WO2012157950A2 - Appareil d'inspection de support de carte de circuit imprimé - Google Patents

Appareil d'inspection de support de carte de circuit imprimé Download PDF

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Publication number
WO2012157950A2
WO2012157950A2 PCT/KR2012/003829 KR2012003829W WO2012157950A2 WO 2012157950 A2 WO2012157950 A2 WO 2012157950A2 KR 2012003829 W KR2012003829 W KR 2012003829W WO 2012157950 A2 WO2012157950 A2 WO 2012157950A2
Authority
WO
WIPO (PCT)
Prior art keywords
pcb substrate
inspection
conveyor
pcb
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/003829
Other languages
English (en)
Korean (ko)
Other versions
WO2012157950A3 (fr
Inventor
한충희
김기영
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mer Skilful Feat Co Ltd
Original Assignee
Mer Skilful Feat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mer Skilful Feat Co Ltd filed Critical Mer Skilful Feat Co Ltd
Publication of WO2012157950A2 publication Critical patent/WO2012157950A2/fr
Publication of WO2012157950A3 publication Critical patent/WO2012157950A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Definitions

  • the present invention relates to a PCB substrate inspection apparatus, and more particularly, to a PCB substrate inspection apparatus capable of performing inspection on an PCB substrate efficiently and quickly.
  • SMT Surface Mounting Technology
  • PCB substrates printed circuit boards
  • SMD surface-mounting devices
  • Surface mount lines consist of equipment such as surface mounters and vision inspection equipment.
  • the surface mounter is a device for mounting a surface mount component on a PCB, and receives various surface mount components supplied in a tape, stick, and tray form from a feeder and places them on a mounting position on the PCB. .
  • the vision inspection apparatus inspects the mounting state of the surface mount component before or after the soldering process of the surface mount component is completed and transfers the PCB to the next process according to the inspection result.
  • a typical vision inspection apparatus includes a lighting unit to which light is irradiated using a lamp, and a camera unit which is installed on an upper portion of the lighting unit to photograph image information of various parts mounted on an inspection object.
  • Conventional vision inspection method is to adjust the initial position in the positioning device when the inspection object is transported horizontally through the conveyor, and after the adjustment is completed, the lighting and the like irradiates the printed circuit board, and the camera and each surface-mounted component Take a picture of the lead.
  • the image information is output to the monitor and calculated to inspect the quantity / defect of the surface-mounted component which is the inspection object, or to check whether the surface-mounted component is mounted or not.
  • three-dimensional height is measured by irradiating light through a grating on a PCB substrate which is an inspection object and analyzing a shadow shape formed by the irradiated light on the surface of the inspection object.
  • An object of the present invention is to provide an apparatus for inspecting a substrate substrate that can efficiently and stably inspect a PCB substrate.
  • Another object of the present invention is to provide a PCB substrate inspection apparatus which can improve inspection yield by enabling inspection of a PCB substrate quickly.
  • Another object of the present invention is to provide a PCB substrate inspection apparatus capable of precisely aligning a PCB substrate.
  • Another object of the present invention is to provide a PCB substrate inspection apparatus that can flexibly correspond to the width of a PCB substrate to be inspected.
  • the PCB substrate inspection apparatus for achieving the above object includes a lead portion for introducing the PCB substrate into the inspection region for inspecting the PCB substrate, a pair of first and second inspection portions for inspecting the PCB substrate; And a pair of first and second conveyor shuttle portions for transferring the inserted PCB substrate to the first and second inspection portions, respectively, and a discharge portion for discharging the PCB substrate which has been inspected at a position opposite to the lead portion.
  • the second conveyor shuttle unit introduces or discharges the PCB.
  • the first conveyor shuttle unit introduces or discharges the PCB. It is configured to.
  • the inlet and the outlet are arranged in a fixed position, and may include a pair of conveyor belts, respectively.
  • the pair of first and second conveyor shuttles are configured to reciprocate in a direction perpendicular to the conveying direction of the PCB substrate by the pair of conveyor belts of the inlet portion.
  • the first and second conveyor shuttle unit may include a pair of inspection unit conveyor for transferring the PCB substrate in the discharge direction.
  • the inspection unit conveyor each comprises a pair of PCB substrate transfer roller and the PCB substrate transfer belt.
  • the inspection unit conveyor may be configured to include a PCB substrate support for elastically supporting the PCB substrate.
  • the inspection unit conveyor includes a conveyor width adjusting member for adjusting the distance between the pair of PCB substrate transfer roller and the PCB substrate transfer belt.
  • the inspection unit conveyor may include a substrate stop member configured to be moved in the vertical direction to block the progress of the PCB substrate.
  • the inspection unit conveyor may include a PCB sorting member for displacing the PCB substrate in a direction perpendicular to the direction conveyed by the pair of PCB substrate transfer belt.
  • the inspection unit conveyor is configured to reciprocate in a direction perpendicular to the conveying direction of the PCB substrate in the conveyor shuttle.
  • the inspection conveyor may include an inlet detection sensor for detecting an inlet of the PCB.
  • the conveyor shuttle unit may include a position detecting sensor for detecting the position of the inspection conveyor.
  • the PCB substrate can be inspected efficiently and stably.
  • the inspection yield can be improved by allowing the inspection of the PCB substrate to be performed quickly.
  • the position of the PCB substrate can be precisely aligned.
  • the PCB substrate inspection apparatus which can respond flexibly to the width of the PCB substrate which is a test object.
  • FIG. 1 is a perspective view of a PCB substrate inspection apparatus according to the present invention.
