 (en) * 2005-06-29 2007-02-20 Lam Research Corporation Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette
JP2008087136A (ja) * 2006-10-04 2008-04-17 Ebara Corp 研磨装置、研磨方法、処理装置

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US3524284A (en) * 1967-08-22 1970-08-18 Corning Glass Works Abrasive milling head for numerically controlled apparatus
BE755166A (fr) * 1969-08-23 1971-02-22 Philips Nv Cassette
US4114751A (en) * 1976-10-22 1978-09-19 Teletype Corporation Printing machine with automatic off-center crown roller ribbon-wear compensation
US4347689A (en) * 1980-10-20 1982-09-07 Verbatim Corporation Method for burnishing
US4930259A (en) * 1988-02-19 1990-06-05 Magnetic Perpherals Inc. Magnetic disk substrate polishing assembly
US4964557A (en) * 1989-04-28 1990-10-23 Datatape Incorporated Bidirectional web guiding system
JP3024947B2 (ja) * 1997-07-03 2000-03-27 日本ミクロコーティング株式会社 研磨装置
JP2003209082A (ja) * 2002-01-15 2003-07-25 Nitto Denko Corp 保護テープの貼付方法およびその装置並びに保護テープの剥離方法
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
CN100429752C (zh) * 2004-02-25 2008-10-29 株式会社荏原制作所 抛光装置和衬底处理装置
US20060256465A1 (en) * 2005-05-11 2006-11-16 Biskeborn Robert G Tape system with dynamically controlled flangeless rollers
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
WO2007126815A2 (fr) * 2006-03-30 2007-11-08 Applied Materials, Inc. Procédés et appareil de polissage du bord d'un substrat
US7662024B2 (en) * 2006-05-03 2010-02-16 V.I. Mfg. Inc. Method and apparatus for precision polishing of optical components
US20080293336A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus to control substrate bevel and edge polishing profiles of films
JP2008284683A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の振動により基板のノッチを研磨する方法及び装置
US20080293333A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for controlling the size of an edge exclusion zone of a substrate
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing
TW200908124A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US20080291448A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for finding a substrate notch center
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置
US20080293344A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate using a polishing pad
JP2008290233A (ja) * 2007-05-21 2008-12-04 Applied Materials Inc 半導体製造における基板斜面及び縁部の研磨用の高性能及び低価格の研磨テープのための方法及び装置
US8142260B2 (en) * 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065548A (en) * 1988-06-06 1991-11-19 Speedfam Company, Ltd. Surface treating tape cartridge and surface treating machine
US6309278B1 (en) * 1996-02-27 2001-10-30 The Furukawa Electric Co., Ltd. Method and apparatus for polishing optical connector end faces
US20020098787A1 (en) * 2001-01-09 2002-07-25 Junji Kunisawa Polishing apparatus
US7179154B1 (en) * 2005-06-29 2007-02-20 Lam Research Corporation Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette
JP2008087136A (ja) * 2006-10-04 2008-04-17 Ebara Corp 研磨装置、研磨方法、処理装置

Also Published As

Publication number Publication date
WO2009132005A2 (fr) 2009-10-29
TW201002472A (en) 2010-01-16
US20090264053A1 (en) 2009-10-22

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