WO2012173460A3 - 경화성 조성물 - Google Patents

경화성 조성물 Download PDF

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Publication number
WO2012173460A3
WO2012173460A3 PCT/KR2012/004820 KR2012004820W WO2012173460A3 WO 2012173460 A3 WO2012173460 A3 WO 2012173460A3 KR 2012004820 W KR2012004820 W KR 2012004820W WO 2012173460 A3 WO2012173460 A3 WO 2012173460A3
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
composition
led
present application
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/004820
Other languages
English (en)
French (fr)
Other versions
WO2012173460A2 (ko
Inventor
김민균
고민진
문명선
정재호
최범규
강대호
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
Original Assignee
LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Priority to EP12800817.4A priority Critical patent/EP2722366B1/en
Priority to JP2014515769A priority patent/JP5831958B2/ja
Priority to CN201280029919.2A priority patent/CN103608408B/zh
Publication of WO2012173460A2 publication Critical patent/WO2012173460A2/ko
Publication of WO2012173460A3 publication Critical patent/WO2012173460A3/ko
Priority to US14/109,179 priority patent/US9123647B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Liquid Crystal (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 출원은, 경화성 조성물, 발광 다이오드, 액정표시장치 및 조명 기구에 관한 것이다. 본 출원에서는, 가공성 및 작업성이 뛰어나고, 경화 후에 내크렉성, 경도, 내열성, 내열충격성, 투명성 및 접착성이 우수한 경화성 조성물을 제공할 수 있다. 상기 조성물은, 적용된 후에 백탁을 나타내지 않고, 표면에서의 끈적임도 없다. 상기 조성물은, 예를 들면, LED, CCD 또는 포토커플러 등과 같은 광반도체 소자의 접착 소재 또는 봉지 소재로 유용하게 사용될 수 있다.
PCT/KR2012/004820 2011-06-17 2012-06-18 경화성 조성물 Ceased WO2012173460A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP12800817.4A EP2722366B1 (en) 2011-06-17 2012-06-18 Curable composition
JP2014515769A JP5831958B2 (ja) 2011-06-17 2012-06-18 硬化性組成物
CN201280029919.2A CN103608408B (zh) 2011-06-17 2012-06-18 可固化组合物
US14/109,179 US9123647B2 (en) 2011-06-17 2013-12-17 Curable composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20110059102 2011-06-17
KR10-2011-0059102 2011-06-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/109,179 Continuation US9123647B2 (en) 2011-06-17 2013-12-17 Curable composition

Publications (2)

Publication Number Publication Date
WO2012173460A2 WO2012173460A2 (ko) 2012-12-20
WO2012173460A3 true WO2012173460A3 (ko) 2013-03-28

Family

ID=47357645

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004820 Ceased WO2012173460A2 (ko) 2011-06-17 2012-06-18 경화성 조성물

Country Status (6)

Country Link
US (1) US9123647B2 (ko)
EP (1) EP2722366B1 (ko)
JP (2) JP5831958B2 (ko)
KR (1) KR101518104B1 (ko)
CN (1) CN103608408B (ko)
WO (1) WO2012173460A2 (ko)

Families Citing this family (8)

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JP2014169415A (ja) * 2013-03-05 2014-09-18 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
TWI468415B (zh) * 2013-06-13 2015-01-11 Daxin Materials Corp 矽氧烷二酸酐、聚合物、液晶配向劑、液晶配向膜及液晶顯示元件
KR20150066969A (ko) * 2013-12-09 2015-06-17 제일모직주식회사 봉지재 조성물, 봉지재, 및 전자 소자
CN107464867B (zh) * 2017-07-14 2019-06-14 上海盛丽光电科技有限公司 一种led用大尺寸氮化镓半导体片的制备方法
JP7296539B2 (ja) * 2019-11-18 2023-06-23 Ａｇｃ株式会社 支持ガラス基板及び積層体
CN111100463A (zh) * 2019-12-26 2020-05-05 广东盈骅新材料科技有限公司 环氧改性硅树脂组合物及其应用
US20220041903A1 (en) * 2020-08-04 2022-02-10 Samsung Sdi Co., Ltd. Adhesive film, optical member including the same, and optical display including the same
KR20250038047A (ko) * 2023-09-11 2025-03-19 주식회사 케이씨씨 몰딩용 에폭시 수지 조성물

Citations (4)

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JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP2006306957A (ja) * 2005-04-27 2006-11-09 Fujikura Ltd 導電材料および導電膜ならびにそれらの製造方法
KR20070016988A (ko) * 2005-08-03 2007-02-08 신에쓰 가가꾸 고교 가부시끼가이샤 발광 다이오드용 부가 경화형 실리콘 수지 조성물
KR20110057136A (ko) * 2008-09-03 2011-05-31 니폰 가야꾸 가부시끼가이샤 실록산 화합물, 경화성 수지 조성물, 그 경화물 및 광반도체 소자

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Publication number Priority date Publication date Assignee Title
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
JP2006306957A (ja) * 2005-04-27 2006-11-09 Fujikura Ltd 導電材料および導電膜ならびにそれらの製造方法
KR20070016988A (ko) * 2005-08-03 2007-02-08 신에쓰 가가꾸 고교 가부시끼가이샤 발광 다이오드용 부가 경화형 실리콘 수지 조성물
KR20110057136A (ko) * 2008-09-03 2011-05-31 니폰 가야꾸 가부시끼가이샤 실록산 화합물, 경화성 수지 조성물, 그 경화물 및 광반도체 소자

Also Published As

Publication number Publication date
US9123647B2 (en) 2015-09-01
JP6066140B2 (ja) 2017-01-25
EP2722366A2 (en) 2014-04-23
WO2012173460A2 (ko) 2012-12-20
KR101518104B1 (ko) 2015-05-06
EP2722366A4 (en) 2015-01-21
CN103608408B (zh) 2016-04-13
US20140175333A1 (en) 2014-06-26
KR20120139614A (ko) 2012-12-27
EP2722366B1 (en) 2023-01-04
JP5831958B2 (ja) 2015-12-16
JP2015193850A (ja) 2015-11-05
CN103608408A (zh) 2014-02-26
JP2014518292A (ja) 2014-07-28

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