ZA857435B - Photosensitive polymer compositions,electrophoretic deposition processes using same,and the use of same in forming films on substrates - Google Patents

Photosensitive polymer compositions,electrophoretic deposition processes using same,and the use of same in forming films on substrates

Info

Publication number
ZA857435B
ZA857435B ZA857435A ZA857435A ZA857435B ZA 857435 B ZA857435 B ZA 857435B ZA 857435 A ZA857435 A ZA 857435A ZA 857435 A ZA857435 A ZA 857435A ZA 857435 B ZA857435 B ZA 857435B
Authority
ZA
South Africa
Prior art keywords
same
substrates
polymer compositions
deposition processes
photosensitive polymer
Prior art date
Application number
ZA857435A
Other languages
English (en)
Inventor
William David Emmons
Mark Robert Winkle
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=67809744&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ZA857435(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of ZA857435B publication Critical patent/ZA857435B/xx

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/164Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/138Corona discharge process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Paints Or Removers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
ZA857435A 1984-09-26 1985-09-26 Photosensitive polymer compositions,electrophoretic deposition processes using same,and the use of same in forming films on substrates ZA857435B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/654,821 US4592816A (en) 1984-09-26 1984-09-26 Electrophoretic deposition process
CN86100150A CN86100150A (zh) 1984-09-26 1986-01-11 感光聚合物组合物及其电泳沉积工艺过程

Publications (1)

Publication Number Publication Date
ZA857435B true ZA857435B (en) 1987-11-25

Family

ID=67809744

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA857435A ZA857435B (en) 1984-09-26 1985-09-26 Photosensitive polymer compositions,electrophoretic deposition processes using same,and the use of same in forming films on substrates

Country Status (19)

Country Link
US (1) US4592816A (fr)
EP (1) EP0176356B1 (fr)
JP (1) JPH081519B2 (fr)
KR (1) KR920005775B1 (fr)
CN (2) CN86100150A (fr)
AU (1) AU586189B2 (fr)
BR (1) BR8504640A (fr)
CA (1) CA1257803A (fr)
DE (1) DE3566047D1 (fr)
DK (1) DK168802B1 (fr)
FI (1) FI80350C (fr)
HK (1) HK58289A (fr)
IE (1) IE58622B1 (fr)
IL (1) IL76491A (fr)
MX (1) MX165458B (fr)
NO (1) NO168857C (fr)
PH (1) PH22139A (fr)
SG (1) SG8489G (fr)
ZA (1) ZA857435B (fr)

