WO2012134145A1 - Appareil pour inspecter la vision à l'aide de modèles de grilles multiples ayant des couleurs différentes - Google Patents

Appareil pour inspecter la vision à l'aide de modèles de grilles multiples ayant des couleurs différentes Download PDF

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Publication number
WO2012134145A1
WO2012134145A1 PCT/KR2012/002217 KR2012002217W WO2012134145A1 WO 2012134145 A1 WO2012134145 A1 WO 2012134145A1 KR 2012002217 W KR2012002217 W KR 2012002217W WO 2012134145 A1 WO2012134145 A1 WO 2012134145A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
grid pattern
camera
inspection object
different colors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/002217
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English (en)
Korean (ko)
Inventor
박찬화
김성현
구자명
장권규
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mer Skilful Feat Co Ltd
Original Assignee
Mer Skilful Feat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mer Skilful Feat Co Ltd filed Critical Mer Skilful Feat Co Ltd
Publication of WO2012134145A1 publication Critical patent/WO2012134145A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2509—Color coding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

Definitions

  • the present invention relates to a vision inspection apparatus, and more particularly, by performing a vision inspection using a wider grid pattern and a narrower grid pattern, different from each other that can quickly and accurately measure the height of the inspection object It relates to a vision inspection device using a multi-colored grid pattern.
  • SMT Surface Mounting Technology
  • PCB printed circuit board
  • SMD surface-mounting components
  • Surface mount lines consist of equipment such as surface mounters and vision inspection equipment.
  • the surface mounter is a device for mounting surface-mounted parts on a printed circuit board.
  • the surface mounter receives various surface-mounted parts supplied in the form of tape, stick, and tray from a feeder and places them on the mounting position on the printed circuit board. Perform.
  • the vision inspection apparatus inspects the mounting state of the surface mount component before or after the soldering process of the surface mount component is completed and transfers the printed circuit board to the next process according to the inspection result.
  • a typical vision inspection apparatus includes a lighting unit to which light is irradiated using a lamp or the like, a camera unit for photographing image information of various components mounted on an inspection unit and reflecting light from the lighting unit. It comprises a half mirror for transmitting the shape of the inspection object to the camera unit while being reflected on the inspection object.
  • the lighting unit is arranged in the housing by arranging a plurality of lamps in a plurality, when the illumination of the inspection object to supply power to the plurality of lamps to irradiate light.
  • All of the above inspection methods measure the two-dimensional shadow shape and calculate the three-dimensional height by using a trigonometric function.
  • the conventional vision inspection apparatus includes an illumination unit 110 to which light is irradiated using a lamp and the like, and an image of various components installed on the inspection object by being installed on the illumination unit 110. And a half mirror 130 for reflecting the light from the illumination unit 110 to capture information and transmitting the shape of the inspection object to the camera while reflecting light from the illumination unit 110.
  • the lighting unit 110 is arranged in the housing 140 by arranging a plurality of lamps, and, when irradiating the light to the inspection object to supply power to the plurality of lamps to irradiate light.
  • a half mirror provided for capturing an image while reflecting light is disposed in front of the central camera unit, thereby preventing a clearer image.
  • the present invention has been made to solve the above problems, to provide a vision inspection apparatus capable of measuring the height of the inspection object quickly and accurately.
  • Still another object of the present invention is to provide a vision inspection apparatus capable of improving the uniformity of light irradiated onto a surface of an inspection object.
  • Still another object of the present invention is to provide a vision inspection apparatus capable of capturing a clearer image by removing a half mirror disposed in front of a central camera unit.
  • a vision inspection apparatus using multiple grids of different colors includes a photographed image of an inspection object assembled or mounted in a process of assembling the image, and the photographed image is pre-input with the target image.
  • a vision inspection apparatus for comparing good or bad of an inspection object comprising: a stage unit for fixing or transferring the inspection object to an inspection position, an illumination unit positioned at an upper portion of the stage unit, and providing illumination to the inspection object; A central camera unit positioned at the center of the illumination unit to obtain a two-dimensional shape of an inspection object, a side camera unit disposed in a plurality of side portions of the central camera unit, a camera of the side camera unit at the side of the central camera unit; In the plurality of grid pattern irradiation unit disposed between the camera, and the central camera unit And a control unit for controlling the stage unit, the lattice pattern irradiation unit, and the camera unit by reading a photographed image to determine whether the inspection object is good or bad.
  • the grid pattern irradiation unit comprises any one of a liquid crystal panel or a micromirror module.
  • the lattice of the large period and the lattice of the small period may be configured to be irradiated at the same time.
  • a light diffusing unit may be disposed in front of the lighting unit.
  • the lighting unit comprises a horizontal light unit for irradiating light in the vertical direction and a tilted light unit for irradiating light in the oblique direction.
