WO2012166086A1 - Dispositif de transfert thermique à profil vertical réduit - Google Patents

Dispositif de transfert thermique à profil vertical réduit Download PDF

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Publication number
WO2012166086A1
WO2012166086A1 PCT/US2011/038299 US2011038299W WO2012166086A1 WO 2012166086 A1 WO2012166086 A1 WO 2012166086A1 US 2011038299 W US2011038299 W US 2011038299W WO 2012166086 A1 WO2012166086 A1 WO 2012166086A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermal transfer
condenser
transfer device
transfer fluid
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/038299
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English (en)
Inventor
Sukhvinder Singh Kang
John Ralph CENNAMO
Bradley Robert Whitney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy LLC
Original Assignee
Aavid Thermalloy LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy LLC filed Critical Aavid Thermalloy LLC
Priority to US14/119,919 priority Critical patent/US20140345829A1/en
Priority to JP2014513482A priority patent/JP6078054B2/ja
Priority to EP11867056.1A priority patent/EP2716147A4/fr
Priority to CN201180072616.4A priority patent/CN103733746B/zh
Priority to PCT/US2011/038299 priority patent/WO2012166086A1/fr
Publication of WO2012166086A1 publication Critical patent/WO2012166086A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Definitions

  • This invention is directed to a thermal transfer device, such as a closed loop fluid cooling system having at least one evaporator, at least one condenser and one or more fluid conduits connecting the evaporator and condenser for use in indirectly cooling objects with a cooling fluid and, more particularly, to a thermal transfer device having a reduced vertical profile for conducting a cooling fluid into indirect thermal contact with an object to be cooled in a compact environment .
  • a thermal transfer device such as a closed loop fluid cooling system having at least one evaporator, at least one condenser and one or more fluid conduits connecting the evaporator and condenser for use in indirectly cooling objects with a cooling fluid and, more particularly, to a thermal transfer device having a reduced vertical profile for conducting a cooling fluid into indirect thermal contact with an object to be cooled in a compact environment .
  • Passive closed loop two-phase fluid cooling systems are well-known thermal transfer devices used for cooling objects that generate excessive heat, such as, without limitation, computer chips.
  • the term passive is meant to denote a system which uses no mechanized pump to circulate the cooling fluid.
  • the motivation for the fluid to circulate in a passive system comes from buoyancy changes and phase changes in the fluid as heat is added.
  • the evaporator is generally placed in thermal contact with the object to be cooled, and a cooling fluid in liquid form is passed over a surface which separates the liquid from the actual object to be cooled. In this fashion, heat may be transferred between the fluid and the object, without the fluid ever coming into direct contact with the object.
  • the addition of heat to the fluid causes at least a portion of the fluid to vaporize.
  • FIG. 1 depicts such a prior art condenser 100
  • Figure lb shows a detail thereof.
  • Prior art condensers coramonly use tubes 102 of circular cross section, or flattened tubes which approximate an oval or rectangular cross section, to provide the condensation surfaces . These tubes are typically disposed with their longitudinal axis vertical. A multitude of air cooling fins 104 with apertures dimensioned to fit the perimeters of these tubes are arranged horizontally.
  • the air cooling fins 104 are interspersed with the condenser tubes and as such the air cooling fins and condenser tubes occupy the same vertical region above the liquid header tank 106 and below the vapor header tank 108.
  • a vapor conduit 110 conducts heated vapor to vapor header tank 108 and a condensate return line 112 returns liquid condensate 114 to a reservoir 116.
  • the air cooling fins 118 are not interspersed with the condenser fins ⁇ within condenser 120, and not shown in Fig. 2 ⁇ .
  • the instant invention can likewise be configured to provide a total air cooling fin area substantially equal to the prior art design.
  • the key benefit of the invention is that the collection point for the condensed fluid (liquid condensate 114) is located substantially higher than that of the prior art design.
  • This key benefit of the invention the ability to locate the condensate surface area and the collection point for the condensed liquid high in the space available and well above the level of the evaporator component, is most apparent in the embodiment of Figure 4 .
  • the difference between the height of liquid in the reservoir (RH) and the height of fluid in the condenser (CH) is the gravitational height (GH) , sometimes referred to as gravitational head.
  • GH-2 of Figure 2 is substantially larger that GH-1 of Figure 1.
  • each design to return condensate from the condenser to the reservoir is directly tied to their respective gravitational heights, GH-1 and GH-2 .
  • GH-1 and GH-2 gravitational heights
  • both the prior art design and the invention can be configured to have substantially equal air cooling fin area and internal condenser surface area, the invention can operate at a higher heat load by virtue of its higher GH. This is because the mass transport rate of condensate return is directly related to the maximum amount of heat transfer achievable.
  • Figure 3 depicts a prior art type design configured to provide the same gravitational height as with the invention (GH-2) .
  • this configuration provides for substantially less vertical space for the air cooling fins and condenser tubes as there is a region 122 below the condenser that cannot be used. The reduction in air cooling fin area and condenser tube area renders this configuration inferior to the invention.
