WO2012157952A2 - Appareil d'inspection de support de carte de circuit imprimé - Google Patents

Appareil d'inspection de support de carte de circuit imprimé Download PDF

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Publication number
WO2012157952A2
WO2012157952A2 PCT/KR2012/003831 KR2012003831W WO2012157952A2 WO 2012157952 A2 WO2012157952 A2 WO 2012157952A2 KR 2012003831 W KR2012003831 W KR 2012003831W WO 2012157952 A2 WO2012157952 A2 WO 2012157952A2
Authority
WO
WIPO (PCT)
Prior art keywords
pcb substrate
inspection
conveyor
pcb
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/003831
Other languages
English (en)
Korean (ko)
Other versions
WO2012157952A3 (fr
Inventor
한충희
김기영
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mer Skilful Feat Co Ltd
Original Assignee
Mer Skilful Feat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mer Skilful Feat Co Ltd filed Critical Mer Skilful Feat Co Ltd
Publication of WO2012157952A2 publication Critical patent/WO2012157952A2/fr
Publication of WO2012157952A3 publication Critical patent/WO2012157952A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Definitions

  • the present invention relates to a PCB substrate inspection apparatus, and more particularly, to a PCB substrate inspection apparatus capable of inspecting a PCB substrate stably and efficiently.
  • SMT Surface Mounting Technology
  • PCB substrates printed circuit boards
  • SMD surface-mounting devices
  • Surface mount lines consist of equipment such as surface mounters and vision inspection equipment.
  • the surface mounter is a device for mounting a surface mount component on a PCB, and receives various surface mount components supplied in a tape, stick, and tray form from a feeder and places them on a mounting position on the PCB. .
  • the vision inspection apparatus inspects the mounting state of the surface mount component before or after the soldering process of the surface mount component is completed and transfers the PCB to the next process according to the inspection result.
  • a typical vision inspection apparatus includes a lighting unit to which light is irradiated using a lamp, and a camera unit which is installed on an upper portion of the lighting unit to photograph image information of various parts mounted on an inspection object.
  • Conventional vision inspection method is to adjust the initial position in the positioning device when the inspection object is transported horizontally through the conveyor, and after the adjustment is completed, the lighting and the like irradiates the printed circuit board, and the camera and each surface-mounted component Take a picture of the lead.
  • the image information is output to the monitor and calculated to inspect the quantity / defect of the surface-mounted component which is the inspection object, or to check whether the surface-mounted component is mounted or not.
  • three-dimensional height is measured by irradiating light through a grating on a PCB substrate which is an inspection object and analyzing a shadow shape formed by the irradiated light on the surface of the inspection object.
  • An object of the present invention is to provide an apparatus for inspecting a substrate substrate that can efficiently and stably inspect a PCB substrate.
  • Another object of the present invention is to provide a PCB substrate inspection apparatus which can improve inspection yield by enabling inspection of a PCB substrate quickly.
  • Another object of the present invention is to provide a PCB substrate inspection apparatus capable of precisely aligning a PCB substrate.
  • Another object of the present invention is to provide a PCB substrate inspection apparatus that can flexibly correspond to the width of a PCB substrate to be inspected.
  • a PCB substrate inspection apparatus for achieving the above object includes a pair of first and second lead portions for introducing a PCB substrate into an inspection region for inspecting a PCB substrate, and a pair of pairs for inspecting the PCB substrate.
  • a first and a second inspection unit and a pair of first and second conveyor shuttles for transferring the incoming PCB to the first and second inspection units, respectively; a position opposed to the first and second inlet units It characterized in that it comprises a first, second discharge portion for receiving and discharging the PCB substrate, the inspection is completed from the first, second conveyor shuttle unit.
  • first and second inlet portion and the first and second outlet portion are arranged in a fixed position, all can be configured to include a pair of conveyor belt, respectively.
  • the pair of first and second conveyor shuttles are configured to reciprocate in a direction perpendicular to the conveying direction of the PCB substrate by the pair of conveyor belts of the inlet portion.
  • the first and second conveyor shuttle units may include a pair of inspection unit conveyors for transferring the PCB substrate in the discharge direction.
  • the inspection unit conveyor may be configured to include a pair of PCB substrate transfer roller and each of the PCB substrate transfer belt.
  • the inspection unit conveyor may be configured to include a PCB substrate support for elastically supporting the PCB substrate.
  • the inspection unit conveyor includes a conveyor width adjusting member for adjusting the distance between the pair of PCB substrate transfer roller and the PCB substrate transfer belt.
  • the inspection unit conveyor may include a substrate stop member configured to be moved in the vertical direction to block the progress of the PCB substrate.
  • the inspection unit conveyor includes a PCB alignment member for displacing the PCB substrate in a direction perpendicular to the direction to be conveyed by the pair of PCB substrate transfer belt.
  • the inspection unit conveyor may be configured to reciprocate in a direction perpendicular to the conveying direction of the PCB substrate in the conveyor shuttle.
  • the inspection unit conveyor may include an inlet detection sensor for detecting the inlet of the PCB.
