AT517014A3 - Verfahren und Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat - Google Patents

Verfahren und Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat Download PDF

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Publication number
AT517014A3
AT517014A3 AT502912016A AT502912016A AT517014A3 AT 517014 A3 AT517014 A3 AT 517014A3 AT 502912016 A AT502912016 A AT 502912016A AT 502912016 A AT502912016 A AT 502912016A AT 517014 A3 AT517014 A3 AT 517014A3
Authority
AT
Austria
Prior art keywords
substrate
coating
metering device
applying
solvent
Prior art date
Application number
AT502912016A
Other languages
English (en)
Other versions
AT517014A2 (de
AT517014B1 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT517014A2 publication Critical patent/AT517014A2/de
Application granted granted Critical
Publication of AT517014A3 publication Critical patent/AT517014A3/de
Publication of AT517014B1 publication Critical patent/AT517014B1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/34—Applying different liquids or other fluent materials simultaneously
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01921—Manufacture or treatment of bond pads using local deposition
    • H10W72/01923—Manufacture or treatment of bond pads using local deposition in liquid form, e.g. by dispensing droplets or by screen printing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Die Erfindung betrifft eine Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat (3), mit einer Dosiereinrichtung (5), mit der ein Beschichtungsfluid (2) als Strahl auf das Substrat (3) aufgebracht werden kann, und mit einem Lösungsmitteldispenser (10), der exzentrisch und seitlich des vorderen Endes der Dosiereinrichtung (5) angeordnet ist, so dass dem vorderen Ende der Dosiereinrichtung (5) eine vorbestimmte Menge Lösungsmittel (14) verabreicht werden kann. Die Erfindung betrifft auch ein Verfahren zum Aufbringen einer Beschichtung auf ein Substrat (3) mittels einer Vorrichtung nach einem der vorhergehenden Ansprüche, wobei vor dem Aufbringen des Beschichtungsfluids (2) eine vorbestimmte Menge Lösungsmittel (14) auf das vordere Ende der Dosiereinrichtung (5) gebracht wird, so dass das Lösungsmittel (14) mit dem sich dort befindenden Beschichtungsfluid (2) in Kontakt gelangt, und nach einer Wartezeit das Beschichtungsfluid (2) mittels der Dosiereinrichtung (5) auf das Substrat (3) aufgebracht wird.
AT502912016A 2015-04-08 2016-04-08 Verfahren und Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat AT517014B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2014597A NL2014597B1 (en) 2015-04-08 2015-04-08 Method and device for applying a coating to a substrate.

Publications (3)

Publication Number Publication Date
AT517014A2 AT517014A2 (de) 2016-10-15
AT517014A3 true AT517014A3 (de) 2019-11-15
AT517014B1 AT517014B1 (de) 2019-11-15

Family

ID=53836151

Family Applications (1)

Application Number Title Priority Date Filing Date
AT502912016A AT517014B1 (de) 2015-04-08 2016-04-08 Verfahren und Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat

Country Status (8)

Country Link
US (1) US20160296968A1 (de)
JP (1) JP6715658B2 (de)
KR (1) KR20160120679A (de)
CN (1) CN106054535B (de)
AT (1) AT517014B1 (de)
DE (1) DE102016106399A1 (de)
NL (1) NL2014597B1 (de)
TW (1) TWI754612B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116618241B (zh) * 2023-07-24 2023-09-12 江苏泽润新能科技股份有限公司 一种汽车电池包灌胶装置

Citations (3)

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EP0540447A1 (de) * 1991-10-29 1993-05-05 International Business Machines Corporation Materialsparende Schleuder für Fotolack und Verfahren
US6001417A (en) * 1996-09-18 1999-12-14 Kabushiki Kaisha Toshiba Resist coating method and resist coating apparatus
US20010033895A1 (en) * 2000-04-25 2001-10-25 Tokyo Electron Limited Film forming method and film forming apparatus

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JPS62185322A (ja) * 1986-02-10 1987-08-13 Nec Corp フオトレジスト塗布装置
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EP0540447A1 (de) * 1991-10-29 1993-05-05 International Business Machines Corporation Materialsparende Schleuder für Fotolack und Verfahren
US6001417A (en) * 1996-09-18 1999-12-14 Kabushiki Kaisha Toshiba Resist coating method and resist coating apparatus
US20010033895A1 (en) * 2000-04-25 2001-10-25 Tokyo Electron Limited Film forming method and film forming apparatus

Also Published As

Publication number Publication date
DE102016106399A1 (de) 2016-10-13
CN106054535B (zh) 2021-04-27
JP2016219791A (ja) 2016-12-22
JP6715658B2 (ja) 2020-07-01
AT517014A2 (de) 2016-10-15
KR20160120679A (ko) 2016-10-18
NL2014597B1 (en) 2017-01-20
TW201709985A (zh) 2017-03-16
TWI754612B (zh) 2022-02-11
US20160296968A1 (en) 2016-10-13
AT517014B1 (de) 2019-11-15
CN106054535A (zh) 2016-10-26
NL2014597A (en) 2016-10-12

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Effective date: 20220408