  • the invention can transfer a higher heat load compared to condensers of the prior art design in applications demanding a relatively low available height (AH), i.e., "low profile” designs.
  • AH available height
  • United States Patent No. 7,422,052 discloses a low profile cooling system with a substantially horizontally disposed condenser component.
  • the condenser is generally similar to prior art vertical, or standing, condensers, except that it is angled closer to the horizontal while still at a shallow incline. This provides the benefit of a reduced vertical profile, at the expense of a substantially increased horizontal profile.
  • United States Patent No. 7,231,961 also discloses a low profile cooling system. This reference specifies a condenser as "a long chamber having a narrow interior channel".
  • This chamber is oriented with its "long" dimension oriented substantially parallel to the horizontal plane where the horizontal plane is taken to mean the plane on which the device to be cooled is mounted, e.g., the plane of a circuit board bearing the chip / processor to be cooled.
  • One side of this chamber (a substantially vertical exterior surface) is populated with air cooling fins.
  • the chamber is oriented with its "long" dimension oriented substantially parallel to the horizontal plane where the horizontal plane is taken to mean the plane on which the device to be cooled is mounted, e.g., the plane of a circuit board bearing the chip / processor to be cooled.
  • One side of this chamber (a substantially vertical exterior surface) is populated with air cooling fins.
  • the chamber is disposed with its longitudinal axis horizontal instead of vertical.
  • the design achieves a low vertical profile simply by placing the condenser tube in a horizontal configuration. This is done clearly at the expense of gravitational height.
  • This limitation is expressly recited in column 5, lines 12-19;
  • the condensers of thermosyphons are placed over or higher than the evaporators to utilize gravity to force the liquid from the condenser to the evaporator. This placement is not possible in spaces where the available height is severely limited. Although part of the condenser may be higher than the evaporator, or vice versa, the condenser and evaporator are approximately horizontal to each other in the present invention. "
  • condensers are generally well known and widely used, there is a continuing need to make condensers more efficient, and, therefore, more competitive, cost-effective and useful. It is especially useful to provide a condenser that can be used for cooling an object in a very compact environment while providing adequate internal condenser surface area coupled with adequate gravitational height for transport of the condensate.
  • a thermal transfer device which includes a chamber having substantially vertical condenser fins for condensing a heated thermal transfer fluid from vapor to liquid.
  • the chamber has an inlet for receiving the vapor and an outlet for conducting the condensed fluid in its liquid state back to a reservoir.
  • the inlet and the outlet are both positioned at a level higher than the level of the liquid thermal transfer fluid in the reservoir.
  • the vertical condenser fins which provide the condensing surfaces are positioned substantially in the vertical space between the inlet and the outlet. The benefit of this arrangement is that it leaves a larger portion of the available vertical height for gravitational return of the condensate to the evaporator.
  • This arrangement likewise allows for a significant change in the height of the liquid in the liquid return line without the negative consequence of driving liquid into the condenser component (which, if it occurs, renders some portion of the condenser inoperative) .
  • This structure permits the device to achieve good condensation performance and have an overall reduced vertical profile. Additionally, this structure permits the device to have an overall reduced vertical profile in which the depth of the chamber is greater than the height of the interior of the chamber.
  • the condenser fins within the chamber may include flutes on their surfaces to increase the effective cooling surface within the chamber.
  • the flutes may be disposed in matched opposed pairs on opposed sides of the fins, or may be staggered in alternation on opposing sides as a matter of design choice.
  • one or more of the external surfaces of the chamber will be fitted with a multitude of air cooling fins in thermal communication with the chamber.
  • the surfaces employed are most typically the top or bottom surface. Although a multitude of fins (sometimes referred to as an array of fins) are most commonly employed, a singular fin can be used as well. Air is passed over the air cooling fin or fins either by natural convection means or by forced convection means.
  • a liquid cold plate can be placed on either the top surface or bottom surface of the chamber, or both. Used in this manner, a cold plate will be fixed to the chamber in so as to be in thermal communication with the chamber. A cooling fluid is circulated through the cold plate. The cooling provided by the cooling fluid causes the vapor inside the chamber to condense.
  • the term "Liquid Cold Plate” is interchangeable with "Liquid Cooled Heat Sink” and both terms are well known in the art.
  • An example of a liquid cooled heat sink is disclosed in United States Patent No. 5,829,516 and is herein incorporated by reference.
  • Figures la and lb are a schematic illustration of a prior art thermal transfer device
  • FIGS. 2a and 2b are a schematic illustration of the inventive thermal transfer device
  • Figures 3a and 3b are a schematic illustration of a prior art thermal transfer device configured with the condenser elevated above the surface on which the evaporator sits;
  • Figures 4a and 4b are a schematic illustration of the preferred embodiment of the inventive thermal transfer device configured for operation in low vertical profile applications;
  • Figure 5 is a schematic illustration of a chamber used in a first embodiment of the inventive thermal transfer device