  • the plurality of grid pattern irradiation units may be disposed to face each other with respect to the central camera unit.
  • the side camera parts may be disposed to face each other with respect to the center camera part.
  • the light diffusing unit is disposed in front of both the horizontal lighting unit and the inclined lighting unit.
  • the central camera unit may be a positioning camera unit for positioning the inspection object.
  • the positioning lighting unit and the half mirror are disposed in front of the positioning camera unit.
  • the angle between the central camera portion and the grid pattern irradiation portion on the side view is 25 degrees to 45 degrees.
  • the height of the inspection object can be calculated quickly and accurately.
  • the uniformity of the light irradiated on the surface of the inspection object can be improved.
  • Fig. 1A is a perspective view showing a state in which a lattice pattern is irradiated to the part.
  • FIG.1 (b) is a top view which shows the state which irradiated the grid with a component.
  • FIG. 2 is a side cross-sectional view of a conventional vision inspection apparatus.
  • FIG. 3 is a schematic side view of a vision inspection apparatus according to the present invention.
  • FIG. 4 is a schematic plan view of a vision inspection apparatus according to the present invention.
  • 5 is a conceptual diagram showing the relationship between the period of the lattice pattern and the height of the parts.
  • FIG 3 is a schematic side view of a vision inspection apparatus according to the present invention
  • Figure 4 is a schematic plan view of the vision inspection apparatus according to the present invention.
  • a vision inspection apparatus for discriminating good or bad of an inspection object 5 compared to an input target image comprising: a stage unit 10 for fixing or conveying the inspection object 5 to an inspection position, and the stage unit ( Located in the upper portion 10, the illumination unit 20 for providing illumination to the inspection object 5, and the central camera unit 30 for obtaining a two-dimensional shape of the inspection object is located in the center of the illumination unit 20 ), Side camera parts 40-2, 40-4, 40-6, and 40-8 arranged on the side of the central camera part, and the side camera part (from the side of the central camera part 30).
  • 40-2, 40-4, 40-6, 40-8) placed between the camera Is a plurality of grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) and the vision to read the image taken by the central camera unit 30 to determine the good or bad of the inspection object
  • another grid pattern irradiation unit is characterized in that configured to irradiate the grid pattern of a small period (interval) as another predetermined color.
  • Vision inspection apparatus of the present invention is installed to perform the vision inspection before moving to the next process through the conveyor of the preceding equipment, when inspecting the surface-mounted parts of the printed circuit board after the surface mounting work in the surface mounting line .
  • Such vision inspection apparatus can be installed in a manner that is arranged in the space formed between the conveyor of the line, trailing equipment and the conveyor, can also be used in the form of a single table without being connected to the line, trailing equipment.
  • the stage unit 10 is a component that provides a space in which the inspected object 5 to be inspected is seated, and a position adjusting unit (not shown) and a high position for adjusting and fixing the position of the inspected object 5. It may be configured to include a government (not shown).
  • the lighting unit 20 is installed on the upper portion of the stage unit 10 continuously or intermittently along the circumferential direction around the central camera unit 30.
  • the lighting unit 20 is a component that provides illumination to the inspection object 5 in order to secure accurate image information of the inspection object 5, by placing a plurality of lamps or LED bulbs to the inspection object (5) ) Can be arranged to illuminate from side to side.
  • the lighting unit 20 includes a horizontal lighting unit 22 and the inclined lighting unit 23.
  • the horizontal lighting unit 22 is installed on the upper portion of the stage 10 serves to provide the light incident to the inspection object (5) perpendicularly.
  • the inclined light unit 23 is disposed at the side of the vertical light unit 22 to provide light in the oblique direction.
  • the central camera unit 30 is a component for photographing the inspection object 5 in a plan view, and preferably, may be provided as a charge coupled device (CCD) camera.
  • CCD charge coupled device
  • the degree of deformation of the pattern can be measured the height of the inspection object.
  • a half mirror is disposed in front of the center camera unit, and reflects the light from the lighting unit, and is configured to capture an image through the camera.
  • the center camera unit 30 No half mirror is placed in front.
  • a plurality of side camera units 40-2, 40-4, 40-6, and 40-8 are arranged symmetrically with respect to the center camera unit 30 on the side of the central camera unit 30, thereby providing an image. Eliminate blind spots and take pictures quickly.
  • the four side camera parts 40-2, 40-4, 40-6, and 40-8 are symmetrically arranged with respect to the center camera part 30, such as a substrate. Examine the lifting and uninsertion of the parts placed on the inspection object.
  • the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) is a configuration for measuring the height by irradiating the grid pattern on the inspection object 5, a liquid crystal panel or a digital micromirror display ( DMD: Digital Micromirror Display and light source.
  • DMD Digital Micromirror Display and light source.
  • the shadow of the grid-shaped shadow is irradiated onto the inspection object 5 under the control of the control unit 70, and the degree of deformation of the grid-shaped shadow through the central camera unit 30, We can calculate the height of.
