ATE161901T1 - Elektroplattierte kupferfolie und verfahren zu deren herstellung - Google Patents

Elektroplattierte kupferfolie und verfahren zu deren herstellung

Info

Publication number
ATE161901T1
ATE161901T1 AT94307388T AT94307388T ATE161901T1 AT E161901 T1 ATE161901 T1 AT E161901T1 AT 94307388 T AT94307388 T AT 94307388T AT 94307388 T AT94307388 T AT 94307388T AT E161901 T1 ATE161901 T1 AT E161901T1
Authority
AT
Austria
Prior art keywords
foil
cathode
copper foil
copper
anode
Prior art date
Application number
AT94307388T
Other languages
English (en)
Inventor
Dino F Difranco
Shiuh-Kao Chiang
Craig J Hasegawa
Original Assignee
Gould Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Electronics Inc filed Critical Gould Electronics Inc
Application granted granted Critical
Publication of ATE161901T1 publication Critical patent/ATE161901T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
AT94307388T 1993-10-22 1994-10-07 Elektroplattierte kupferfolie und verfahren zu deren herstellung ATE161901T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/141,483 US5431803A (en) 1990-05-30 1993-10-22 Electrodeposited copper foil and process for making same

Publications (1)

Publication Number Publication Date
ATE161901T1 true ATE161901T1 (de) 1998-01-15

Family

ID=22495882

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94307388T ATE161901T1 (de) 1993-10-22 1994-10-07 Elektroplattierte kupferfolie und verfahren zu deren herstellung

Country Status (10)

Country Link
US (1) US5431803A (de)
EP (1) EP0649917B1 (de)
JP (2) JP3270637B2 (de)
KR (1) KR100364685B1 (de)
CN (1) CN1047411C (de)
AT (1) ATE161901T1 (de)
DE (1) DE69407726T2 (de)
MY (1) MY111485A (de)
RU (1) RU2122049C1 (de)
TW (1) TW373037B (de)

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* Cited by examiner, † Cited by third party
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JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) * 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
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JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
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RU94037962A (ru) 1997-02-27
US5431803A (en) 1995-07-11
KR100364685B1 (ko) 2003-04-16
JP2002129373A (ja) 2002-05-09
TW373037B (en) 1999-11-01
CN1105398A (zh) 1995-07-19
CN1047411C (zh) 1999-12-15
DE69407726D1 (de) 1998-02-12
RU2122049C1 (ru) 1998-11-20
EP0649917B1 (de) 1998-01-07
DE69407726T2 (de) 1998-04-16
JP3270637B2 (ja) 2002-04-02
KR950013331A (ko) 1995-05-17
MY111485A (en) 2000-06-30
JPH07188969A (ja) 1995-07-25

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