WO2017018580A1 - Appareil à moule de gaufrage et procédé de préparation de produit au moyen dudit appareil - Google Patents

Appareil à moule de gaufrage et procédé de préparation de produit au moyen dudit appareil Download PDF

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Publication number
WO2017018580A1
WO2017018580A1 PCT/KR2015/008750 KR2015008750W WO2017018580A1 WO 2017018580 A1 WO2017018580 A1 WO 2017018580A1 KR 2015008750 W KR2015008750 W KR 2015008750W WO 2017018580 A1 WO2017018580 A1 WO 2017018580A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
release film
layer
chip
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/008750
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English (en)
Korean (ko)
Inventor
류기택
박형근
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FINETECH Co Ltd
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FINETECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FINETECH Co Ltd filed Critical FINETECH Co Ltd
Publication of WO2017018580A1 publication Critical patent/WO2017018580A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor

Definitions

  • the present invention relates to an embossed mold apparatus and a method for manufacturing a product using the same. More particularly, the embossed mold apparatus and a product using the embossed mold apparatus enable mass production of the product quickly and efficiently while eliminating defects by a simple configuration. It relates to a manufacturing method.
  • Such an embossed mold is a mold using a blade formed by embossing, and is typically produced by CNC precision machining after etching a thin steel sheet from 0.6mm to 3mm according to the shape.
  • Embossed molds are easy to mount, easy to use, can be applied to all presses, and are highly suitable for machining precision products.They do not have adhesive components attached to the punch and can remove chips at the same time. There are advantages.
  • Embossed molds have been applied to various fields such as flexible printed circuit boards, double-sided tapes, packing materials, insulators, precision processing materials, liquid crystal displays, and protective films due to the aforementioned advantages.
  • the embossed mold processes the workpiece into blades with a specific pattern, in which chips are cut by the blades, which remain in the workpiece or are attached to the blade.
  • the chip cut by the blade is manually removed by the operator, and this operation takes a considerable amount of time, and in the case of a small chip, the chip is not easily seen by the operator. Occurred.
  • these prior arts employ an operation mechanism that protrudes the pin to eject the chip and then sucks the discharged chip back into the air to remove the chip.
  • an operation mechanism can reduce the incidence of defective products.
  • the process delay according to the operation sequence is inevitable, and this process delay naturally has a problem that acts as a factor that lowers the yield.
  • a method using a method of removing chips, which are by-products of processing the workpiece is applied by using a separate member having an attachment ability such as a release tape.
  • the present invention has been invented to improve the above problems, to provide a relief mold apparatus and a method for manufacturing a product using the same to enable mass production of products quickly and efficiently while eliminating defects by a simple configuration will be.
  • the present invention provides an embossed mold apparatus and a method of manufacturing a product using the same to reduce the cost of the complex mold design cost and time, thereby simplifying the entire apparatus, thereby improving efficiency through cost reduction due to initial installation and construction. It is to provide.
  • the present invention is to form a hole by using a mold portion in the processed layer of the processed film comprising a release layer is formed on the bottom surface of the processing layer and the adhesive layer is adhered to the bottom surface of the processing layer.
  • Process forming an adhesive or a pressure-sensitive adhesive at a position corresponding to the hole to be formed in the processing layer, laminating the release film for chip removal with the processing layer, the release film for chip removal and the processing layer Including a process of separating from each other, the chip may provide a method for manufacturing a product using an embossed mold apparatus, characterized in that the chip is removed by the release film for chip removal.
  • the adhesive or the adhesive is characterized in that formed by printing on the release film for chip removal.
  • the adhesive or the pressure-sensitive adhesive is characterized in that it is formed by printing on the processed layer.
  • the adhesive or the pressure-sensitive adhesive is characterized in that printed on all or part of the position corresponding to the hole.
  • the adhesive or the adhesive is characterized in that hot air drying or UV curing.
  • the release film for chip removal and the processed layer are laminated.
  • the adhesive formed on the chip removing mold release film is UV cured after the chip removing mold release film and the processing layer are laminated.