  • the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 also has four grid pattern irradiation units 50-2, 50-4, 50-6, centered on the central camera unit 30. 50-8) are arranged symmetrically and configured to irradiate the object 5 with the grid.
  • the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 is configured to irradiate the grid pattern of various colors, such as red, blue.
  • one of the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) of the grid pattern irradiation unit irradiates the grid pattern of a larger gap as one color, the other grid pattern irradiation unit By simultaneously irradiating smaller grids with different colors, more accurate height measurements can be made while reducing the time required for component height measurements.
  • one of the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) of the grid pattern irradiation unit irradiates the grid pattern of a larger gap in red
  • the other grid pattern The irradiation unit may irradiate the grids of smaller intervals in blue, and may irradiate the grids of larger intervals and the grids of smaller intervals.
  • the arrangement angle a between the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 and the central camera unit 30 is arranged in an angle range of 25 degrees to 45 degrees. .
  • the angle (a) When the angle (a) is smaller than 25 degrees, the degree of deformation of the grid pattern according to the height of the component is small, which may cause an error in the height calculation.
  • the angle (a) is larger than 45 degrees, the grid pattern irradiation unit ( 50-2, 50-4, 50-6, 50-8), the difference in the width of the grid pattern irradiated on the near and far sides is too large, which may cause errors in the height calculation.
  • the vision processing unit 60 calculates the image information of the inspection object 5 obtained from the camera unit through a mathematical process such as Fourier transform (Fourier Transform), and compares with the reference value input in advance The good or bad of the object 5 is determined.
  • a mathematical process such as Fourier transform (Fourier Transform)
  • control unit 70 is a component including a motion controller for controlling the driving and operation of the stage unit 10 and the camera unit, and may be provided to control driving of the entire vision inspection apparatus according to the present invention.
  • the controller 70 is responsible for physical control such as photographing position control of the vision inspection apparatus, processing of photographed images, and lighting unit control according to a system control program, as well as performing inspection task and data calculation task.
  • control unit 70 is in charge of the overall control of the vision inspection device, such as output device control for outputting the work contents and inspection results to the monitor and input device control for the operator to set and input various items.
  • the light diffusion unit 25 such as a light diffusion plate is disposed in front of the illumination unit 20, so that the light from the illumination unit 20 is evenly irradiated to the entire area of the inspection object.
  • the light diffusion unit 25 is configured to be bent in a side cross-section so that the light diffusion unit 25 can be disposed in front of both the horizontal light unit 22 and the inclined light unit 23.
  • a positioning camera unit 80 for checking the position of the inspection object.
  • the positioning lighting unit 84 and the half mirror 82 is disposed in front of the positioning camera unit 80.
  • the configuration for positioning is accommodated in the housing of the separate positioning camera unit 80, thereby reducing the housing diameter of the central camera unit 30 It can be reduced and management is easy even in case of accessory failure.
  • 5 is a conceptual diagram showing the relationship between the period (interval) of the lattice pattern and the height of the part.
  • the straight lines connecting the points a, b, c and d conceptually show the height that can be measured by the lattice pattern having a large period.
  • a large periodic grid has a resolution of 500 micrometers, so all heights from 0 to 500 micrometers are recognized as the same height, and another height from 500 to 1000 micrometers.
  • the approximate height of the component is measured using a large-gap grid pattern of red color, for example, irradiated by one of the grid pattern irradiation units 50-2, 50-4, 50-6, and 50-8. Done.
  • the height of the hexahedral shaped part illustrated in FIG. 5 is 1680 micrometers, the height of the part is primarily measured in the range of 1500 and 2000 micrometers through the lattice of a large period.
  • the total height of the part is 1500 + 180, measured 1680 micrometers.
  • the lattice pattern corresponding to the first lattice pattern on the left in FIG. 1 Plaid, 2-1 Plaid, 3-1 Plaid that is, whether the plaid on the top of the part and the plaid on the bottom coincide after several cycles (lattice spacing) Cannot be judged.
  • the large periodic plaid and the small periodic plaid may be photographed by irradiating the large interval plaid and the small periodic plaid once, or the large interval plaid once according to the requirements of the height inspection device.
  • the image may be irradiated and photographed, and the grid pattern having a small interval may be configured to allow a more accurate height measurement by photographing while moving between the grid patterns having a large interval.
  • the larger plaid spacing is preferably comprised three to six times larger than the smaller plaid spacing.
  • the lattice spacing of a large period is less than three times, the difference in measurement resolution due to the difference of the period size is not large, which is not desirable for more accurate height measurement. If the lattice spacing of a large period exceeds six times, The difference between the spacing and the small spacing becomes so large that it has an undesirable effect on the sharpness of the grid shape finally reflected on the inspection object.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

