WO2017018581A1 - Appareil de moule de gaufrage et procédé de préparation de produit au moyen de celui-ci - Google Patents

Appareil de moule de gaufrage et procédé de préparation de produit au moyen de celui-ci Download PDF

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Publication number
WO2017018581A1
WO2017018581A1 PCT/KR2015/008751 KR2015008751W WO2017018581A1 WO 2017018581 A1 WO2017018581 A1 WO 2017018581A1 KR 2015008751 W KR2015008751 W KR 2015008751W WO 2017018581 A1 WO2017018581 A1 WO 2017018581A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
release film
film
chip
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/008751
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English (en)
Korean (ko)
Inventor
류기택
박형근
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FINETECH Co Ltd
Original Assignee
FINETECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FINETECH Co Ltd filed Critical FINETECH Co Ltd
Publication of WO2017018581A1 publication Critical patent/WO2017018581A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor

Definitions

  • the present invention relates to an embossed mold apparatus and a method for manufacturing a product using the same. More particularly, the embossed mold apparatus and a product using the embossed mold apparatus enable mass production of the product quickly and efficiently while eliminating defects by a simple configuration. It relates to a manufacturing method.
  • Such an embossed mold is a mold using a blade formed by embossing, and is typically produced by CNC precision machining after etching a thin steel sheet from 0.6mm to 3mm according to the shape.
  • Embossed molds are easy to mount, easy to use, can be applied to all presses, and are highly suitable for machining precision products.They do not have adhesive components attached to the punch and can remove chips at the same time. There are advantages.
  • Embossed molds have been applied to various fields such as flexible printed circuit boards, double-sided tapes, packing materials, insulators, precision processing materials, liquid crystal displays, and protective films due to the aforementioned advantages.
  • the embossed mold processes the workpiece into blades with a specific pattern, in which chips are cut by the blades, which remain in the workpiece or are attached to the blade.
  • the chip cut by the blade is manually removed by the operator, and this operation takes a considerable amount of time, and in the case of a small chip, the chip is not easily seen by the operator. Occurred.
  • these prior arts employ an operation mechanism that protrudes the pin to eject the chip and then sucks the discharged chip back into the air to remove the chip.
  • an operation mechanism can reduce the incidence of defective products.
  • the process delay according to the operation sequence is inevitable, and this process delay naturally has a problem that acts as a factor that lowers the yield.
  • a method using a method of removing chips, which are by-products of processing the workpiece is applied by using a separate member having an attachment ability such as a release tape.
  • the present invention has been invented to improve the above problems, to provide a relief mold apparatus and a method for manufacturing a product using the same to enable mass production of products quickly and efficiently while eliminating defects by a simple configuration will be.
  • the present invention provides an embossed mold apparatus and a method of manufacturing a product using the same to reduce the cost of the complex mold design cost and time, thereby simplifying the entire apparatus, thereby improving efficiency through cost reduction due to initial installation and construction. It is to provide.
  • the present invention is a process of forming an adhesive or a pressure-sensitive adhesive on the release film for chip removal, the position corresponding to the hole to be formed in the processed film, the film for chip removal wherein the adhesive or pressure-sensitive adhesive is formed And, the process of laminating with the processing film, the process of forming the hole in the processing film by using a mold portion, and the process of separating the chip release film and the processing film from each other, wherein the chip is the It is possible to provide a method for producing a product using an embossed mold apparatus, characterized in that removed by the adhesive or the adhesive formed on the release film for chip removal.
  • the adhesive or the adhesive is characterized in that formed by printing on the release film for chip removal.
  • the adhesive or the pressure-sensitive adhesive is characterized in that printed on all or part of the position corresponding to the hole.
  • the adhesive or the adhesive is characterized in that hot air drying or UV curing.
  • the release film for chip removal and the processed film are laminated.
  • the adhesive formed on the chip removing mold release film is UV cured after the chip removing mold release film and the processing film are laminated.