Families Citing this family (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8430377D0 (en) * 1984-12-01 1985-01-09 Ciba Geigy Ag Modified phenolic resins
DE3517796A1 (de) * 1985-05-17 1986-11-20 Hoechst Ag, 6230 Frankfurt Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten
JPH0644150B2 (ja) * 1986-05-09 1994-06-08 関西ペイント株式会社 プリント配線フオトレジスト用電着塗料組成物
JPS6317592A (ja) * 1986-07-09 1988-01-25 三菱電機株式会社 プリント配線板の製造方法
US4762747A (en) * 1986-07-29 1988-08-09 Industrial Technology Research Institute Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom
US4751172A (en) * 1986-08-01 1988-06-14 Shipley Company Inc. Process for forming metal images
GB8620001D0 (en) * 1986-08-16 1986-09-24 Ciba Geigy Ag Production of images
EP0662636A3 (fr) * 1986-10-23 1995-11-22 Ciba Geigy Ag Méthode de formation d'images.
JPS63182888A (ja) * 1987-01-26 1988-07-28 関西ペイント株式会社 プリント配線板の製造方法
JPS63246890A (ja) * 1987-04-02 1988-10-13 関西ペイント株式会社 プリント回路の形成方法
JPS6420694A (en) * 1987-07-15 1989-01-24 Kansai Paint Co Ltd Manufacture of printed wiring board
EP0302831B1 (fr) * 1987-08-05 1993-05-12 Ciba-Geigy Ag Composés
DE3850533T2 (de) * 1987-08-05 1994-10-27 Ciba Geigy Ag Bilderzeugungsverfahren.
US5196098A (en) * 1988-01-04 1993-03-23 Shipley Company Inc. Apparatus and process for electrophoretic deposition
JPH0795577B2 (ja) * 1988-04-12 1995-10-11 富士プラント工業株式会社 リードフレームへの部分メッキ方法
JP2585070B2 (ja) * 1988-08-02 1997-02-26 日本ペイント株式会社 画像形成方法
CA1334897C (fr) * 1988-08-02 1995-03-28 Mamoru Seio Couche d'electrodeposition et methode de production d'images utilisant cette couche
US5102775A (en) * 1988-09-30 1992-04-07 Kansai Paint Co., Ltd. Visible light sensitive electrodeposition coating composition and image-forming method using the same
GB8827847D0 (en) * 1988-11-29 1988-12-29 Ciba Geigy Ag Method
CA2009274A1 (fr) * 1989-02-22 1990-08-22 Manuel Buentello Iii Methode de fabrication de composants electroniques au moyen d'un materiau de masquage et materiau de masquage connexe
GB8909561D0 (en) * 1989-04-26 1989-06-14 Kodak Ltd Radiation-sensitive composition and use thereof in the preparation of electrochemical ion sensors
JPH02302092A (ja) * 1989-05-16 1990-12-14 Kansai Paint Co Ltd プリント配線板の製造方法
US5004672A (en) * 1989-07-10 1991-04-02 Shipley Company Inc. Electrophoretic method for applying photoresist to three dimensional circuit board substrate
US5236810A (en) * 1989-10-03 1993-08-17 Kansai Paint Co., Ltd. Process for preparing printed-circuit board
US5047128A (en) * 1990-01-02 1991-09-10 Shipley Company Inc. Electrodialysis cell for removal of excess electrolytes formed during electrodeposition of photoresists coatings
DE4009563A1 (de) * 1990-03-24 1991-09-26 Basf Lacke & Farben Waessrig entwickelbares, negativ wirkendes, elektrophoretisch abscheidbares und photohaertbares beschichtungsmittel sowie seine verwendung zur herstellung von leiterbahnen
US5055164A (en) * 1990-03-26 1991-10-08 Shipley Company Inc. Electrodepositable photoresists for manufacture of hybrid circuit boards
EP0449022A3 (en) * 1990-03-26 1992-03-11 Shipley Company Inc. Method of controlling photoresist film thickness and stability of an electrodeposition bath
EP0536272B1 (fr) * 1990-06-27 1999-09-22 Coates Brothers Plc Procede de formation d'images
JPH0465184A (ja) * 1990-07-05 1992-03-02 Kansai Paint Co Ltd 電着前処理方法
ATE175280T1 (de) * 1990-08-02 1999-01-15 Ppg Industries Inc Lichtempfindliche, elektroabscheidbare photoresistzusammensetzung
US5268256A (en) * 1990-08-02 1993-12-07 Ppg Industries, Inc. Photoimageable electrodepositable photoresist composition for producing non-tacky films
US5066374A (en) * 1990-09-20 1991-11-19 Rohm And Haas Company Elimination of film defects due to hydrogen evolution during cathodic electrodeposition
EP0490118A1 (fr) * 1990-12-10 1992-06-17 Shipley Company Inc. Masque de soudure dont l'image est obtenue par voie photographique et composition photosensible
DE59108989D1 (de) * 1990-12-18 1998-06-25 Ciba Geigy Ag Strahlungsempfindliche Zusammensetzung auf Basis von Wasser als Lösungs- bzw. Dispersionsmittel
US5202222A (en) * 1991-03-01 1993-04-13 Shipley Company Inc. Selective and precise etching and plating of conductive substrates
US5607818A (en) * 1991-06-04 1997-03-04 Micron Technology, Inc. Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition
US5288377A (en) * 1991-06-05 1994-02-22 Macdermid, Incorporated Process for the manufacture of printed circuits using electrophoretically deposited organic resists
US5160579A (en) * 1991-06-05 1992-11-03 Macdermid, Incorporated Process for manufacturing printed circuit employing selective provision of solderable coating
CA2067921A1 (fr) * 1991-06-12 1992-12-13 Alan Frederick Becknell Nouvelle methode de fabrication de circuits electriques
US5314789A (en) * 1991-10-01 1994-05-24 Shipley Company Inc. Method of forming a relief image comprising amphoteric compositions
US5384229A (en) * 1992-05-07 1995-01-24 Shipley Company Inc. Photoimageable compositions for electrodeposition
PL309779A1 (en) * 1993-01-11 1995-11-13 Macdermid Phosphate compositions and method of obtaining them, especially for use in production of printed circuit boards employing organic protective films
JPH07249766A (ja) * 1994-03-10 1995-09-26 Fujitsu Ltd 半導体装置及びその製造方法
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
US5531872A (en) * 1994-08-11 1996-07-02 Xerox Corporation Processes for preparing photoconductive members by electrophoresis