L'invention concerne un appareil pour inspecter la vision à l'aide de modèles de grilles multiples ayant des couleurs différentes, destiné à photographier avec un appareil photo un objet d'inspection, qui est assemblé ou monté dans un processus d'assemblage de pièces, et ensuite comparer l'image photographiée avec une image d'objet qui est entrée par avance pour déterminer si l'objet d'inspection est satisfaisant ou défectueux, et comprenant : une partie d'étage pour fixer ou transférer l'objet d'inspection vers une position d'inspection ; une partie d'éclairage qui est positionnée sur la partie supérieure de la partie d'étage, pour apporter de la lumière sur l'objet d'inspection ; une partie centrale d'appareil photo qui est positionnée au centre de la partie d'éclairage, pour obtenir une forme bidimensionnelle de l'objet d'inspection ; des parties latérales d'appareil photo qui sont agencées dans une pluralité sur la partie latérale de la partie centrale d'appareil photo ; une pluralité de parties d'irradiation de modèles de grilles qui est agencée sur la partie latérale de la partie centrale d'appareil photo, entre les appareils photos sur la partie latérale d'appareil photo ; une partie de traitement de la vision pour lire l'image qui est photographiée par la partie centrale d'appareil photo pour déterminer si l'objet d'inspection est satisfaisant ou défectueux ; et une partie de commande pour commander la partie d'étage, la partie d'irradiation de modèles de grilles et la partie d'appareil photo, une partie d'irradiation de modèles de grilles parmi la pluralité de parties d'irradiation de modèles de grilles irradiant un modèle de grille ayant une couleur prédéterminée et une période importante, et l'autre partie d'irradiation de modèles de grilles irradiant un modèle de grille ayant une autre couleur prédéterminée et une période faible.
PCT/KR2012/002217 2011-03-31 2012-03-27 Appareil pour inspecter la vision à l'aide de modèles de grilles multiples ayant des couleurs différentes Ceased WO2012134145A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110029548A KR101245621B1 (ko) 2011-03-31 2011-03-31 서로 다른 색깔의 다중 격자 무늬를 이용한 비전검사장치
KR10-2011-0029548 2011-03-31