  • the pressure-sensitive adhesive formed on the chip removing release film may be UV cured before or after the chip removing release film and the processed film are laminated.
  • the adhesive or the pressure-sensitive adhesive formed on the chip removing mold release film is hot-air dried before the chip removing release film and the processed film are laminated.
  • the adhesiveness of the adhesive or the adhesiveness of the adhesive may be expressed by hot air drying or UV curing after the adhesive or the adhesive is formed on the release film for chip removal.
  • the forming of the adhesive or the adhesive on the chip removing release film may be performed by printing the adhesive or the adhesive at a position corresponding to the hole on the chip removing release film.
  • the process of forming an adhesive or an adhesive on the chip removing release film the adhesive or the adhesive is formed over the entire surface of the chip removing release film, and then the remaining portion except for the portion where the hole is to be formed It is characterized by made by removing the adhesiveness or adhesiveness of the adhesive or the pressure-sensitive adhesive formed in the.
  • the present invention is a mold portion comprising an embossed mold for forming a hole in the processed film, a printing portion for forming an adhesive or an adhesive at a position corresponding to the hole on the chip removal film, and the adhesive or the adhesive And a lamination part for laminating the formed release film for chip removal with the processing film, wherein the chip generated from the hole is removed by the adhesive or the adhesive formed on the release film for chip removal. It is also possible to provide a device.
  • the present invention by forming a hole in the processed film using a mold portion including an embossed mold, by removing a plurality of chips generated by the formation of the hole by the release film for chip removal given adhesive or tack, Since it is possible to produce a high-quality product without the occurrence of defects, it is possible to provide a reliable device to the producer and to deliver a reliable product to the consumer.
  • the present invention eliminates any complex driving mechanisms that cause unnecessary process delays, compared to most related prior arts including the applicant's prior applications, thereby enabling rapid and efficient mass production by reducing TAG time.
  • the present invention by preparing only the mold portion having a blade formed with a basic specific pattern, to significantly reduce the consumption and waste of time and cost due to the complex and huge mold design to provide a conventional embossed mold apparatus and system Can be.
  • the present invention in the manufacture of a flexible printed circuit board, double-sided tape, packing material, insulator, precision processing material, etc., as chips and fine powder generated due to the fine hole is scattered, adversely affecting the breathing in the workers in the workplace It will be able to prevent any problem that harms health in the long term.
  • the present invention immediately attaches and removes chips and fine powders generated by the hole processing of the mold part by using adhesiveness or adhesiveness imparted to the release film for chip removal, to prioritize the health of the worker and to create a pleasant working environment. It becomes possible.
  • FIG. 1 is a perspective view schematically showing that a hole is drilled and chips are generated by using an embossed mold apparatus according to an embodiment of the present invention.
  • Figure 2 is a conceptual diagram showing the overall structure of the embossed mold apparatus according to an embodiment of the present invention
  • FIG. 3 is an enlarged cross-sectional conceptual view of part A of FIG. 2;
  • Figure 4 is a perspective view showing a state in which the adhesive or the adhesive is printed on the release film for chip removal by the printing unit of the embossed mold apparatus according to an embodiment of the present invention
  • FIG. 5 is an enlarged cross-sectional conceptual view of part B of FIG. 2;
  • FIG. 6 is a schematic enlarged cross-sectional view of part C of FIG.
  • FIG. 7 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a first modification of the present invention.
  • FIG. 8 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a second modification of the present invention.
  • FIG. 9 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a third modification of the present invention
  • FIG. 10 is a conceptual diagram schematically showing a process of removing the adhesive force or adhesive force by using a remover on the adhesive or adhesive formed on the release film for chip removal according to another embodiment of the present invention.
  • FIG. 1 is a perspective view schematically showing that a hole is drilled and chips are generated by using an embossed mold apparatus according to an embodiment of the present invention.
  • FIG. 1 (a) shows a state before a drilling operation
  • FIG. 1 (b) is a diagram showing a state after the drilling operation.
  • Figure 2 is a conceptual diagram showing the overall structure of the embossed mold apparatus according to an embodiment of the present invention.