US5721088A (en) * 1995-12-20 1998-02-24 Ppg Industries, Inc. Electrodepositable photoimageable compositions with improved edge coverage
KR100242165B1 (ko) * 1996-11-30 2000-02-01 김영남 음극선관의 건식전자사진식 스크린 제조용 광전도막도포용액 및 이를 사용하는 그 스크린 제조방법
US5893966A (en) * 1997-07-28 1999-04-13 Micron Technology, Inc. Method and apparatus for continuous processing of semiconductor wafers
US6033548A (en) * 1997-07-28 2000-03-07 Micron Technology, Inc. Rotating system and method for electrodepositing materials on semiconductor wafers
US6153075A (en) 1998-02-26 2000-11-28 Micron Technology, Inc. Methods using electrophoretically deposited patternable material
US6503564B1 (en) * 1999-02-26 2003-01-07 3M Innovative Properties Company Method of coating microstructured substrates with polymeric layer(s), allowing preservation of surface feature profile
WO2001009259A1 (fr) 1999-07-30 2001-02-08 Ppg Industries Ohio, Inc. Compositions de revetement possedant une meilleure resistance au grattage, substrats a revetement et procedes correspondants
US6623791B2 (en) 1999-07-30 2003-09-23 Ppg Industries Ohio, Inc. Coating compositions having improved adhesion, coated substrates and methods related thereto
US6610777B1 (en) 1999-07-30 2003-08-26 Ppg Industries Ohio, Inc. Flexible coating compositions having improved scratch resistance, coated substrates and methods related thereto
BR0012882A (pt) 1999-07-30 2002-04-09 Ppg Ind Ohio Inc Revestimentos curados tendo resistência ao risco melhorada, substratos revestidos e métodos a eles relacionados
PT1204709E (pt) 1999-07-30 2007-05-31 Ppg Ind Ohio Inc Composições de revestimento que têm resistência ao arranhão melhorada, substratos revestidos e métodos relacionados com eles
US6455231B1 (en) * 1999-11-03 2002-09-24 Shipley Company, L.L.C. Dry film photoimageable compositions
KR100686228B1 (ko) 2000-03-13 2007-02-22 삼성전자주식회사 사진 식각용 장치 및 방법, 그리고 이를 이용한 액정 표시장치용 박막 트랜지스터 기판의 제조 방법
US6379865B1 (en) 2000-04-11 2002-04-30 3M Innovative Properties Company Photoimageable, aqueous acid soluble polyimide polymers
US6635341B1 (en) 2000-07-31 2003-10-21 Ppg Industries Ohio, Inc. Coating compositions comprising silyl blocked components, coating, coated substrates and methods related thereto
DE10112023A1 (de) * 2001-03-07 2002-10-02 Atotech Deutschland Gmbh Verfahren zum Bilden eines Metallmusters auf einen dielektrischen Substrat
US6671950B2 (en) 2001-03-08 2004-01-06 Ppg Industries Ohio, Inc. Multi-layer circuit assembly and process for preparing the same
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US7228623B2 (en) * 2001-03-08 2007-06-12 Ppg Industries Ohio, Inc. Process for fabricating a multi layer circuit assembly
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US8065795B2 (en) 2001-03-08 2011-11-29 Ppg Industries Ohio, Inc Multi-layer circuit assembly and process for preparing the same
US6803092B2 (en) 2001-06-26 2004-10-12 3M Innovative Properties Company Selective deposition of circuit-protective polymers
WO2004020704A1 (fr) * 2001-08-31 2004-03-11 Semitool, Inc. Appareil et procede de depot d'une emulsion electrophoretique
WO2003054629A1 (fr) * 2001-12-20 2003-07-03 Koninklijke Philips Electronics N.V. Procede de structuration d'une couche et procede de fabrication d'un dispositif electronique
US7344970B2 (en) * 2002-04-11 2008-03-18 Shipley Company, L.L.C. Plating method
US6824959B2 (en) * 2002-06-27 2004-11-30 Ppg Industries Ohio, Inc. Process for creating holes in polymeric substrates
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
EP1520454B1 (fr) * 2002-06-27 2012-01-25 PPG Industries Ohio, Inc. Carte de circuit imprime simple ou multicouches a languettes de rupture allongees et son procédé de fabrication
TWI439823B (zh) * 2003-08-26 2014-06-01 尼康股份有限公司 Optical components and exposure devices
FR2860523B1 (fr) * 2003-10-01 2006-01-13 Commissariat Energie Atomique Procede de formation d'un film polymere sur une surface conductrice ou semi-conductrice de l'electricite par electro-greffage, surfaces obtenues et applications
EP1581034A1 (fr) * 2004-03-25 2005-09-28 DSM IP Assets B.V. Procédé de formation d'un masque de soudure
US8003293B2 (en) * 2004-09-30 2011-08-23 Intel Corporation Pixelated photoresists
US20060141143A1 (en) * 2004-12-17 2006-06-29 J Mccollum Gregory Method for creating circuit assemblies
TWI342172B (en) * 2007-01-02 2011-05-11 Advanced Semiconductor Eng Circuit board and method for manufacturing the same
EP1975706A3 (fr) * 2007-03-30 2010-03-03 FUJIFILM Corporation Précurseur de plaque d'impression lithographique
CN101693515B (zh) * 2009-10-30 2012-04-25 上海交通大学 用于mems领域的可图形化聚合物薄膜的制备方法
KR101548784B1 (ko) 2011-02-14 2015-08-31 주식회사 엘지화학 기재 필름 및 그의 제조방법
CN108811359B (zh) * 2018-07-03 2019-11-08 刘平 一种双面和多层印制电路板的生产方法
DE102020206107A1 (de) 2020-05-14 2021-11-18 Carl Zeiss Smt Gmbh Verfahren zum Herstellen eines optischen Elements
CN116887866A (zh) 2020-12-03 2023-10-13 巴特尔纪念研究院 聚合物纳米颗粒和dna纳米结构组合物及用于非病毒递送的方法
WO2022216977A1 (fr) 2021-04-07 2022-10-13 Batelle Memorial Institute Technologies de conception, de construction, de test et d'apprentissage rapides pour identifier et utiliser des vecteurs non viraux
GB2613173A (en) * 2021-11-25 2023-05-31 Bae Systems Plc Component processing
WO2025072751A1 (fr) 2023-09-29 2025-04-03 Battelle Memorial Institute Compositions de nanoparticules polymères pour l'expression in vivo de polypeptides
US12441996B2 (en) 2023-12-08 2025-10-14 Battelle Memorial Institute Use of DNA origami nanostructures for molecular information based data storage systems