  • Figure 6a is a schematic illustration of a secondary embodiment of the chamber used in the inventive thermal transfer device
  • Figure 6b is a schematic illustration of a tertiary embodiment of the chamber used in the inventive thermal transfer device
  • Figure 7 is a perspective view of the thermal transfer device of Fig. 4 showing a multitude of air cooled fins attached to the bottom of the condenser chamber, with arrows depicting cooling air traversing the air cooled fins;
  • Figure 8 is a perspective view of the condenser component of the thermal transfer device of Fig. 4 with a cut-away in the top of the chamber to allow viewing of internal structure;
  • Figures 9a and 9b are cross-sections of differing embodiments of fins and flutes used in the inventive thermal transfer device
  • Figure 10 is a schematic cross-section of a single tube embodiment of the inventive thermal transfer device ;
  • FIG 11 is a perspective view of a further embodiment of the inventive thermal transfer device with a liquid cooled heat sink, also known as a liquid cold plate, placed in thermal communication with lower external surface of condenser chamber, with arrows depicting cooling fluid entering and leaving the liquid cold plate;
  • a liquid cooled heat sink also known as a liquid cold plate
  • Figures 12a, 12b and 12c are schematic illustrations of the preferred embodiment of the invention mounted on a circuit board and further comprising a bulkhead to separate the region of the circuit board from the region of the condenser component;
  • Figure 13a is a schematic illustration of the condenser component of the inventive thermal transfer device where the condenser chamber is shown in cross- section and the condenser chamber is located in vertical region B, entirely above vertical region A where one array of air cooling fins is located;
  • Figure 13b is a schematic illustration of the condenser component of the inventive thermal transfer device where the condenser chamber is shown in cross- section and the condenser chamber is located in vertical region B, substantially above vertical region A where one array of air cooling fins is located.
  • Thermal transfer device 10 includes a reservoir 12 acting as an evaporator, for holding a thermal transfer fluid 14, a first conduit 16 for conducting thermal transfer fluid 14 out of reservoir 12 when the thermal transfer fluid is in a vapor state, and a second conduit 18 for conducting thermal transfer fluid 14 back to reservoir 12 once thermal transfer fluid 14 has condensed from its vapor state to a liquid state.
  • the maximum height to which the liquid portion of the thermal transfer fluid can rise before flooding the condensing surfaces is denominated as h in Fig. 4.
  • thermal transfer fluid 14 is water or deionized water.
  • organic cooling fluids such as alcohols, refrigerants such as R134A or engineered fluids such as 3M Fluorinert or Novec Liquids may be used.
  • Thermal transfer device 10 also includes a chamber 20, acting as a condenser, having an inlet 22 (Fig. 7) coupled to first conduit 16 and an outlet 24 coupled to second conduit 18.
  • chamber 20 is hermetic and made of metal, such as aluminum or copper.
  • Figures 5 and 8 show one of a plurality of substantially vertical condenser fins 26 positioned within chamber 20 to provide cooling surfaces for thermal transfer fluid 14 to condense from its vapor state when it is introduced to chamber 20 to its liquid state for return to reservoir 12. Fins 26 are spaced from one another to form passages therebetween through which thermal transfer fluid 14 may flow, and contact more of the surfaces of cooling fins 26.
  • a first open header space 32 (Figs. 5 and 6a) is provided at the top of chamber 20.
  • First open header space 32 spans substantially the entire width of chamber 20, which permits the unimpeded flow of thermal transfer fluid 14 in a vapor state over the entire width of chamber 20, and then along the passages to the entire depth of chamber 20. (Depth, width and height orientations are shown in Fig. 8.) Allowing the smooth distribution of the vapor to the entire depth and width of 20 exposes the maximum cooling surface area of cooling fins 26 in a most efficient manner.
  • Second open header space 34 extends substantially the entire width of chamber 20 and opens into outlet 24.
  • a singular contiguous header space illustrated as 33 in Fig. 6b
  • a singular contiguous header space can be used as a matter of design choice as the higher density of the condensate (compared to the vapor) will lead to the condensate naturally collecting in the lower portion of the singular header space leaving the upper portion available for the vapor.
  • Inlet 22 may either be positioned in the top of chamber 20, as shown in Fig. 5 and 6b, or in the side of chamber 20 as shown in Fig. 6a. In either configuration, the vapor of thermal transfer fluid 14 will enter first header space 32 , and condense on fins 26 as described.
  • the choice of construction is a mere matter of design choice and will depend upon the requirements of the application, and the selection of the appropriate position for inlet 22 is well within the skill of one of ordinary skill in the art.
  • the structural arrangement of the present invention allows for all of the condensing surfaces to be located gravitationally above the liquid level in both the reservoir and the liquid return conduit. This structure provides the further benefit that the condensing surfaces, together with the chamber housing them, occupy a relatively small portion of the vertical height available for the entire thermal transfer device.
  • Figure 7 shows an embodiment of the invention in which air cooled fins 30 ' are attached to the bottom external surface of the condenser chamber.
  • a liquid-cooled cold plate 30 as shown in Fig 11, or any other known method of providing cooling to condenser, can be used in place of the air cooled fins .