  • FIG. 3 is an enlarged cross-sectional conceptual view of part A of FIG. 2, and FIG. 4 illustrates a state in which an adhesive or an adhesive is printed on a release film for chip removal by a printing unit of an embossed mold apparatus according to an exemplary embodiment of the present disclosure.
  • 5 is a perspective view of a portion B enlarged cross-sectional view of FIG. 2, and
  • FIG. 6 is a view illustrating a portion C enlarged cross-sectional view of FIG. 2.
  • a mold part 20 having a blade 22 having a specific pattern is formed to form a hole 11 having a specific shape in a processing film 10 supplied as a processing object. It can be seen that the structure to include.
  • the hole corresponding part 11 ′ at a position corresponding to the hole 11 to be formed on the processed film 10 may be formed using the mold part illustrated in FIG. 2. 20 to form a hole 11 while generating the chip 12 as shown in FIG.
  • the processed film 10 from which the chips 12 are removed is produced in the form of a product P applicable to various fields.
  • Such products P may include, for example, flexible printed circuit boards, double-sided tapes, packing materials, insulators, precision processing materials and the like.
  • the hole 11 is formed in the processing film 10 that is the object to be processed using the mold part 20, and the plurality of chips 12 generated according to the formation of the hole 11 may be adhesive or
  • the chip removal release film 30 provided with tackiness, it is possible to produce a high-quality product (P) without the occurrence of defects, it is possible to provide a reliable device to the producer and a reliable product to the consumer Guidance will be possible.
  • the present invention will be able to reduce the TAG time to achieve a rapid and efficient mass production by omitting a complex drive mechanism that causes unnecessary process delay compared to the prior art described above.
  • the present invention prepares only the mold part 20 having the blade 22 having a basic specific pattern, thereby providing a complex and huge mold design in order to provide a conventional embossed mold apparatus and system. The consumption and waste can be greatly reduced.
  • the present invention is adversely affected when breathing to the workers in the workplace due to the scattering of chips and fine powder generated by the minute hole processing in manufacturing such as a flexible printed circuit board, double-sided tape, packing material, insulator, precision processing material, etc. It will be able to prevent any problems that can affect the health and long-term health.
  • the present invention immediately removes the chips 12 and the fine powder generated by processing the holes 11 of the mold part 20 by using the adhesiveness or adhesiveness applied to the release film 30 for chip removal. By doing so, it is possible to create a pleasant work environment by giving priority to the health of the worker.
  • the mold includes the mold part 20, the print part 40, and the lamination part 60.
  • the mold part 20 includes an embossed mold 20 which forms a plurality of holes 11 in the processed film 10 to be supplied as the object to be processed.
  • the mold part and the embossed mold have the same reference numeral '20'. 'Is used.
  • the printing part 40 is for printing the adhesive 31a or adhesive 31b including the position corresponding to each of the holes 11 on the chip
  • the printing unit 40 may be applied to a screen printing machine, an offset printing machine, a gravure printing machine, and the like.
  • the lamination portion 60 is formed of a pair of rollers as shown in the drawing, and the release film 30 for chip removal on which the adhesive 31a or the pressure-sensitive adhesive 31b is printed, together with the processing film 10 as long as described above.
  • tip removal mutually laminated.
  • the chips 12 generated from each of the holes 11 are completely removed using the adhesive 31a or the adhesive 31b applied to the release film 30 for chip removal supplied in a specific direction.
  • the mold part 20 is lowered from the upper side of the lower fixed mold 20d for supporting the processing film 10 supplied in one direction, and the lower fixed mold 20d, the upper blade 22 is provided on the lower surface A structure including the moving mold 20u can be applied.
  • the mold part 20 is not limited to the illustrated structure, and of course, the press mold as shown, as well as a rotary rotary die mold can also be applied.
  • the chip removing release film 30 is transferred through the printing unit 40 and the mold unit 20, and the lamination unit 60 is a chip removing release film 30 passing through the printing unit 40.