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE525225A (fr) 1951-08-20
US2875047A (en) 1955-01-19 1959-02-24 Oster Gerald Photopolymerization with the formation of coherent plastic masses
US2850445A (en) 1955-01-19 1958-09-02 Oster Gerald Photopolymerization
US2893868A (en) * 1955-08-22 1959-07-07 Du Pont Polymerizable compositions
US3074974A (en) 1957-12-06 1963-01-22 Monsanto Chemicals Method for the preparation of diglycidyl ether of tetrachlorobisphenol-a
US3097097A (en) 1959-02-12 1963-07-09 Gisela K Oster Photo degrading of gel systems and photographic production of reliefs therewith
NL254306A (fr) 1959-08-07
US3200057A (en) 1960-12-27 1965-08-10 Ford Motor Co Electrophoretic coating process
US3303078A (en) 1962-05-18 1967-02-07 David Wolf Method of making electrical components
US3403088A (en) 1964-05-18 1968-09-24 Ppg Industries Inc Electrodeposition of water-dispersed acrylic interpolymers
US3380831A (en) 1964-05-26 1968-04-30 Du Pont Photopolymerizable compositions and elements
GB1090142A (en) 1965-02-26 1967-11-08 Agfa Gevaert Nv Photochemical insolubilisation of polymers
US3479185A (en) 1965-06-03 1969-11-18 Du Pont Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers
FR1486212A (fr) 1965-07-09 1967-10-04
US3549367A (en) 1968-05-24 1970-12-22 Du Pont Photopolymerizable compositions containing triarylimidazolyl dimers and p-aminophenyl ketones
US3469982A (en) 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
JPS4925505B1 (fr) 1969-06-10 1974-07-01
US3738835A (en) * 1971-10-21 1973-06-12 Ibm Electrophoretic photoresist composition and a method of forming etch resistant masks
JPS5221526B2 (fr) * 1972-01-10 1977-06-11
US4040925A (en) * 1974-05-02 1977-08-09 Scm Corporation Ultraviolet curing of electrocoating compositions
US4039414A (en) 1974-06-19 1977-08-02 Scm Corporation Ultraviolet curing of electrocoating compositions
US3925181A (en) 1974-10-31 1975-12-09 Scm Corp Cathodic electrocoating process
ES442315A1 (es) * 1974-11-04 1977-04-01 Standard Electrica Sa Un metodo para desprender de un substrato una pelicula re- sistente expuesta de fotopolimero.
US3975251A (en) 1975-03-19 1976-08-17 Scm Corporation Cathodic electrocoating process
US4025409A (en) * 1975-07-14 1977-05-24 Scm Corporation Dual cure cathodic electrocoating process
JPS5211601A (en) 1975-07-17 1977-01-28 Taiho Kensetsu Kk Excavation device
GB1572441A (en) * 1975-12-23 1980-07-30 Vickers Ltd Photopolymerisable polymers with free carboxyl groups and printing plates therefrom
US4029561A (en) * 1976-01-22 1977-06-14 Scm Corporation Photocurable cathodic electrocoating
US4066523A (en) * 1976-02-17 1978-01-03 Scm Corporation Dual cure cathodic electrocoating composition
US4035274A (en) 1976-05-24 1977-07-12 Scm Corporation Dual cure cathodic electrocoating
US4035273A (en) * 1976-05-24 1977-07-12 Scm Corporation Cathodic electrocoating process
US4166017A (en) * 1976-05-24 1979-08-28 Scm Corporation Process for cathodic electrocoating and photocuring
JPS60432B2 (ja) * 1978-03-27 1985-01-08 凸版印刷株式会社 部分着色金属化粧板
DE2651507C3 (de) 1976-11-11 1981-09-10 Bayer Ag, 5090 Leverkusen Verwendung von Triacrylaten von oxäthyliertem Trimethylolpropan mit einem Oxäthylierungsgrad von 2,5 bis 4 als Verdünnungsmittel in strahlenhärtbaren Zusammensetzungen
DE2816774A1 (de) * 1977-04-22 1978-10-26 Du Pont Photopolymerisierbares material
US4162162A (en) 1978-05-08 1979-07-24 E. I. Du Pont De Nemours And Company Derivatives of aryl ketones and p-dialkyl-aminoarylaldehydes as visible sensitizers of photopolymerizable compositions
US4343885A (en) 1978-05-09 1982-08-10 Dynachem Corporation Phototropic photosensitive compositions containing fluoran colorformer
JPS5527647A (en) 1978-08-17 1980-02-27 Nippon Telegraph & Telephone Paint for forming insulating film of conductive printed circuit board and method of forming insulating film
JPS55148491A (en) 1979-05-09 1980-11-19 Meidensha Electric Mfg Co Ltd Method of fabricating printed circuit board
US4338235A (en) 1979-12-21 1982-07-06 E. I. Du Pont De Nemours And Company Electrocoating composition with polyhydroxyamine and acrylic or methacrylic polymers
DE3005034A1 (de) * 1980-02-11 1981-08-20 Basf Ag, 6700 Ludwigshafen Verfahren zur herstellung von ueberzuegen
US4378264A (en) 1980-05-27 1983-03-29 E. I. Du Pont De Nemours And Company Integrated laminating process
US4382135A (en) 1981-04-01 1983-05-03 Diamond Shamrock Corporation Radiation-hardenable diluents
DE3131448A1 (de) * 1981-08-07 1983-02-24 Basf Ag, 6700 Ludwigshafen Fuer die herstellung von photoresistschichten geeignete photopolymerisierbare aufzeichnungsmasse
CA1182469A (fr) 1981-12-11 1985-02-12 William D. Emmons Esters d'homopolymeres d'acide acrylique obtenus par la reaction de condensation de michael
US4414311A (en) * 1982-03-18 1983-11-08 American Hoechst Corporation Cathodic deposition of light sensitive components