  • the pressure-sensitive adhesive formed on the chip removing release film may be UV-cured before or after the chip removing release film and the processing layer are laminated.
  • the adhesive or the pressure-sensitive adhesive formed on the chip removing release film is hot-air dried before the chip removing release film and the processed layer are laminated.
  • the adhesiveness of the adhesive or the adhesiveness of the adhesive may be expressed by hot air drying or UV curing after the adhesive or the adhesive is formed on the release film for chip removal.
  • the process of forming the adhesive or the adhesive may be performed by printing the adhesive or the adhesive at a position corresponding to the hole on the release film for chip removal.
  • the process of forming the adhesive or pressure-sensitive adhesive is formed over the entire surface of the release film for chip removal, the adhesive or the pressure-sensitive adhesive formed on the remaining portion except for the portion where the hole is to be formed It is characterized by made by removing the adhesiveness or adhesion of.
  • the present invention is a mold portion including an embossed mold for forming a hole in the processed layer of the processed film comprising an adhesive layer is formed on the bottom surface of the processing layer and the bottom surface of the processing layer is adhered, and chip removal A printing portion for forming an adhesive or an adhesive at a position corresponding to the hole on a release film for a dragon, and a lamination portion for laminating the release film for chip removal on which the adhesive or the adhesive is formed with the processing layer;
  • the generated chip may be provided with an embossed mold apparatus, characterized in that the chip is removed by the adhesive or the adhesive formed on the release film for chip removal.
  • the present invention is to form a hole in the processing layer using a mold portion including an embossed mold, by removing a plurality of chips generated by the formation of the hole by the release film for chip removal given adhesive or tack, Since it is possible to produce a high-quality product without the occurrence of defects, it is possible to provide a reliable device to the producer and to deliver a reliable product to the consumer.
  • the present invention eliminates any complex driving mechanisms that cause unnecessary process delays, compared to most related prior arts including the applicant's prior applications, thereby enabling rapid and efficient mass production by reducing TAG time.
  • the present invention by preparing only the mold portion having a blade formed with a basic specific pattern, to significantly reduce the consumption and waste of time and cost due to the complex and huge mold design to provide a conventional embossed mold apparatus and system Can be.
  • the present invention in the manufacture of a flexible printed circuit board, double-sided tape, packing material, insulator, precision processing material, etc., as chips and fine powder generated due to the fine hole is scattered, adversely affecting the breathing in the workers in the workplace It will be able to prevent any problem that harms health in the long term.
  • the present invention immediately attaches and removes chips and fine powders generated by the hole processing of the mold part by using adhesiveness or adhesiveness imparted to the release film for chip removal, to prioritize the health of the worker and to create a pleasant working environment. It becomes possible.
  • FIG. 1 is a perspective view schematically showing that a hole is drilled and chips are generated by using an embossed mold apparatus according to an embodiment of the present invention.
  • Figure 2 is a conceptual diagram showing the overall structure of the embossed mold apparatus according to an embodiment of the present invention
  • FIG. 3 is an enlarged cross-sectional conceptual view of part A of FIG. 2;
  • Figure 4 is a perspective view showing a state in which the adhesive or the adhesive is printed on the release film or processed layer for chip removal by the printing unit of the embossed mold apparatus according to an embodiment of the present invention
  • FIG. 5 is an enlarged cross-sectional conceptual view of part B of FIG. 2;
  • FIG. 6 is a schematic enlarged cross-sectional view of part C of FIG.
  • FIG. 7 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a first modification of the present invention.
  • FIG. 8 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a second modification of the present invention.
  • FIG. 9 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a third modification of the present invention
  • FIG. 10 is a conceptual diagram schematically showing a process of removing the adhesive force or adhesive force by using a remover on the adhesive or adhesive formed on the release film for chip removal according to another embodiment of the present invention.
  • FIG. 1 is a perspective view schematically showing that a hole is drilled and chips are generated by using an embossed mold apparatus according to an embodiment of the present invention.