  • FIG. 2 is a plan view of a PCB substrate inspection apparatus according to the present invention.
  • FIG. 4 is a perspective view of the inspection unit conveyor.
  • 5 is a perspective view of the inspection unit.
  • FIG. 1 is a perspective view of a PCB substrate inspection apparatus according to the present invention
  • FIG. 2 is a plan view of a PCB substrate inspection apparatus according to the present invention
  • FIG. 3 is a plan view of a conveyor shuttle unit
  • FIG. 4 is a perspective view of an inspection unit conveyor
  • FIG. 5 Is a perspective view of an inspection part.
  • a PCB substrate inspection apparatus includes an inlet 20 for inserting a PCB into an inspection region 10 for inspecting a PCB and a pair for inspecting the PCB.
  • a pair of first and second conveyor shuttles 40 for transferring the first 30 and second inspection units 35 and the incoming PCB to the first 30 and second inspection units 35, respectively. 50) and a discharge part 60 for discharging the PCB substrate which has been inspected at a position opposite to the inlet part, and when the inspection is performed at the first inspection part 30, the second conveyor shuttle
  • the unit 50 draws in or ejects the PCB, and when the inspection is performed in the second inspection unit 35, the first conveyor shuttle 40 is configured to draw or eject the PCB.
  • the inlet 20 is configured to receive a PCB substrate from a previous process, and includes a pair of conveyor belts 22 and 24 configured to be adjustable in a distance, and arranged in a fixed position in front of the inspection area. do.
  • the pair of inspection units 30 and 35 include a camera, a lens, and various lighting means to perform vision inspection on the PCB substrate, and a pair of lateral movement guides to move in the X and Y directions. It is arranged to be movable on the longitudinal movement guide members 34 and 36 movably disposed on the members 32 and 33.
  • the pair of conveyor shuttle units 40 and 50 receive the PCB substrate from the inlet unit 20 in the inspection region 10 and arrange the PCB substrate under the inspection units 30 and 35.
  • the pair of first and second conveyor shuttles 40 and 50 are configured to reciprocate in a direction perpendicular to the conveying direction of the PCB substrate by the pair of conveyor belts 22 and 24 of the inlet 20. do.
  • the discharge part 60 includes a pair of conveyor belts 62 and 64 that are configured to be adjustable in intervals, such as the inlet part 20, and is disposed in a fixed position behind the inspection area 10. .
  • the first and second conveyor shuttle parts 40 and 50 each include an inspection part conveyor 41 shown in FIG. 4 for transferring the PCB substrate in the discharge part 60 direction.
  • the inspection unit conveyor 41 includes a pair of PCB substrate transfer rollers 43 and a PCB substrate transfer belt 45, respectively.
  • the PCB substrate can be received from the inlet 20 and transferred to the discharge unit 60.
  • the inspection unit conveyor 41 includes a PCB support 46 provided with a support pin 47 for elastically supporting the PCB.
  • the PCB substrate when the PCB substrate is mounted on the inspection unit conveyor 41, the PCB substrate is elastically supported to prevent bending of the substrate substrate.
  • the inspection unit conveyor 41 includes a conveyor width adjusting member 47 for adjusting the interval between a pair of belt for conveying the PCB substrate.
  • the inspection unit conveyor 41 is provided with one or more conveyor width detection sensors 56.
  • the inspection unit conveyor 41 includes a substrate stopping member 49 for stopping the PCB substrate in a proper position by the PCB substrate transfer belt 45.
  • the substrate stop member 49 is configured to be movable in the vertical direction by, for example, a configuration such as an air cylinder, and when configured to stop the PCB substrate at a predetermined position, it is configured to descend to block the PCB substrate, When it is necessary to transfer the inspection PCB substrate in the direction of the discharge unit 60 is configured to be raised so as not to interfere with the transfer of the PCB substrate.
  • At least one PCB detection sensor 53 may be installed at one side of the inspection unit conveyor 41 to detect the PCB.
  • the PCB substrate support part 46 When the PCB substrate is disposed at the position defined by the substrate stop member 49, the PCB substrate support part 46 is lifted, and the support pin 47 elastically supports the PCB substrate.
  • the PCB support plate 52 is also raised to continuously support the edge portion of the PCB substrate, thereby supporting the PCB substrate as a whole.
  • the inspection unit conveyor 41 includes a PCB alignment member 51 for pushing the PCB substrate in a direction perpendicular to the direction transferred by the pair of PCB substrate transfer belts 45.
  • the PCB substrate is pushed in the direction of the frame 42 opposite to the frame on which the PCB alignment member 51 is installed to align the position of the PCB substrate.
  • the inspection unit conveyor 41 is configured to reciprocate in the direction perpendicular to the conveyance direction of the PCB substrate in the conveyor shuttle unit 40.
  • the inspection unit conveyor 41 is installed on the conveyor screw ball shaft 58 and the conveyor transfer guide 59 in the conveyor shuttle unit 40, It is reciprocated by the drive of the conveyor motor 57.
  • one or more shuttle position detecting sensors 55 are installed in the conveyor shuttle unit 40 to detect the position in the conveyor shuttle unit 40 of the inspection unit conveyor 41.
  • the second conveyor shuttle unit 50 is configured to draw the PCB substrate from the inlet 20 or to discharge to the discharge unit 60
  • the first conveyor shuttle unit 40 is configured to draw the PCB substrate from the inlet unit 20 or to discharge the inlet unit 60.
  • the PCB substrate is stably inspected by the simple movement of the two inspection unit conveyors 41 which are moved in a direction perpendicular to the conveying direction of the conveyor belts 22 and 24 of the inlet 20 fixed in position as described above. Not only can be disposed below (30, 35), it can be flexibly applied to the process according to the type of PCB substrate by the conveyor width adjusting member 47 included in the inspection unit conveyor 41.
  • the efficiency of the PCB substrate inspection can be improved while flexibly responding to the types and widths of the various PCB substrates to be inspected.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