  • a further possibility for improving the performance of thermal transfer device 10 is to provide fins 26 with flutes 40 , as shown in Figs. 9a and 9b.
  • Flutes 40 may be either positioned as matched pairs on opposing sides of fins 26 (Fig. 9a) or in a staggered arrangement as shown in Fig. 9b, as a matter of design choice .
  • a thermal transfer device 40 together with the microprocessor being cooled is mounted on a circuit board.
  • the circuit board which includes an electrical connector 42 disposed near one of its peripheral edges, can be inserted into another structure such as a slot within a computer chassis.
  • Thermal transfer device 40 bears a liquid cold plate 44 which provides the cooling means for condenser 20 as well as an electrical connector 46 dimensioned to mate with electrical connecter 42 on the circuit board.
  • the cooling fluid circulating through the liquid cold plate 44 can be provided by a number of means well known in the art of cooling of servers, mainframe computers and telecom equipment. Two specific examples are as follows; [1] a dedicated standalone chiller can provide the cooling fluid, typically de-ionized water at a pre-determined temperature and at a pre-determined volumetric flow rate. The temperature of the liquid entering the cold plate is set according to the desired maximum operating temperature of the microprocessor being cooled. The volumetric flow rate of the cooling fluid is set according to the total amount of wattage that needs to be transferred and by the maximum desired temperature rise of the cooling fluid within the liquid cold plate.
  • cooling fluid temperature entering the cold plate can be accomplished with well known and long standing engineering methods and would not require an undue amount of experimentation.
  • the building facility housing the equipment being cooled for example, a data center housing and supporting many servers, could provide cooling water at a sufficient volumetric flow rate at a pre-determined temperature and pressure. This is sometimes referred to as "utility water”. Designing the liquid cold plate based on these values to achieve the thermal transfer required can, as in the previous example, be accomplished with well known and long standing engineering methods.
  • the advantage of this embodiment is that a fluid cooled electronic component such a chip or micro processor together with the circuit board on which it is mounted can be removed for repair or replacement without disturbing the plumbing providing cooling fluid to, or removing cooling fluid from, the liquid cold plate component.
  • This in turn lowers the risk of using water to indirectly cool an electronic component in that in normal operation, including service and maintenance, there is less risk of cooling water escaping and damaging the electronic components.
  • This benefit can be further enhanced by providing a physical barrier, for example a bulkhead or wall 50 separating the circuit board region from the liquid cold plate region.
  • the physical barrier could be in the form of an enclosure (such as suggested by dotted line 52) housing the circuit board where the condenser component and electrical connector protrude through one wall of enclosure. As shown in Fig. 12c, the structure could even completely enclose condenser 20, leaving interface material 48 on the exterior of enclosure 52' .
  • the liquid cold plate mates with the inclined bottom surface of condenser 20.
  • Liquid cold plate 44 is provided with a correspondingly angled upper surface.
  • the circuit board is moved horizontally to engage both electrical connector 46 and liquid cold plate 44.
  • a spring 54 urges the upper surface of the liquid cold plate towards the lower surface of the condenser component to provide good thermal communication at the interface.
  • a liquid cold plate can be used on the lower surface of the condenser, the upper surface, or both.
  • the liquid cold plate has an inclined surface, this simply represents a design choice.
  • a cold plate whose upper and lower surfaces are parallel (as is most commonly the case) can be used by inclining the entire cold plate as needed to mate with the inclined surface of the condenser component.
  • the inventive thermal transfer device has a reduced vertical profile when compared to known prior art devices, and provides improved and efficient thermal transfer, particularly for applications providing a limited vertical space by virtue of the invention's configuration .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur un dispositif de transfert thermique ayant un profil vertical réduit. Le dispositif comprend un condenseur muni des ailettes de refroidissement internes sensiblement verticales. Une entrée conduit un fluide de transfert thermique sous un état de vapeur vers les sommets des ailettes de refroidissement où la vapeur se condense et s'écoule vers le bas des ailettes vers le fond du condenseur. Le fond du condenseur est en angle vers une sortie pour conduire le fluide de transfert thermique liquide vers un réservoir pour contenir le fluide. L'entrée et la sortie sont toutes deux positionnées à une certaine hauteur au-dessus du niveau du fluide de transfert thermique à l'état liquide dans le réservoir. Le dispositif peut également comprendre des ailettes sur l'extérieur du condenseur pour produire des surfaces de refroidissement qui ne viennent pas en contact avec le fluide de transfert thermique dans les états soit liquide soit de vapeur.
PCT/US2011/038299 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit Ceased WO2012166086A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US14/119,919 US20140345829A1 (en) 2011-05-27 2011-05-27 Thermal Transfer Device with Reduced Vertical Profile
JP2014513482A JP6078054B2 (ja) 2011-05-27 2011-05-27 高さが減少した熱伝達装置
EP11867056.1A EP2716147A4 (fr) 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit
CN201180072616.4A CN103733746B (zh) 2011-05-27 2011-05-27 竖向剖面缩小的传热装置
PCT/US2011/038299 WO2012166086A1 (fr) 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/038299 WO2012166086A1 (fr) 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit

