ATE147542T1 - Eine versiegelbare kontaminationsdichte behälterverpackung für wafer - Google Patents

Eine versiegelbare kontaminationsdichte behälterverpackung für wafer

Info

Publication number
ATE147542T1
ATE147542T1 AT90303175T AT90303175T ATE147542T1 AT E147542 T1 ATE147542 T1 AT E147542T1 AT 90303175 T AT90303175 T AT 90303175T AT 90303175 T AT90303175 T AT 90303175T AT E147542 T1 ATE147542 T1 AT E147542T1
Authority
AT
Austria
Prior art keywords
package
sides
opposing
wafers
wafer
Prior art date
Application number
AT90303175T
Other languages
English (en)
Inventor
Barry Gergerson
Larry Dressen
Original Assignee
Empak Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23293349&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE147542(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Empak Inc filed Critical Empak Inc
Application granted granted Critical
Publication of ATE147542T1 publication Critical patent/ATE147542T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT90303175T 1989-03-31 1990-03-26 Eine versiegelbare kontaminationsdichte behälterverpackung für wafer ATE147542T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/331,291 US4966284A (en) 1987-07-07 1989-03-31 Substrate package

Publications (1)

Publication Number Publication Date
ATE147542T1 true ATE147542T1 (de) 1997-01-15

Family

ID=23293349

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90303175T ATE147542T1 (de) 1989-03-31 1990-03-26 Eine versiegelbare kontaminationsdichte behälterverpackung für wafer

Country Status (6)

