TW201002472A - Apparatus and methods for using a polishing tape cassette - Google Patents

Apparatus and methods for using a polishing tape cassette Download PDF

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Publication number
TW201002472A
TW201002472A TW098113227A TW98113227A TW201002472A TW 201002472 A TW201002472 A TW 201002472A TW 098113227 A TW098113227 A TW 098113227A TW 98113227 A TW98113227 A TW 98113227A TW 201002472 A TW201002472 A TW 201002472A
Authority
TW
Taiwan
Prior art keywords
supply
abrasive
reel
substrate
belt
Prior art date
Application number
TW098113227A
Other languages
English (en)
Chinese (zh)
Inventor
Antoine P Manens
Gary C Ettinger
Paul D Butterfield
Shou-Sung Chang
Ricardo Martinez
Eashwer Kollata
Robert A Ewald
Kuldip Sumbria
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201002472A publication Critical patent/TW201002472A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW098113227A 2008-04-21 2009-04-21 Apparatus and methods for using a polishing tape cassette TW201002472A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4645308P 2008-04-21 2008-04-21

Publications (1)

Publication Number Publication Date
TW201002472A true TW201002472A (en) 2010-01-16

Family

ID=41201494

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098113227A TW201002472A (en) 2008-04-21 2009-04-21 Apparatus and methods for using a polishing tape cassette

Country Status (3)

Country Link
US (1) US20090264053A1 (fr)
TW (1) TW201002472A (fr)
WO (1) WO2009132005A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739361B (zh) * 2020-03-26 2021-09-11 南茂科技股份有限公司 清潔裝置及捲帶自動接合封裝結構的製造設備

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6113960B2 (ja) * 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
JP6223873B2 (ja) * 2014-03-14 2017-11-01 株式会社荏原製作所 研磨装置及び研磨方法
CN105397597B (zh) * 2015-10-26 2017-07-11 长安大学 一种多级一体化全自动金相磨抛机
USD834075S1 (en) 2016-08-05 2018-11-20 Ebara Corporation Pressing member for substrate polishing apparatus
US10416575B2 (en) * 2016-11-16 2019-09-17 Suss Microtec Photomask Equipment Gmbh & Co. Kg Apparatus and method for cleaning a partial area of a substrate

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US20080293333A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for controlling the size of an edge exclusion zone of a substrate
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TW200908124A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US20080291448A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for finding a substrate notch center
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置
US20080293344A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate using a polishing pad
JP2008290233A (ja) * 2007-05-21 2008-12-04 Applied Materials Inc 半導体製造における基板斜面及び縁部の研磨用の高性能及び低価格の研磨テープのための方法及び装置
US8142260B2 (en) * 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739361B (zh) * 2020-03-26 2021-09-11 南茂科技股份有限公司 清潔裝置及捲帶自動接合封裝結構的製造設備

Also Published As

Publication number Publication date
WO2009132005A2 (fr) 2009-10-29
WO2009132005A3 (fr) 2010-03-04
US20090264053A1 (en) 2009-10-22

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