  • the processing film 10 is mutually laminated.
  • the direction in which the chip removing release film 30 is supplied is the same direction as the direction in which the processing film 10 is supplied, and the holes 11 of a specific pattern should be formed only in the processing film 10.
  • the adhesive 31a or the adhesive 31b printed on the chip removing release film 30 has the same structure as shown in FIGS. 3 and 4, and the printing part 40 and the mold part 20 are chip removing. It can be seen that the release film 30 is disposed sequentially along the direction in which the release film 30 is supplied.
  • the adhesive 31a or the adhesive 31b forms the hole corresponding portion 11 'corresponding to the hole 11 of the processed film 10 on the release film 30 for chip removal as shown in FIG. Assuming that, the print area and the print pattern may be properly adjusted according to the hole counterpart 11 'and the chips 12 of various shapes corresponding to each other.
  • the adhesive 31a or the adhesive 31b may be printed over the entire area corresponding to the hole counterpart 11 'as shown in FIG. 4 (a), and the hole counterpart 11 as shown in FIG. 4 (b).
  • ') Is printed in a circle, ellipse, or various other shapes over a portion of the corresponding area, thereby exerting the adhesive force to which the chip 12 is attached and removed.
  • the processing film 10 is supplied between the printing unit 40 and the mold unit 20 as shown in the embodiment of FIGS. 7 to 9 to be described later together with FIG. 2 to be laminated with the release film 30 for chip removal. Will be.
  • the laminated processing film 10 and the chip removing mold release film 30 are pressed to form a hole 11 (see FIG. 1 below) and chips 12 near the blades 22 of the mold part 20 forming the chips 12.
  • the structure is briefly described with reference to FIG. 5 as follows.
  • the blade 22 penetrates through the processing film 10 to form the holes 11 to generate chips 12, each of which is used for chip removal.
  • the state of being attached to the adhesive 31a or the adhesive 31b printed by the printing unit 40 on the release film 30 is maintained.
  • the chips 12 attached to the adhesive 31a or the adhesive 31b along the direction in which the chip removing release film 30 is transported are removed together with the chip removing release film 30 as shown in FIG. 6.
  • the product P is discharged in a state in which the hole 11 is formed is transferred in one direction.
  • the adhesiveness and adhesiveness of the adhesive 31a and the adhesive 31b are expressed after the adhesive 31a or the adhesive 31b is printed on the release film 30 for chip removal.
  • the adhesive or adhesiveness is expressed by hot air drying or UV curing described later after the adhesive 31a or the adhesive 31b is printed on the release film 30 for chip removal.
  • the adhesive 31a or the adhesive 31b is one that can exhibit adhesiveness or tackiness by hot air drying or UV curing.
  • the present invention so that the adhesive (31a), which is a material that generates the adhesive force due to heat as shown in Figure 7, so that the adhesive 31a can be dried by hot air, the printing unit 40 and the mold unit 20 It may be further provided with a hot air dryer (51) disposed between.
  • the processed film 10 is supplied between the hot air dryer 51 and the mold part 20, and is laminated with the release film 30 for chip removal by the lamination part 60.
  • hot air drying by the hot air dryer 51 should be performed before the processing film 10 is laminated with the release film 30 for chip removal.
  • Hot air drying is carried out before the adhesive 31a is laminated in order to prevent damage to the processed film 10.
  • the hot film is used to generate the adhesive force of the adhesive 31a by hot air drying before the release film 30 for chip removal. This is because the adhesive 31a can exert the sure performance of removing the chip 12 only by laminating with the resin.
  • the present invention is disposed between the printing portion 40 and the mold portion 20 so that the adhesive 31a can be cured by UV irradiation to apply the adhesive 31a which is a UV curable material as shown in FIG. UV curing machine 52 may be further provided.
  • the processing film 10 is supplied between the printing unit 40 and the UV curing machine 52, is laminated with the release film 30 for chip removal by the lamination unit 60, the release film 30 for chip removal ),
  • the adhesive 31a which is a UV curable material as described above, is printed.