  • FIG. 1 (a) shows a state before a drilling operation
  • FIG. 1 (b) is a diagram showing a state after the drilling operation.
  • Figure 2 is a conceptual diagram showing the overall structure of the embossed mold apparatus according to an embodiment of the present invention.
  • FIG. 3 is an enlarged cross-sectional conceptual view of part A of FIG. 2, and FIG. 4 illustrates a state in which an adhesive or an adhesive is printed on a release film for chip removal by a printing unit of an embossed mold apparatus according to an exemplary embodiment of the present disclosure.
  • 5 is a perspective view of a portion B enlarged cross-sectional view of FIG. 2, and
  • FIG. 6 is a view illustrating a portion C enlarged cross-sectional view of FIG. 2.
  • a blade 22 having a specific pattern is formed to form a hole 11 having a specific shape only in the processing layer 10 of the processing film M supplied as a processing object. It can be seen that the structure including the mold portion 20.
  • the hole corresponding part 11 ′ at a position corresponding to the hole 11 to be formed on the processing layer 10 may be formed using the mold part illustrated in FIG. 2. 20 to form a hole 11 while generating the chip 12 as shown in FIG.
  • the processing film M includes a processing layer 10, an adhesive layer 72 formed on the bottom of the processing layer 10, and a release paper layer 70 to which the bottom of the processing layer 10 is adhered.
  • the chips 12 having a specific shape generated from each of the holes 11 of a specific shape are removed using the chip removal release film 30 supplied in a specific direction, the adhesive 31a or the adhesive 31b. May be applied to a method of printing on the processed layer 10.
  • the processing layer 10 from which the chips 12 are removed is produced in the form of a product P applicable to various fields.
  • Such products P may include, for example, flexible printed circuit boards, double-sided tapes, packing materials, insulators, precision processing materials, stickers, and the like.
  • the hole 11 is formed in the processing layer 10 which is the object to be processed using the mold part 20, and the plurality of chips 12 generated according to the formation of the hole 11 are adhesive or
  • the chip removal release film 30 provided with tackiness, it is possible to produce a high-quality product (P) without the occurrence of defects, it is possible to provide a reliable device to the producer and a reliable product to the consumer Guidance will be possible.
  • the present invention will be able to reduce the TAG time to achieve a rapid and efficient mass production by omitting a complex drive mechanism that causes unnecessary process delay compared to the prior art described above.
  • the present invention prepares only the mold part 20 having the blade 22 having a basic specific pattern, thereby providing a complex and huge mold design in order to provide a conventional embossed mold apparatus and system. The consumption and waste can be greatly reduced.
  • the present invention is adversely affected when breathing to the workers in the workplace due to the scattering of chips and fine powder generated by the minute hole processing in manufacturing such as a flexible printed circuit board, double-sided tape, packing material, insulator, precision processing material, etc. It will be able to prevent any problems that can affect the health and long-term health.
  • the present invention immediately removes the chips 12 and the fine powder generated by processing the holes 11 of the mold part 20 by using the adhesiveness or adhesiveness applied to the release film 30 for chip removal. By doing so, it is possible to create a pleasant work environment by giving priority to the health of the worker.
  • the mold includes the mold part 20, the print part 40, and the lamination part 60.
  • the mold part 20 includes an embossed mold 20 for forming a plurality of holes 11 in the processed layer 10 to be supplied as the object to be processed.
  • the mold part and the embossed mold have the same reference numeral '20'. 'Is used.
  • the printing part 40 is for printing the adhesive 31a or adhesive 31b including the position corresponding to each of the holes 11 on the chip
  • the printing unit 40 may be applied to a screen printing machine, an offset printing machine, a gravure printing machine, and the like.
  • the lamination part 60 is comprised of a pair of rollers as shown, and the above-mentioned release film 30 for chip removal printed with the adhesive 31a or the adhesive 31b together with the processing layer 10 as long as it was mentioned above.
  • tip removal mutually laminate.
