JP6078054B2 - 高さが減少した熱伝達装置 - Google Patents

高さが減少した熱伝達装置 Download PDF

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Publication number
JP6078054B2
JP6078054B2 JP2014513482A JP2014513482A JP6078054B2 JP 6078054 B2 JP6078054 B2 JP 6078054B2 JP 2014513482 A JP2014513482 A JP 2014513482A JP 2014513482 A JP2014513482 A JP 2014513482A JP 6078054 B2 JP6078054 B2 JP 6078054B2
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Japan
Prior art keywords
heat transfer
condenser
transfer device
transfer fluid
chamber
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Expired - Fee Related
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JP2014513482A
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English (en)
Japanese (ja)
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JP2014517906A (ja
Inventor
カン，スクビンダル，シン
ケナモ，ジョン，ラルフ
ホイットニー，ブラッドリー，ロバート
クック，ランドルフ，エイチ．
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アアヴィッド・サーマロイ・エルエルシー
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014513482A 2011-05-27 2011-05-27 高さが減少した熱伝達装置 Expired - Fee Related JP6078054B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/038299 WO2012166086A1 (fr) 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016056729A Division JP2016153720A (ja) 2016-03-22 2016-03-22 高さが減少した熱伝達装置

Publications (2)

Publication Number Publication Date
JP2014517906A JP2014517906A (ja) 2014-07-24
JP6078054B2 true JP6078054B2 (ja) 2017-02-08

Family

ID=47259642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014513482A Expired - Fee Related JP6078054B2 (ja) 2011-05-27 2011-05-27 高さが減少した熱伝達装置

Country Status (5)

Country Link
US (1) US20140345829A1 (fr)
EP (1) EP2716147A4 (fr)
JP (1) JP6078054B2 (fr)
CN (1) CN103733746B (fr)
WO (1) WO2012166086A1 (fr)

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JP5986064B2 (ja) 2013-12-25 2016-09-06 Ｎｅｃプラットフォームズ株式会社 冷却システムおよび電子機器
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
KR102424963B1 (ko) 2015-07-30 2022-07-25 삼성전자주식회사 집적회로 소자 및 그 제조 방법
JP6309928B2 (ja) * 2015-09-24 2018-04-11 Ｎｅｃプラットフォームズ株式会社 冷却システムおよび電子機器
US10349561B2 (en) * 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
CN106231871B (zh) * 2016-08-23 2018-04-20 山东时风（集团）有限责任公司 一种电动车辆控制器的散热装置
CN113784599B (zh) * 2016-08-24 2024-08-27 台达电子工业股份有限公司 散热组件
US11236948B2 (en) 2016-08-24 2022-02-01 Delta Electronics, Inc. Heat dissipation assembly
US12439561B2 (en) 2017-03-12 2025-10-07 Zuta-Core Ltd. Systems and methods for heat exchange
US11778783B2 (en) 2017-03-12 2023-10-03 Zuta-Core Ltd. Cooling systems and methods
CN114423232A (zh) * 2017-04-28 2022-04-29 株式会社村田制作所 均热板、散热设备以及电子设备
CN107339900A (zh) * 2017-08-22 2017-11-10 无锡马山永红换热器有限公司 新型板翅式冷却器
CN109714931B (zh) * 2017-10-26 2020-08-18 深圳富泰宏精密工业有限公司 应用散热结构的电子设备
US11754344B2 (en) * 2018-01-19 2023-09-12 Sumitomo Precision Products Co., Ltd. Boiling cooler
US10568238B1 (en) * 2018-08-10 2020-02-18 Facebook, Inc. Modular network switch
TWI690686B (zh) * 2018-10-31 2020-04-11 英業達股份有限公司 冷卻裝置
CN113163683B (zh) * 2021-04-02 2023-05-30 西安易朴通讯技术有限公司 液冷散热设备、机柜及系统
WO2024019912A1 (fr) * 2022-07-20 2024-01-25 KYOCERA AVX Components Corporation Terminaisons de composants de dissipateur thermique
CN117848122A (zh) * 2023-12-18 2024-04-09 浙江台信应用科技有限公司 塔型冷媒两相变化虹吸式散热器

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Also Published As

Publication number Publication date
JP2014517906A (ja) 2014-07-24
EP2716147A1 (fr) 2014-04-09
US20140345829A1 (en) 2014-11-27
CN103733746B (zh) 2017-05-03
WO2012166086A1 (fr) 2012-12-06
EP2716147A4 (fr) 2015-08-26
CN103733746A (zh) 2014-04-16

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