ATE122485T1 - Ic-karte mit integriertem schaltkreismodul. - Google Patents

Ic-karte mit integriertem schaltkreismodul.

Info

Publication number
ATE122485T1
ATE122485T1 AT90311820T AT90311820T ATE122485T1 AT E122485 T1 ATE122485 T1 AT E122485T1 AT 90311820 T AT90311820 T AT 90311820T AT 90311820 T AT90311820 T AT 90311820T AT E122485 T1 ATE122485 T1 AT E122485T1
Authority
AT
Austria
Prior art keywords
card
recess
module
circuit board
integrated circuit
Prior art date
Application number
AT90311820T
Other languages
English (en)
Inventor
Tomoshige Oka
Shigeo Hiraishi
Yoshiteru Ibuki
Hiroyuki Kaneko
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17645621&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE122485(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Application granted granted Critical
Publication of ATE122485T1 publication Critical patent/ATE122485T1/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07728Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
AT90311820T 1989-10-31 1990-10-29 Ic-karte mit integriertem schaltkreismodul. ATE122485T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28190789 1989-10-31

Publications (1)

Publication Number Publication Date
ATE122485T1 true ATE122485T1 (de) 1995-05-15

Family

ID=17645621

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90311820T ATE122485T1 (de) 1989-10-31 1990-10-29 Ic-karte mit integriertem schaltkreismodul.

Country Status (6)

Country Link
EP (1) EP0426406B2 (de)
JP (1) JP3095766B2 (de)
AT (1) ATE122485T1 (de)
CA (1) CA2027823C (de)
DE (1) DE69019298T3 (de)
ES (1) ES2074139T5 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07182471A (ja) * 1991-01-10 1995-07-21 Nec Corp Icカード
FR2684471B1 (fr) * 1991-12-02 1994-03-04 Solaic Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
DE4209184C1 (de) * 1992-03-21 1993-05-19 Orga Kartensysteme Gmbh, 6072 Dreieich, De
JPH06166286A (ja) * 1992-11-30 1994-06-14 Sony Corp メモリカードの加熱圧着方法及び圧着機
US5956601A (en) * 1996-04-25 1999-09-21 Kabushiki Kaisha Toshiba Method of mounting a plurality of semiconductor devices in corresponding supporters
DE29709618U1 (de) * 1997-06-03 1997-08-07 Sternberg, Dirk, 94568 St Oswald Chipkarte und Kartenadapter
FR2794552B1 (fr) * 1999-06-03 2001-08-31 Gemplus Card Int Procede de collage a chaud d'un module electronique dans une carte a puce
GB2352999A (en) * 1999-07-21 2001-02-14 Allan Walter Sills Smart card with chip carrier with contact pads fitted into aperture of card base
EP2418608A1 (de) * 2010-07-23 2012-02-15 Gemalto SA Gesichertes elektronisches Modul, Vorrichtung mit gesichertem elektronischen Modul und entsprechendes Herstellungsverfahren
EP3168788A1 (de) 2015-11-11 2017-05-17 Mastercard International Incorporated Chipkarte
EP3168787A1 (de) * 2015-11-11 2017-05-17 Mastercard International Incorporated Chipkarte
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11267172B2 (en) * 2016-07-27 2022-03-08 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
SG11202002064SA (en) 2017-09-07 2020-04-29 Composecure Llc Transaction card with embedded electronic components and process for manufacture
HUE060022T2 (hu) 2017-10-18 2023-01-28 Composecure Llc Fém, kerámia vagy kerámiabevonatos tranzakciókártya ablakkal vagy ablakmintával és opcionális háttévilágítással
JP7485005B1 (ja) * 2022-12-19 2024-05-16 株式会社レゾナック 接合体の製造方法、接合体、及び電気電子部品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben

Also Published As

Publication number Publication date
EP0426406A3 (en) 1993-03-24
ES2074139T3 (es) 1995-09-01
DE69019298T2 (de) 1996-01-04
DE69019298D1 (de) 1995-06-14
JPH03205197A (ja) 1991-09-06
CA2027823A1 (en) 1991-05-01
EP0426406B2 (de) 1998-08-19
JP3095766B2 (ja) 2000-10-10
EP0426406B1 (de) 1995-05-10
ES2074139T5 (es) 1999-01-01
CA2027823C (en) 1994-11-08
EP0426406A2 (de) 1991-05-08
DE69019298T3 (de) 1999-04-15

Similar Documents

Publication Publication Date Title
ATE122485T1 (de) Ic-karte mit integriertem schaltkreismodul.
CA2089435A1 (en) Semiconductor device
DE3752101D1 (de) Baustein mit integrierten Schaltkreisen
ATE192883T1 (de) Elektronikmodul in flachbauweise und chipkarte
CA2195438A1 (en) Optical Card with a Built-In IC Module
EP0766197A4 (de) Chipkarte und -modul
SE8102962L (sv) Berelement for en ic-chip
KR960001604B1 (en) Semiconductor device with an encapsulation package
SE8106889L (sv) Berelement for komponenter i form av integrerade kretsar
MY115170A (en) Semiconductor devices and methods of making the devices
KR960009146A (ko) 집적 테스트 회로가 인터포저 기판 내부에 배치되어 있는 멀티칩 모듈 및 그 제조 방법
SE8104663L (sv) Berelement for en ic-modul
KR940022812A (ko) 반도체장치용 패키지 및 반도체장치
EP0333374A3 (de) Randmontierte Packung vom Oberflächen-Montierungstyp, für integrierte Halbleiterschaltungsanordnungen
KR910007401A (ko) Ic 실장장치
DE3869248D1 (de) Traegerelement zum einbau in ausweiskarten.
ATE167319T1 (de) Basis folie für chip karte
EP0695494A4 (de) Elektronisches modul mit einem stapel von ic-chips
DE3677937D1 (de) Modul mit zwei gedruckten schaltungsplatten.
EP0381383A3 (de) Halbleitervorrichtung mit auf ein leitendes Substrat aufgeklebtem isolierenden Substrat
EP0618083A4 (de) Chip karte.
KR900700302A (ko) Ic카드 및 그 제조방법
FR2778308B1 (fr) Procede de realisation d'un composant electronique et composant electronique
DE69013646D1 (de) Integrierte Halbleiterschaltungsvorrichtung mit Kontaktierungsflächen am Rande des Halbleiterchips.
TW359748B (en) Device for inspecting liquid crystal display panel, method of inspecting liquid crystal display panel and method of manufacturing liquid crystal display panel