  • UV curing by the UV curing machine 52 should be made after the processing film 10 is laminated with the release film 30 for chip removal.
  • UV curing after the adhesive 31a is laminated is because the adhesive force disappears when the adhesive 31a is UV cured before the processing film 10 is laminated with the release film 30 for chip removal. Since the adhesive force is generated as soon as the adhesive 31a is UV cured after laminating (10) with the release film 30 for chip removal, the adhesive 31a can exhibit the removal performance of the reliable chip 12 only by doing so. Because.
  • the processed film 10 is supplied between the printing part 40 and the mold part 20 as shown in FIG. ) May be laminated with the release film 30 for chip removal.
  • the pressure sensitive adhesive 31b is made of a removable material, hot air drying and UV curing may be performed before or after laminating the processing film 10 and the release film 30 for chip removal.
  • the adhesive 31b generates adhesive force by UV curing, before or after laminating the processing film 10 and the release film 30 for chip removal to each other, the adhesive force is generated by UV curing to generate adhesive force. There will be little to remove them.
  • the processed film 10 and the chips 12 having the holes 11 formed through the mold part 20 are formed.
  • the chip removal release film 30 to which each is attached is separated so as to be separated into the form of the chip removal release film 30 (see FIG. 6) to which the product P and the chip 12 are attached via the guide roller 80.
  • a part (hereinafter not shown) may be further provided.
  • P the product
  • the process film 10 and the chip removal release film 30 is attached to each of the processing film 10 and the chip 12 is formed with a hole 11 discharged through the guide roller 80. It may be a worker who separates by hand manually.
  • the blade 22 having a specific pattern corresponding to each of the holes 11 having a specific shape is formed in the mold part 20.
  • the mold part 20 is arranged to be capable of lifting up and down on the upper side of the processing film 10 to form the hole 11 by pressing the processing film 10.
  • the complete knife operation illustrated in FIGS. 2 to 9 may include a process of largely printing, laminating, pressing, and separating.
  • the chips 12 are attached to and removed from the adhesive 31a or the adhesive 31b printed on the release film 30 for chip removal.
  • the holes 11 of a specific pattern should be formed only in the processing film 10, of course.
  • the adhesive 31a or the adhesive 31b may be printed including a position corresponding to the holes 11 of a specific pattern, but as shown in FIG. 4 (a), the holes 11 in the chip removing release film 30 may be used. ) May be printed on all of the hole forming portions 11 'at positions corresponding to each of the holes, or may be printed only on a part of the hole forming portions 11' at positions corresponding to the holes 11, as shown in FIG. Of course.
  • the adhesive force is expressed by hot air drying and UV curing as described above, and the adhesive 31b is printed as shown in FIG. 9.
  • the release film 30 for chip removal is pressed with the processing film 10 by the lamination part 60, and then presses the processing film 10 using the mold part 20.
  • the adhesive 31a or the adhesive 31b may be printed over the entire surface of the chip removing release film 30, and as shown in FIG. 10 (a), over the entire surface of the chip removing release film 30.
  • the adhesive 31a or the adhesive 31b printed on the remaining portions except for the portion where the holes 11 of a specific pattern are to be formed is shown in FIG. 10 (b) or FIG. 10. It may be removed using a remover 32 provided separately (c).
  • the remover does not leave the adhesive 31a or the adhesive 31b until the unnecessary portion of the adhesive 31a or the adhesive 31b as shown in FIG. 10 (b), and the adhesive corresponding to the exact position of each of the holes 11. It can remove, leaving only 31a or adhesive 31b.
  • the remover 32 is a material that removes the adhesive force or adhesive force of the adhesive 31a or the adhesive 31b to a portion where the adhesive 31a or the adhesive 31b is unnecessary, as shown in FIG. 10 (c). Material such as) may be applied.
  • the adhesive 31a or the adhesive 31b may be removed in a precise printing manner using equipment such as the printing unit 40.