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104897678A (zh) * 2015-06-29 2015-09-09 杭州载力科技有限公司 水平式ccd双面线扫描系统
CN109187584A (zh) * 2018-08-08 2019-01-11 华南理工大学 一种混合场景下的柔性印制电路缺陷检测系统及方法
EP4300082A1 (fr) * 2022-06-29 2024-01-03 Siemens Aktiengesellschaft Détection de contamination des modules électriques au moyen d'un revêtement fluorescent

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KR100378490B1 (ko) * 2001-04-06 2003-03-29 삼성테크윈 주식회사 씨씨디 카메라의 조명장치
KR100406843B1 (ko) * 2001-04-06 2003-11-21 (주) 인텍플러스 색정보를 이용한 실시간 3차원 표면형상 측정방법 및 장치
JP2007333591A (ja) * 2006-06-15 2007-12-27 Daiichi Jitsugyo Viswill Co Ltd 検査用照明装置
KR101000047B1 (ko) * 2008-04-18 2010-12-09 주식회사 미르기술 비전 검사 시스템

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JP4611782B2 (ja) * 2005-03-28 2011-01-12 シチズンホールディングス株式会社 ３次元形状測定方法及び測定装置
KR101035895B1 (ko) * 2008-08-23 2011-05-23 주식회사 고영테크놀러지 3차원형상 측정장치
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Publication number Priority date Publication date Assignee Title
KR100378490B1 (ko) * 2001-04-06 2003-03-29 삼성테크윈 주식회사 씨씨디 카메라의 조명장치
KR100406843B1 (ko) * 2001-04-06 2003-11-21 (주) 인텍플러스 색정보를 이용한 실시간 3차원 표면형상 측정방법 및 장치
JP2007333591A (ja) * 2006-06-15 2007-12-27 Daiichi Jitsugyo Viswill Co Ltd 検査用照明装置
KR101000047B1 (ko) * 2008-04-18 2010-12-09 주식회사 미르기술 비전 검사 시스템

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104897678A (zh) * 2015-06-29 2015-09-09 杭州载力科技有限公司 水平式ccd双面线扫描系统
CN109187584A (zh) * 2018-08-08 2019-01-11 华南理工大学 一种混合场景下的柔性印制电路缺陷检测系统及方法
EP4300082A1 (fr) * 2022-06-29 2024-01-03 Siemens Aktiengesellschaft Détection de contamination des modules électriques au moyen d'un revêtement fluorescent
WO2024002809A1 (fr) 2022-06-29 2024-01-04 Siemens Aktiengesellschaft Détection de contamination dans des ensembles électriques par l'intermédiaire d'un revêtement fluorescent

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KR101245621B1 (ko) 2013-03-20

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