  • the chips 12 generated from each of the holes 11 are completely removed using the adhesive 31a or the adhesive 31b applied to the release film 30 for chip removal supplied in a specific direction.
  • the mold unit 20 is lowered from the upper side of the lower fixed mold 20d and the lower fixed mold 20d supporting the processing layer 10 supplied in one direction, the upper blade 22 is provided on the lower surface A structure including the moving mold 20u can be applied.
  • the mold part 20 is not limited to the illustrated structure, and of course, the press mold as shown, as well as a rotary rotary die mold can also be applied.
  • the present invention is a so-called half-knife operation, that is, half cutting, applied to the production of a product such as a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a sticker, and the like as shown in FIGS. Therefore, it can be applied to the manufacturing process for forming the hole 11 in the processed layer (10).
  • the various kinds of products as described above, which are the objects of the vanishing work are formed on the release paper layer 70, that is, the adhesive layer 72 is formed on the bottom surface of the processing layer 10, and the mold part (only) is formed on the processing layer 10. Hole processing by the hole 11 is made 20.
  • the processed film M includes a release paper layer 70 having an adhesive layer 72 formed on a bottom surface of the processed layer 10 to which the bottom surface of the processed layer 10 is adhered. do.
  • the lamination unit 60 is laminated with the processing layer 10 transferred through the mold unit 20 and the release film 30 for chip removal transferred through the printing unit 40.
  • the printing unit 40 is as described above is provided so that the adhesive 31a or the adhesive 31b can be accurately and precisely applied to the position corresponding to the hole (11).
  • the direction in which the chip removing release film 30 is supplied is opposite to the direction in which the processing layer 10 passing through the mold part 20 is supplied.
  • the chip removing mold release film 30 passing through the printing part 40 and the processing layer 10 passing through the mold part 20 are laminated together by the lamination part 60, and the holes 11 of a specific pattern are laminated. Are formed only in the processing layer 10.
  • the release paper layer 70 is provided separately from the chip removing release film 30 to which the adhesive 31a or the adhesive 31b is applied and is integrally supplied with the processing layer 10.
  • the adhesive force of the adhesive 31a or the adhesive 31b will be described later, but when the release film 30 for chip removal and the processing layer 10 are laminated together by the lamination part 60 as shown in FIG. It is preferable that the adhesion force of the adhesive layer 72 is larger so that each of the chips 12 formed as the portion 20 can be detached from the adhesive layer 72 and attached to and removed from the release film 30 for chip removal.
  • the present invention together with the printing unit 40, at least one guide roller 80 for guiding the main doll film passed through the printing unit 40 toward the processing layer 10 side passing through the mold unit 20 It may be further provided.
  • the processing layer 10 and the chip release film 30 for passing through the mold part 20 are separated from each other while being discharged through the guide roller 80.
  • the adhesiveness and adhesiveness of the adhesive 31a and the adhesive 31b are expressed after the adhesive 31a or the adhesive 31b is printed on the release film 30 for chip removal.
  • the adhesive or adhesiveness is expressed by hot air drying or UV curing described later after the adhesive 31a or the adhesive 31b is printed on the release film 30 for chip removal.
  • the adhesive 31a or the adhesive 31b is one that can exhibit adhesiveness or tackiness by hot air drying or UV curing.
  • the present invention so that the adhesive (31a) which is a material that generates the adhesive force by heat as shown in Figure 7, so that the adhesive 31a can be dried by hot air, the printing portion 40 and the guide roller 80 It may be further provided with a hot air dryer (51) disposed between.
  • the present invention is disposed between the printing portion 40 and the guide roller 80 so that the adhesive 31a can be cured by UV irradiation so that the adhesive 31a, which is a UV curable material, can be applied as shown in FIG. 8. It may be further provided with a UV curing machine 52.
  • the adhesive 31a is printed on the release film 30 for chip removal guided by the guide roller 80 and transferred to the lamination part 60.
  • the adhesive 31b when the adhesive 31b is applied to the release film 30 for chip removal, the present invention is guided to the guide roller 80 as shown in FIG. 9 and the release film 30 for chip removal transferred to the lamination part 60 side.