La présente invention concerne un appareil d'inspection de support de carte de circuit imprimé comprenant : une partie de chargement destinée à acheminer un support de carte de circuit imprimé dans une zone d'inspection dans laquelle des supports de carte de circuit imprimé sont inspectés; des première et second parties d'inspection permettant d'inspecter le support de carte de circuit imprimé; des première et seconde parties navettes transporteuses permettant de transporter les supports de carte de circuit imprimé qui ont été acheminés jusqu'aux première et seconde parties d'inspection, respectivement; et une partie d'évacuation située à l'opposé de la partie de chargement, pour évacuer le support de carte de circuit imprimé une fois l'inspection terminée, la seconde partie navette transporteuse acheminant ou déchargeant le support de carte de circuit imprimé lorsque l'inspection a lieu dans la première partie d'inspection, et la première partie navette transporteuse acheminant ou déchargeant le support de carte de circuit imprimé lorsque l'inspection a lieu dans la seconde partie d'inspection. La présente invention permet une inspection efficace et stable des supports de carte de circuit imprimé, et en outre, peut améliorer le rendement d'inspection en permettant une inspection rapide des supports de carte de circuit imprimé et permet l'alignement précis de supports de carte de circuit imprimé.
PCT/KR2012/003829 2011-05-18 2012-05-16 Appareil d'inspection de support de carte de circuit imprimé Ceased WO2012157950A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0047021 2011-05-18
KR1020110047021A KR101178403B1 (ko) 2011-05-18 2011-05-18 피시비 기판 검사장치