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NO168857B (no) 1991-12-30
AU586189B2 (en) 1989-07-06
FI80350B (fi) 1990-01-31
BR8504640A (pt) 1986-07-15
FI853691L (fi) 1986-03-27
EP0176356A2 (fr) 1986-04-02
JPS6180240A (ja) 1986-04-23
PH22139A (en) 1988-06-01
IE58622B1 (en) 1993-10-20
SG8489G (en) 1989-07-14
HK58289A (en) 1989-07-28
NO853738L (no) 1986-04-01
EP0176356A3 (en) 1986-08-20
US4592816A (en) 1986-06-03
FI80350C (fi) 1990-05-10
KR860002735A (ko) 1986-04-28
DE3566047D1 (en) 1988-12-08
JPH081519B2 (ja) 1996-01-10
IE852343L (en) 1986-03-26
EP0176356B1 (fr) 1988-11-02
FI853691A0 (fi) 1985-09-25
AU4786285A (en) 1986-04-10
IL76491A (en) 1989-07-31
KR920005775B1 (ko) 1992-07-18
CA1257803A (fr) 1989-07-25
DK434885A (da) 1986-03-27
IL76491A0 (en) 1986-01-31
CN1058431A (zh) 1992-02-05
CN86100150A (zh) 1987-07-22
DK434885D0 (da) 1985-09-25
NO168857C (no) 1992-04-08
DK168802B1 (da) 1994-06-13
MX165458B (es) 1992-11-11

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