  • the adhesive 31b should be printed.
  • the present invention is discharged through the mold part 20 to form a processed layer 10 having holes 11 and chips 12 formed therein.
  • the chip removing mold release film 30 to which each of the chips 12 is attached is passed through the guide roller 80, and the chip removing mold release film 30 to which the product P and the chip 12 are attached (see FIG. 6).
  • Separator (not shown) may be further provided to be separated in the form of.
  • P the product
  • the processing layer 10 and the chip release film 30 is attached to each of the processing layer 10 and the chip 12 is formed with a hole 11 discharged through the guide roller 80 It may be a worker who separates by hand manually.
  • the chip 12 generated from each of the holes 11 formed in the plurality of holes 11 formed in the processing layer 10 as the object to be processed by the mold part 20 is a release film 30 for chip removal having adhesiveness or adhesiveness. To remove all of them.
  • the blade 22 having a specific pattern corresponding to each of the holes 11 having a specific shape is formed in the mold part 20.
  • the mold part 20 is disposed to be capable of lifting up and down on the upper side of the processing layer 10 to form the hole 11 by pressing the processing layer 10.
  • the half knife operation illustrated in FIGS. 2 to 9 may include a process of separating and pressing and printing and laminating largely.
  • the processing film M includes a processing layer 10 having an adhesive layer 72 formed on a bottom surface thereof, and a release paper layer 70 on which a bottom surface of the processing layer 10 adheres.
  • the chips 12 are attached to and removed from the adhesive 31a or the adhesive 31b printed on the release film 30 for chip removal.
  • the direction in which the processing layer 10 is transferred and the direction in which the chip removing release film 30 is transferred are opposite to each other until the process of laminating the processing layer 10 is performed.
  • holes 11 of a specific pattern should be formed only in the processing layer 10 as shown in FIG. 5 according to the action of the blade 22 of the mold part 20.
  • the release paper layer 70 is provided separately from the chip removing release film 30 to which the adhesive 31a or the adhesive 31b is applied and is integrally supplied together with the processing layer 10 in one direction.
  • the adhesive force of the adhesive 31a or the adhesive 31b should be larger than the adhesive force of the adhesive layer 72 so that the adhesion removal of the chip 12 can be made reliably.
  • the adhesive 31a or the adhesive 31b may be printed including a position corresponding to the holes 11 of a specific pattern, but as shown in FIG. 4 (a), the holes 11 are removed from the release film 30 for chip removal. It may be printed on all of the hole forming portions 11 'at positions corresponding to the respective holes, or may be printed only on a part of the hole forming portions 11' at positions corresponding to the holes 11, as shown in FIG.
  • the adhesive 31a or the adhesive 31b may be formed in the hole in the processed layer 10 of the processed film M as shown in FIG. 4 (c) in order to reduce mold design and manufacturing cost and to prevent waste of raw materials.
  • 11) may be printed on all of the hole forming portions 11 'corresponding to each position, or may be printed only on a part of the hole forming portions 11' corresponding to each of the holes 11 as shown in FIG. 4 (d). Of course.
  • the adhesive force is expressed by hot air drying and UV curing as described above, and the adhesive 31b is formed as shown in FIG. 9.
  • the printed chip removing release film 30 is laminated with the processing layer 10 by the lamination part 60, and then presses the processing layer 10 by using the mold part 20.
  • the pressure sensitive adhesive 31b is made of a removable material, hot air drying and UV curing may be performed before or after laminating the processing layer 10 and the release film 30 for chip removal.
  • the adhesive 31a or the adhesive 31b may be printed over the entire surface of the chip removing release film 30, and as shown in FIG. 10 (a), over the entire surface of the chip removing release film 30.
  • the adhesive 31a or the adhesive 31b printed on the remaining portions except for the portion where the holes 11 of a specific pattern are to be formed is shown in FIG. 10 (b) or FIG. 10. It may be removed using a remover 32 provided separately (c).
