CN103733746B - 竖向剖面缩小的传热装置 - Google Patents

竖向剖面缩小的传热装置 Download PDF

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Publication number
CN103733746B
CN103733746B CN201180072616.4A CN201180072616A CN103733746B CN 103733746 B CN103733746 B CN 103733746B CN 201180072616 A CN201180072616 A CN 201180072616A CN 103733746 B CN103733746 B CN 103733746B
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CN
China
Prior art keywords
heat transfer
condenser
fins
transfer device
transfer fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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CN201180072616.4A
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English (en)
Chinese (zh)
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CN103733746A (zh
Inventor
苏克温德·辛格·康
约翰·拉尔夫·琴纳莫
布雷德利·罗伯特·惠特尼
伦道夫·H·库克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy LLC
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Aavid Thermalloy LLC
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Publication of CN103733746A publication Critical patent/CN103733746A/zh
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Publication of CN103733746B publication Critical patent/CN103733746B/zh
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201180072616.4A 2011-05-27 2011-05-27 竖向剖面缩小的传热装置 Active CN103733746B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/038299 WO2012166086A1 (fr) 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit

Publications (2)

Publication Number Publication Date
CN103733746A CN103733746A (zh) 2014-04-16
CN103733746B true CN103733746B (zh) 2017-05-03

Family

ID=47259642

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180072616.4A Active CN103733746B (zh) 2011-05-27 2011-05-27 竖向剖面缩小的传热装置

Country Status (5)

Country Link
US (1) US20140345829A1 (fr)
EP (1) EP2716147A4 (fr)
JP (1) JP6078054B2 (fr)
CN (1) CN103733746B (fr)
WO (1) WO2012166086A1 (fr)

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WO2013140761A1 (fr) * 2012-03-22 2013-09-26 日本電気株式会社 Structure de refroidissement pour substrat électronique et dispositif électronique l'utilisant
JP6179145B2 (ja) * 2013-03-18 2017-08-16 富士通株式会社 電子機器システム
JP5986064B2 (ja) 2013-12-25 2016-09-06 Ｎｅｃプラットフォームズ株式会社 冷却システムおよび電子機器
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
KR102424963B1 (ko) 2015-07-30 2022-07-25 삼성전자주식회사 집적회로 소자 및 그 제조 방법
JP6309928B2 (ja) * 2015-09-24 2018-04-11 Ｎｅｃプラットフォームズ株式会社 冷却システムおよび電子機器
US10349561B2 (en) * 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
CN106231871B (zh) * 2016-08-23 2018-04-20 山东时风（集团）有限责任公司 一种电动车辆控制器的散热装置
CN113784599B (zh) * 2016-08-24 2024-08-27 台达电子工业股份有限公司 散热组件
US11236948B2 (en) 2016-08-24 2022-02-01 Delta Electronics, Inc. Heat dissipation assembly
US12439561B2 (en) 2017-03-12 2025-10-07 Zuta-Core Ltd. Systems and methods for heat exchange
US11778783B2 (en) 2017-03-12 2023-10-03 Zuta-Core Ltd. Cooling systems and methods
CN114423232A (zh) * 2017-04-28 2022-04-29 株式会社村田制作所 均热板、散热设备以及电子设备
CN107339900A (zh) * 2017-08-22 2017-11-10 无锡马山永红换热器有限公司 新型板翅式冷却器
CN109714931B (zh) * 2017-10-26 2020-08-18 深圳富泰宏精密工业有限公司 应用散热结构的电子设备
US11754344B2 (en) * 2018-01-19 2023-09-12 Sumitomo Precision Products Co., Ltd. Boiling cooler
US10568238B1 (en) * 2018-08-10 2020-02-18 Facebook, Inc. Modular network switch
TWI690686B (zh) * 2018-10-31 2020-04-11 英業達股份有限公司 冷卻裝置
CN113163683B (zh) * 2021-04-02 2023-05-30 西安易朴通讯技术有限公司 液冷散热设备、机柜及系统
WO2024019912A1 (fr) * 2022-07-20 2024-01-25 KYOCERA AVX Components Corporation Terminaisons de composants de dissipateur thermique
CN117848122A (zh) * 2023-12-18 2024-04-09 浙江台信应用科技有限公司 塔型冷媒两相变化虹吸式散热器

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US20030128508A1 (en) * 2002-01-04 2003-07-10 Faneuf Barrett M. Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices
CN1893799A (zh) * 2005-07-08 2007-01-10 富准精密工业(深圳)有限公司 环路式散热模组
US20070246197A1 (en) * 2006-04-20 2007-10-25 Ilya Reyzin Low profile thermosiphon
CN101283177A (zh) * 2005-07-30 2008-10-08 艾提丘克事业有限责任公司 叶片穿过式冷凝器及其散热系统
CN101960937A (zh) * 2007-12-19 2011-01-26 集群系统公司 用于接触冷却电子模块的冷却系统

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US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030128508A1 (en) * 2002-01-04 2003-07-10 Faneuf Barrett M. Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices
CN1893799A (zh) * 2005-07-08 2007-01-10 富准精密工业(深圳)有限公司 环路式散热模组
CN101283177A (zh) * 2005-07-30 2008-10-08 艾提丘克事业有限责任公司 叶片穿过式冷凝器及其散热系统
US20070246197A1 (en) * 2006-04-20 2007-10-25 Ilya Reyzin Low profile thermosiphon
CN101960937A (zh) * 2007-12-19 2011-01-26 集群系统公司 用于接触冷却电子模块的冷却系统

Also Published As

Publication number Publication date
JP2014517906A (ja) 2014-07-24
EP2716147A1 (fr) 2014-04-09
US20140345829A1 (en) 2014-11-27
WO2012166086A1 (fr) 2012-12-06
EP2716147A4 (fr) 2015-08-26
CN103733746A (zh) 2014-04-16
JP6078054B2 (ja) 2017-02-08

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Inventor after: KANG SUKHVINDER SINGH

Inventor after: CENNAMO JOHN RALPH

Inventor after: WHITNEY BRADLEY ROBERT

Inventor after: Cook Randolph H.

Inventor before: KANG SUKHVINDER SINGH

Inventor before: CENNAMO JOHN RALPH

Inventor before: WHITNEY BRADLEY ROBERT

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: KANG SUKHVINDER S. CENNAMO JOHN R. WHITNEY BRADLEY R. TO: KANG SUKHVINDER S. CENNAMO JOHN R. WHITNEY BRADLEY R. COOK RANDOLPH H.

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