Publications (2)

Publication Number Publication Date
WO2012157950A2 true WO2012157950A2 (fr) 2012-11-22
WO2012157950A3 WO2012157950A3 (fr) 2013-01-24

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Application Number Title Priority Date Filing Date
PCT/KR2012/003829 Ceased WO2012157950A2 (fr) 2011-05-18 2012-05-16 Appareil d'inspection de support de carte de circuit imprimé

Country Status (2)

Country Link
KR (1) KR101178403B1 (fr)
WO (1) WO2012157950A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017102700A1 (de) 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
CN117665543A (zh) * 2024-01-31 2024-03-08 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 飞针测试装置
CN119667206A (zh) * 2024-12-09 2025-03-21 中山市博测达电子科技有限公司 一种用于pcba的全自动测试机

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101891892B1 (ko) * 2016-11-01 2018-08-27 신흥에스이씨주식회사 캡플레이트 반제품의 제조장치
KR101891893B1 (ko) * 2016-11-01 2018-08-27 신흥에스이씨주식회사 다품종 캡조립체의 제조장치
KR101891891B1 (ko) * 2016-11-01 2018-08-27 신흥에스이씨주식회사 다품종 캡조립체의 제조장치 및 그 방법
KR102753408B1 (ko) * 2022-03-21 2025-01-13 (주)펨트론 기판 검사 시스템
CN116500050B (zh) * 2023-06-28 2024-01-12 四川托璞勒科技有限公司 一种pcb板视觉检测系统

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0139169Y1 (ko) * 1996-09-24 1999-05-15 삼성전자주식회사 Pcb 검사용 pcb 위치설정장치
KR100270519B1 (ko) * 1997-08-21 2001-01-15 구자홍 인쇄회로기판 검사 장치
JP2000012999A (ja) 1998-06-18 2000-01-14 Nagoya Denki Kogyo Kk 基板検査方法およびその装置
JP4803195B2 (ja) * 2008-03-14 2011-10-26 パナソニック株式会社 基板検査装置及び基板検査方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017102700A1 (de) 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
US11061065B2 (en) 2017-02-10 2021-07-13 Xcerra Corp. Testing device and method for testing a printed circuit board
CN117665543A (zh) * 2024-01-31 2024-03-08 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 飞针测试装置
CN119667206A (zh) * 2024-12-09 2025-03-21 中山市博测达电子科技有限公司 一种用于pcba的全自动测试机

Also Published As

Publication number Publication date
WO2012157950A3 (fr) 2013-01-24
KR101178403B1 (ko) 2012-08-31

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