ATE175520T1 - Plättchenbehandlungssystem - Google Patents

Plättchenbehandlungssystem

Info

Publication number
ATE175520T1
ATE175520T1 AT96114218T AT96114218T ATE175520T1 AT E175520 T1 ATE175520 T1 AT E175520T1 AT 96114218 T AT96114218 T AT 96114218T AT 96114218 T AT96114218 T AT 96114218T AT E175520 T1 ATE175520 T1 AT E175520T1
Authority
AT
Austria
Prior art keywords
wafers
support plate
separating
platele
treatment system
Prior art date
Application number
AT96114218T
Other languages
English (en)
Inventor
Takeshiro Miyazaki
Yoshikazu Tsubata
Akio Kawakita
Noboru Katsumata
Akihiro Nakayama
Toyokazu Harada
Mitsuo Takaku
Syunso Yoshida
Original Assignee
Nippei Toyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP22947695A external-priority patent/JP3086639B2/ja
Priority claimed from JP23558195A external-priority patent/JP3254115B2/ja
Priority claimed from JP30952095A external-priority patent/JP3150888B2/ja
Priority claimed from JP4225196A external-priority patent/JP3230566B2/ja
Application filed by Nippei Toyama Corp filed Critical Nippei Toyama Corp
Application granted granted Critical
Publication of ATE175520T1 publication Critical patent/ATE175520T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • External Artificial Organs (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
AT96114218T 1995-09-06 1996-09-05 Plättchenbehandlungssystem ATE175520T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP22947695A JP3086639B2 (ja) 1995-09-06 1995-09-06 ワイヤソー装置により切断されたワークの剥離装置及び剥離方法
JP23558195A JP3254115B2 (ja) 1995-09-13 1995-09-13 割れワーク検出装置及び割れワーク検出方法
JP30952095A JP3150888B2 (ja) 1995-11-28 1995-11-28 ウエハの分離搬送装置及び分離搬送方法
JP33734695 1995-12-25
JP4225196A JP3230566B2 (ja) 1996-02-29 1996-02-29 ウエハの分離搬送装置

Publications (1)

Publication Number Publication Date
ATE175520T1 true ATE175520T1 (de) 1999-01-15

Family

ID=27522242

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96114218T ATE175520T1 (de) 1995-09-06 1996-09-05 Plättchenbehandlungssystem

Country Status (5)

Country Link
US (1) US5950643A (de)
EP (1) EP0762483B1 (de)
KR (1) KR100230625B1 (de)
AT (1) ATE175520T1 (de)
DE (1) DE69601292T2 (de)

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US7264680B2 (en) * 1997-05-09 2007-09-04 Semitool, Inc. Process and apparatus for treating a workpiece using ozone
US7404863B2 (en) * 1997-05-09 2008-07-29 Semitool, Inc. Methods of thinning a silicon wafer using HF and ozone
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CN105983552B (zh) * 2015-02-15 2019-12-24 盛美半导体设备（上海）有限公司 一种防掉落的半导体清洗装置
JP6324917B2 (ja) * 2015-03-03 2018-05-16 富士フイルム株式会社 液体供給装置及び画像形成装置
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CN105396855B (zh) * 2015-12-08 2017-08-25 天津中环半导体股份有限公司 用于硅片清洗机的上料装置
CN105946127B (zh) * 2016-05-23 2019-03-08 天通日进精密技术有限公司 单段式硅棒截断机及其截断方法
JP6568838B2 (ja) * 2016-10-18 2019-08-28 上村工業株式会社 乾燥装置
CN107993963B (zh) * 2017-11-21 2020-07-10 长江存储科技有限责任公司 用于晶圆检测的机械手臂
CN109382351B (zh) * 2018-05-03 2021-06-04 徐州工程学院 一种工件清洗设备
CN108637871A (zh) * 2018-06-28 2018-10-12 黄洪飞 一种高效除锈装置
KR101964567B1 (ko) * 2018-11-29 2019-04-01 손귀욱 반도체 웨이퍼의 낱장분리장치
KR101964568B1 (ko) * 2018-11-29 2019-04-01 손귀욱 반도체 웨이퍼의 낱장분리방법 및 반도체 웨이퍼를 낱장으로 분리하는 자동화 장치
JP7355618B2 (ja) * 2018-12-04 2023-10-03 株式会社ディスコ ウエーハ分割装置
CN109841554B (zh) * 2019-03-25 2024-04-12 常州华数锦明智能装备技术研究院有限公司 一种硅片百片整形上料设备
CN110173016A (zh) * 2019-06-28 2019-08-27 阜宁协鑫光伏科技有限公司 插片机用水系统
CN110201962A (zh) * 2019-06-28 2019-09-06 阜宁协鑫光伏科技有限公司 插片机用水系统
CN110394708B (zh) * 2019-07-30 2021-05-28 马鞍山市金韩防水保温工程有限责任公司 一种五金建筑装饰件加工用表面处理锁合装置
JP7353711B2 (ja) * 2019-08-14 2023-10-02 株式会社ディスコ ウェーハ搬送装置
KR102089225B1 (ko) * 2019-10-22 2020-05-26 손귀욱 웨이퍼 낱장 분리장치 및 이를 이용한 웨이퍼 낱장 분리방법
KR102379163B1 (ko) * 2020-01-31 2022-03-25 에스케이실트론 주식회사 제1 세정 장치, 이를 포함하는 세정 장비 및 방법
KR102368658B1 (ko) * 2020-06-01 2022-02-28 에스케이실트론 주식회사 Asc 공정 자동화 장치
CN113263403A (zh) * 2021-06-01 2021-08-17 贡觉县康巴石锅开发有限责任公司 一种基于人工智能的石锅生产工艺及设备
CN113695308B (zh) * 2021-07-20 2023-01-13 山东力冠微电子装备有限公司 一种半导体晶圆前处理系统
KR102507049B1 (ko) * 2022-10-28 2023-03-07 손귀욱 듀얼 박리 시스템을 기반으로 한 웨이퍼 낱장 분리장치
CN118553667B (zh) * 2024-07-25 2024-11-12 迈为技术(珠海)有限公司 用于晶圆键合设备的调平装置和键合调平方法
KR102820886B1 (ko) 2024-10-31 2025-06-13 고재철 논슬립 양말 제조용 몰드 및 논슬립 양말 제조 방법
CN119610428B (zh) * 2024-12-30 2026-01-09 大连连城数控机器股份有限公司 硅棒切割用压紧装置和硅棒开方机

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Also Published As

Publication number Publication date
KR100230625B1 (ko) 1999-11-15
EP0762483A1 (de) 1997-03-12
KR970018169A (ko) 1997-04-30
DE69601292D1 (de) 1999-02-18
EP0762483B1 (de) 1999-01-07
DE69601292T2 (de) 1999-08-26
US5950643A (en) 1999-09-14

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