Publications (1)

Publication Number Publication Date
WO2012166086A1 true WO2012166086A1 (fr) 2012-12-06

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PCT/US2011/038299 Ceased WO2012166086A1 (fr) 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit

Country Status (5)

Country Link
US (1) US20140345829A1 (fr)
EP (1) EP2716147A4 (fr)
JP (1) JP6078054B2 (fr)
CN (1) CN103733746B (fr)
WO (1) WO2012166086A1 (fr)

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US10349561B2 (en) 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
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CN113784599B (zh) * 2016-08-24 2024-08-27 台达电子工业股份有限公司 散热组件
US11236948B2 (en) 2016-08-24 2022-02-01 Delta Electronics, Inc. Heat dissipation assembly
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CN114423232A (zh) * 2017-04-28 2022-04-29 株式会社村田制作所 均热板、散热设备以及电子设备
CN107339900A (zh) * 2017-08-22 2017-11-10 无锡马山永红换热器有限公司 新型板翅式冷却器
CN109714931B (zh) * 2017-10-26 2020-08-18 深圳富泰宏精密工业有限公司 应用散热结构的电子设备
US11754344B2 (en) * 2018-01-19 2023-09-12 Sumitomo Precision Products Co., Ltd. Boiling cooler
US10568238B1 (en) * 2018-08-10 2020-02-18 Facebook, Inc. Modular network switch
TWI690686B (zh) * 2018-10-31 2020-04-11 英業達股份有限公司 冷卻裝置
CN113163683B (zh) * 2021-04-02 2023-05-30 西安易朴通讯技术有限公司 液冷散热设备、机柜及系统
WO2024019912A1 (fr) * 2022-07-20 2024-01-25 KYOCERA AVX Components Corporation Terminaisons de composants de dissipateur thermique
CN117848122A (zh) * 2023-12-18 2024-04-09 浙江台信应用科技有限公司 塔型冷媒两相变化虹吸式散热器

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EP2716147A1 (fr) 2014-04-09
US20140345829A1 (en) 2014-11-27
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EP2716147A4 (fr) 2015-08-26
CN103733746A (zh) 2014-04-16
JP6078054B2 (ja) 2017-02-08

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