  • the remover does not leave the adhesive 31a or the adhesive 31b until the unnecessary portion of the adhesive 31a or the adhesive 31b as shown in FIG. 10 (b), and the adhesive corresponding to the exact position of each of the holes 11. It can remove, leaving only 31a or adhesive 31b.
  • the remover 32 is a material that removes the adhesive force or adhesive force of the adhesive 31a or the adhesive 31b to a portion where the adhesive 31a or the adhesive 31b is unnecessary, as shown in FIG. 10 (c). Material such as) may be applied.
  • the adhesive 31a or the adhesive 31b may be removed in a precise printing manner using equipment such as the printing unit 40.
  • the chip release film 30 for removing the adhesive 31a or the adhesive 31b with the remover 32 or the adhesive layer or the adhesive force from which the adhesive layer is removed and the processing layer 10 are laminated together by the lamination unit 60. will be.
  • the printing of the adhesive 31a, the adhesive 31b, the removing agent 32, or the like may be performed by appropriately selecting any one of screen printing, offset printing, and gravure printing.
  • the adhesive 31a may be any one or a combination of one or more of A, B, C, and D.
  • the pressure-sensitive adhesive 31b may be any one or a combination of one, b, c, d.
  • the remover 32 may be any one or a combination of one or more of I, II, III, and IV.
  • the present invention has a basic technical idea to provide an embossed mold apparatus and a method of manufacturing a product using the same, which allow mass production of products quickly and efficiently while eliminating defects by a simple configuration. have.

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

La présente invention concerne un appareil à moule de gaufrage et un procédé de préparation d'un produit au moyen dudit appareil. Le procédé comprend les étapes qui consistent : à former des trous sur une couche traitée, qui fait partie d'un film traité ayant une couche adhésive formée sur le côté inférieur de la couche traitée et comprenant une couche en papier de démoulage collée sur la face inférieure de la couche traitée, au moyen d'une partie moule ; à produire une adhérence sur la position qui correspond aux trous à former sur la couche traitée ; à stratifier un film de libération pour l'élimination de copeaux avec la couche traitée ; et à séparer le film de libération d'élimination de copeaux du film traité, les copeaux étant éliminés au moyen du film de libération pour l'élimination des copeaux. La structure simple de l'appareil de l'invention permet ainsi d'empêcher l'apparition de défauts et de produire en masse un produit rapidement et de manière efficace.
PCT/KR2015/008750 2015-07-30 2015-08-21 Appareil à moule de gaufrage et procédé de préparation de produit au moyen dudit appareil Ceased WO2017018580A1 (fr)

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KR1020150108205A KR101577299B1 (ko) 2015-07-30 2015-07-30 양각 금형 장치 및 이것을 이용한 제품의 제조 방법
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KR102032912B1 (ko) * 2017-12-19 2019-10-16 (주)파인테크 스트레치 필름을 이용한 플렉시블 인쇄회로기판용 필름 절단 장치
CN107972108B (zh) * 2017-12-23 2019-07-09 路德通电子设备（北京）有限公司 一种反贴套孔排废工艺
KR101880657B1 (ko) * 2018-03-06 2018-07-20 김선옥 Ｆｐｃｂ의 제작용 시트의 제조방법

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KR100432685B1 (ko) * 1999-06-18 2004-05-22 방성현 인쇄물 재단방법 및 그 장치
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KR101451896B1 (ko) * 2013-01-21 2014-10-23 (주)파인테크 양각 금형 시스템
KR101469055B1 (ko) * 2013-09-16 2014-12-05 (주)파인테크 양각 금형 및 이를 포함하는 양각 금형 장치

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CN108189139A (zh) * 2017-12-28 2018-06-22 苏州市东苏发五金粘胶制品有限公司 一种一膜多种胶带产品加工工艺
CN108189139B (zh) * 2017-12-28 2019-10-29 苏州市东苏发五金粘胶制品有限公司 一种一膜多种胶带产品加工工艺

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