  • the conveyor shuttle unit may include a position detection sensor for detecting the position of the inspection unit conveyor.
  • the PCB substrate can be inspected efficiently and stably.
  • the inspection yield can be improved by allowing the inspection of the PCB substrate to be performed quickly.
  • the position of the PCB substrate can be precisely aligned.
  • the PCB substrate inspection apparatus which can respond flexibly to the width of the PCB substrate which is a test object.
  • FIG. 1 is a perspective view of a PCB substrate inspection apparatus according to the present invention.
  • FIG. 2 is a plan view of a PCB substrate inspection apparatus according to the present invention.
  • FIG. 4 is a perspective view of the inspection unit conveyor.
  • 5 is a perspective view of the inspection unit.
  • FIG. 1 is a perspective view of a PCB substrate inspection apparatus according to the present invention
  • FIG. 2 is a plan view of a PCB substrate inspection apparatus according to the present invention
  • FIG. 3 is a plan view of a conveyor shuttle unit
  • FIG. 4 is a perspective view of an inspection unit conveyor
  • FIG. 5 Is a perspective view of an inspection part.
  • the PCB substrate inspection apparatus includes the inlets 20 and 26 for introducing the PCB into the inspection region 10 for inspecting the PCB, and the PCB substrate is inspected.
  • the lead portions 20 and 26 are configured to receive a PCB substrate from a previous process, and include a pair of conveyor belts 22, 24, 23, and 25, each of which is configured to adjust an interval, in front of the inspection area. Positioned in a fixed state.
  • the pair of inspection units 30 and 35 include a camera, a lens, and various lighting means to perform vision inspection on the PCB substrate, and a pair of lateral movement guides to move in the X and Y directions. It is arranged to be movable on the longitudinal movement guide members 34 and 36 movably disposed on the members 32 and 33.
  • the pair of conveyor shuttle units 40 and 50 receive the PCB substrate from the inlet unit 20 in the inspection region 10 and arrange the PCB substrate under the inspection units 30 and 35.
  • the pair of first and second conveyor shuttles 40 and 50 are configured to reciprocate in a direction perpendicular to the conveying direction of the PCB substrate by the pair of conveyor belts 22 and 24 of the inlet 20. do.
  • the discharge part 60, 66 includes a pair of conveyor belts 62, 64, 63, 65, which are configured to be adjustable in intervals, such as the inlet part 20, at the rear of the inspection area 10. It is arranged in a fixed position.
  • the first and second conveyor shuttle parts 40 and 50 each include an inspection part conveyor 41 shown in FIG. 4 for transferring the PCB substrate in the discharge part 60 direction.
  • the inspection unit conveyor 41 includes a pair of PCB substrate transfer rollers 43 and a PCB substrate transfer belt 45, respectively.
  • the PCB substrate can be received from the inlet 20 and transferred to the discharge unit 60.
  • the inspection unit conveyor 41 includes a PCB support 46 provided with a support pin 47 for elastically supporting the PCB.
  • the PCB substrate when the PCB substrate is mounted on the inspection unit conveyor 41, the PCB substrate is elastically supported to prevent bending of the substrate substrate.
  • the inspection unit conveyor 41 includes a conveyor width adjusting member 47 for adjusting the interval between a pair of belt for conveying the PCB substrate.
  • the inspection unit conveyor 41 is provided with one or more conveyor width detection sensors 56.
  • the inspection unit conveyor 41 includes a substrate stopping member 49 for stopping the PCB substrate in a proper position by the PCB substrate transfer belt 45.
  • the substrate stop member 49 is configured to be movable in the vertical direction by, for example, a configuration such as an air cylinder, and when configured to stop the PCB substrate at a predetermined position, it is configured to descend to block the PCB substrate, When it is necessary to transfer the inspection PCB substrate in the direction of the discharge unit 60 is configured to be raised so as not to interfere with the transfer of the PCB substrate.
  • At least one PCB detection sensor 53 may be installed at one side of the inspection unit conveyor 41 to detect the PCB.
  • the PCB substrate support part 46 When the PCB substrate is disposed at the position defined by the substrate stop member 49, the PCB substrate support part 46 is lifted, and the support pin 47 elastically supports the PCB substrate.
  • the PCB support plate 52 is also raised to continuously support the edge portion of the PCB substrate, thereby supporting the PCB substrate as a whole.
  • the inspection unit conveyor 41 includes a PCB alignment member 51 for displacing the PCB substrate in a direction perpendicular to the direction transferred by the pair of PCB substrate transfer belts 45.
  • the PCB substrate is pushed in the direction of the frame 42 opposite to the frame on which the PCB alignment member 51 is installed to align the position of the PCB substrate.
  • the inspection unit conveyor 41 is configured to reciprocate in the direction perpendicular to the conveyance direction of the PCB substrate in the conveyor shuttle unit 40.
  • the inspection unit conveyor 41 is installed on the conveyor screw ball shaft 58 and the conveyor transfer guide 59 in the conveyor shuttle unit 40, It is reciprocated by the drive of the conveyor motor 57.
  • one or more shuttle position detecting sensors 55 are installed in the conveyor shuttle unit 40 to detect the position in the conveyor shuttle unit 40 of the inspection unit conveyor 41.
  • the PCB substrate can be stably disposed below the inspection units 30 and 35, and can be flexibly applied to the process by the conveyor width adjusting member 47 included in the inspection unit conveyor 41. .
  • the inspection efficiency can be improved by performing inspections two by one while flexibly responding to various kinds and widths of various PCB substrates to be inspected.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