  • the chip release film 30 and the processing film 10 in which the adhesive 31a or the adhesive 31b is removed with the remover 32 or the adhesive force or the adhesive force is removed, are laminated together by the lamination part 60. will be.
  • the printing of the adhesive 31a, the adhesive 31b, the removing agent 32, or the like may be performed by appropriately selecting any one of screen printing, offset printing, and gravure printing.
  • the adhesive 31a may be any one or a combination of one or more of A, B, C, and D.
  • the pressure-sensitive adhesive 31b may be any one or a combination of one, b, c, d.
  • the remover 32 may be any one or a combination of one or more of I, II, III, and IV.
  • the present invention has a basic technical idea to provide an embossed mold apparatus and a method of manufacturing a product using the same, which allow mass production of products quickly and efficiently while eliminating defects by a simple configuration. have.

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

La présente invention concerne un appareil de moule de gaufrage et un procédé de préparation d'un produit au moyen de celui-ci. Le procédé comprend les étapes consistant : à former un adhésif à l'emplacement, sur une pellicule détachable de retrait de puce, correspondant à des trous devant être formés sur un film traité ; à stratifier la pellicule de retrait de puce, sur laquelle l'adhésif est formé, avec le film traité ; à former des trous sur le film traité au moyen d'une partie de moule ; et à séparer la pellicule détachable de retrait de puce et le film traité l'un de l'autre, les puces étant retirées au moyen de l'adhésif formé sur la pellicule détachable de retrait de puce. Cette structure simple permet ainsi d'empêcher des défauts et de pouvoir produire un produit en série de façon rapide et efficace.
PCT/KR2015/008751 2015-07-30 2015-08-21 Appareil de moule de gaufrage et procédé de préparation de produit au moyen de celui-ci Ceased WO2017018581A1 (fr)

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KR10-2015-0108207 2015-07-30
KR1020150108207A KR101577301B1 (ko) 2015-07-30 2015-07-30 양각 금형 장치 및 이것을 이용한 제품의 제조 방법

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KR101943543B1 (ko) 2016-12-01 2019-04-18 (주)파인테크 양각 금형 장치 및 이것을 이용한 제품의 제조 방법
KR102088370B1 (ko) * 2017-12-19 2020-03-13 (주)파인테크 플렉시블 인쇄회로기판용 커버레이 필름의 칩 제거 장치
KR102110832B1 (ko) * 2018-06-26 2020-05-13 주식회사 고려이노테크 홀 타발 장치
WO2020017684A1 (fr) * 2018-07-16 2020-01-23 (주)파인테크 Appareil et procédé de poinçonnage d'un film

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JP2562182B2 (ja) * 1988-07-28 1996-12-11 日東電工株式会社 離型シート仮接着フレキシブル回路の製法およびその離型シート仮接着フレキシブル回路
JP2001127410A (ja) * 1999-10-25 2001-05-11 Lintec Corp 回路基板の製造方法
KR100432685B1 (ko) * 1999-06-18 2004-05-22 방성현 인쇄물 재단방법 및 그 장치
KR101451896B1 (ko) * 2013-01-21 2014-10-23 (주)파인테크 양각 금형 시스템
KR101469055B1 (ko) * 2013-09-16 2014-12-05 (주)파인테크 양각 금형 및 이를 포함하는 양각 금형 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2562182B2 (ja) * 1988-07-28 1996-12-11 日東電工株式会社 離型シート仮接着フレキシブル回路の製法およびその離型シート仮接着フレキシブル回路
KR100432685B1 (ko) * 1999-06-18 2004-05-22 방성현 인쇄물 재단방법 및 그 장치
JP2001127410A (ja) * 1999-10-25 2001-05-11 Lintec Corp 回路基板の製造方法
KR101451896B1 (ko) * 2013-01-21 2014-10-23 (주)파인테크 양각 금형 시스템
KR101469055B1 (ko) * 2013-09-16 2014-12-05 (주)파인테크 양각 금형 및 이를 포함하는 양각 금형 장치

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