Country Link
US (1) US4966284A (de)
EP (1) EP0400784B1 (de)
JP (2) JPH0766939B2 (de)
KR (1) KR970003729B1 (de)
AT (1) ATE147542T1 (de)
DE (1) DE69029604T2 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242696A (en) * 1991-05-14 1993-09-07 Kraft General Foods, Inc. Food package with resiliently biased lid
JPH0563066A (ja) * 1991-08-30 1993-03-12 Shin Etsu Handotai Co Ltd ウエーハ収納容器の係止構造
JPH0563067A (ja) * 1991-08-30 1993-03-12 Shin Etsu Handotai Co Ltd ウエーハ収納容器の積み重ね構造
USD344891S (en) 1992-02-03 1994-03-08 Empak, Inc. Disc package for semiconductor wafers
US5255797A (en) * 1992-02-26 1993-10-26 Fluoroware, Inc. Wafer carrier with wafer retaining cushions
US5273159A (en) * 1992-05-26 1993-12-28 Empak, Inc. Wafer suspension box
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
JP2946450B2 (ja) * 1993-04-27 1999-09-06 コマツ電子金属株式会社 半導体ウェーハ包装容器
US5472086A (en) * 1994-03-11 1995-12-05 Holliday; James E. Enclosed sealable purgible semiconductor wafer holder
US5476176A (en) * 1994-05-23 1995-12-19 Empak, Inc. Reinforced semiconductor wafer holder
USD364271S (en) 1994-06-30 1995-11-21 Rubbermaid Incorporated Hardware container
WO1996002069A1 (en) * 1994-07-08 1996-01-25 Shin-Etsu Handotai Co., Ltd. Storage container for semiconductor crystal
US5816410A (en) * 1994-07-15 1998-10-06 Fluoroware, Inc. Wafer cushions for wafer shipper
US5586658A (en) * 1995-06-06 1996-12-24 Fluoroware, Inc. Wafer cushions for wafer shipper
USD368802S (en) 1994-10-13 1996-04-16 Gallagher Gary M 150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment
USD376688S (en) 1994-12-20 1996-12-24 Empak, Inc. Semiconductor wafer cassette transport box
USD383898S (en) * 1995-10-13 1997-09-23 Empak, Inc. Combination shipping and transport cassette
USD387903S (en) * 1995-10-13 1997-12-23 Empak, Inc. Shipping container
USD378873S (en) * 1995-10-13 1997-04-22 Empak, Inc. 300 mm microenvironment pod with door on side
US6003674A (en) * 1996-05-13 1999-12-21 Brooks; Ray Gene Method and apparatus for packing contaminant-sensitive articles and resulting package
US5711427A (en) * 1996-07-12 1998-01-27 Fluoroware, Inc. Wafer carrier with door
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
US5775508A (en) * 1997-01-06 1998-07-07 Empak, Inc. Disk package for rotating memory disks
US6216874B1 (en) 1998-07-10 2001-04-17 Fluoroware, Inc. Wafer carrier having a low tolerance build-up
US5992638A (en) * 1998-11-11 1999-11-30 Empak, Inc. Advanced wafer shipper
US7789241B2 (en) * 2002-03-12 2010-09-07 Seagate Technology Llc Ergonomic substrate container
US7175026B2 (en) 2002-05-03 2007-02-13 Maxtor Corporation Memory disk shipping container with improved contaminant control
JP2005294386A (ja) * 2004-03-31 2005-10-20 Miraial Kk 薄板支持容器用蓋体
US20060042998A1 (en) * 2004-08-24 2006-03-02 Haggard Clifton C Cushion for packing disks such as semiconductor wafers
EP1945520A4 (de) * 2005-10-26 2009-11-25 Steelworks Hardware Llc Tragbarer und stapelbarer mehrzweckbehälter aus kunststoff
KR101472145B1 (ko) 2006-11-07 2014-12-12 신에츠 폴리머 가부시키가이샤 기판 수납 용기
JP4997962B2 (ja) 2006-12-27 2012-08-15 ソニー株式会社 音声出力装置、音声出力方法、音声出力処理用プログラムおよび音声出力システム
JP4858978B2 (ja) * 2007-02-22 2012-01-18 信越ポリマー株式会社 カセット及びこれを用いた基板収納容器
US20100020440A1 (en) * 2008-07-25 2010-01-28 Seagate Technology Llc Low profile substrate shipper
CN102883973B (zh) 2010-03-11 2016-02-24 恩特格林斯公司 薄晶片运载器
KR102093202B1 (ko) 2012-04-09 2020-03-25 엔테그리스, 아이엔씨. 웨이퍼 운송장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285477A (en) * 1976-01-09 1977-07-15 Senken Kk Wafer carrying container for integrated circuit
US4520925A (en) * 1983-08-09 1985-06-04 Empak Inc. Package
US4557382A (en) * 1983-08-17 1985-12-10 Empak Inc. Disk package
US4493418A (en) * 1983-08-17 1985-01-15 Empak Inc. Wafer processing cassette
JPS61170043A (ja) * 1985-01-23 1986-07-31 Toshiba Ceramics Co Ltd ウエハキヤリア搬送治具
IT1181778B (it) * 1985-05-07 1987-09-30 Dynamit Nobel Silicon Spa Contenitore per l'immagazzinamento ed il trasporto di dischetti (fette) di silicio
JPS6233436A (ja) * 1985-08-07 1987-02-13 Shin Etsu Handotai Co Ltd 輸送用ウエ−ハケ−ス
DE3577795D1 (de) * 1985-12-23 1990-06-21 Asyst Technologies Durch eine behaeltertuer betaetigter halter.
DE3610623A1 (de) * 1986-03-29 1987-10-01 Peter Florjancic Behaelter fuer kompaktplatten
US4752007A (en) * 1986-12-11 1988-06-21 Fluoroware, Inc. Disk shipper
US4793488A (en) * 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
US4817795A (en) * 1988-03-04 1989-04-04 Fluoroware, Inc. Robotic accessible wafer shipper assembly
JPH01268148A (ja) * 1988-04-20 1989-10-25 Nippon Steel Corp ウェーハ輸送用ケース
JPH01274447A (ja) * 1988-04-26 1989-11-02 Nippon Steel Corp ウェーハ輸送用ケース
EP0343762A3 (de) * 1988-05-24 1991-05-08 Empak Inc. Verpackung für Halbleiterscheiben

Also Published As

Publication number Publication date
JPH0766939B2 (ja) 1995-07-19
US4966284A (en) 1990-10-30
DE69029604T2 (de) 1997-07-24
EP0400784B1 (de) 1997-01-08
JPH03114245A (ja) 1991-05-15
JPH07307381A (ja) 1995-11-21
KR970003729B1 (ko) 1997-03-21
KR900015296A (ko) 1990-10-26
EP0400784A2 (de) 1990-12-05
EP0400784A3 (de) 1991-07-24
DE69029604D1 (de) 1997-02-20

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Legal Events

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