La présente invention concerne un appareil d'inspection de support de carte de circuit imprimé comprenant : des première et seconde parties de chargement permettant d'acheminer les supports de carte de circuit imprimé dans les zones d'inspection dans lesquelles les supports de carte de circuit imprimé sont inspectés ; des première et seconde parties d'inspection permettant d'inspecter les supports de carte de circuit imprimé ; des première et seconde parties navettes transporteuses permettant de transporter les supports de carte de circuit imprimé qui ont été acheminés jusqu'aux première et seconde parties d'inspection, respectivement ; et des première et seconde parties de déchargement situées à l'opposé des première et seconde parties de chargement, respectivement, pour recevoir les supports de carte de circuit imprimé par les première et seconde navettes transporteuses, respectivement, une fois les inspections terminées, et pour décharger les supports de carte de circuit imprimé inspectés. La présente invention concerne une inspection efficace et stable des supports de carte de circuit imprimé, et en outre, peut améliorer le rendement d'inspection en permettant une inspection rapide des supports de carte de circuit imprimé et permet l'alignement précis de supports de carte de circuit imprimé.
PCT/KR2012/003831 2011-05-18 2012-05-16 Appareil d'inspection de support de carte de circuit imprimé Ceased WO2012157952A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0047024 2011-05-18
KR1020110047024A KR101178409B1 (ko) 2011-05-18 2011-05-18 피시비 기판 검사장치

Publications (2)

Publication Number Publication Date
WO2012157952A2 true WO2012157952A2 (fr) 2012-11-22
WO2012157952A3 WO2012157952A3 (fr) 2013-01-24

Family

ID=46888082

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/003831 Ceased WO2012157952A2 (fr) 2011-05-18 2012-05-16 Appareil d'inspection de support de carte de circuit imprimé

Country Status (2)

Country Link
KR (1) KR101178409B1 (fr)
WO (1) WO2012157952A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104908457A (zh) * 2015-06-15 2015-09-16 苏州石丸英合精密机械有限公司 键盘激光自动打标机的气动上料机构

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101891892B1 (ko) * 2016-11-01 2018-08-27 신흥에스이씨주식회사 캡플레이트 반제품의 제조장치
KR102581387B1 (ko) * 2018-09-11 2023-09-21 삼성전자주식회사 프로브 및 이를 포함하는 프로브 카드
CN114667058B (zh) * 2022-04-26 2024-08-23 迅得机械（东莞）有限公司 一种印刷电路板检修机自动化方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0139169Y1 (ko) * 1996-09-24 1999-05-15 삼성전자주식회사 Pcb 검사용 pcb 위치설정장치
KR100270519B1 (ko) * 1997-08-21 2001-01-15 구자홍 인쇄회로기판 검사 장치
JP2000012999A (ja) 1998-06-18 2000-01-14 Nagoya Denki Kogyo Kk 基板検査方法およびその装置
JP4803195B2 (ja) * 2008-03-14 2011-10-26 パナソニック株式会社 基板検査装置及び基板検査方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104908457A (zh) * 2015-06-15 2015-09-16 苏州石丸英合精密机械有限公司 键盘激光自动打标机的气动上料机构

Also Published As

Publication number Publication date
KR101178409B1 (ko) 2012-08-31
WO2012157952A3 (fr) 2013-01-24

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