ATE240632T1 - Integrierter konvektiver und wärmeleitender kühlkörper für mehrere montagepositionen - Google Patents

Integrierter konvektiver und wärmeleitender kühlkörper für mehrere montagepositionen

Info

Publication number
ATE240632T1
ATE240632T1 AT00986314T AT00986314T ATE240632T1 AT E240632 T1 ATE240632 T1 AT E240632T1 AT 00986314 T AT00986314 T AT 00986314T AT 00986314 T AT00986314 T AT 00986314T AT E240632 T1 ATE240632 T1 AT E240632T1
Authority
AT
Austria
Prior art keywords
die
heat sink
frame
electronic device
board
Prior art date
Application number
AT00986314T
Other languages
English (en)
Inventor
Matthew A Tehan
Armand Losinski
Jay Berkley Parkinson
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Application granted granted Critical
Publication of ATE240632T1 publication Critical patent/ATE240632T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT00986314T 1999-12-13 2000-12-11 Integrierter konvektiver und wärmeleitender kühlkörper für mehrere montagepositionen ATE240632T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/460,196 US6239972B1 (en) 1999-12-13 1999-12-13 Integrated convection and conduction heat sink for multiple mounting positions
PCT/US2000/033532 WO2001047333A2 (en) 1999-12-13 2000-12-11 Integrated convection and conduction heat sink for multiple mounting positions

Publications (1)

Publication Number Publication Date
ATE240632T1 true ATE240632T1 (de) 2003-05-15

Family

ID=23827734

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00986314T ATE240632T1 (de) 1999-12-13 2000-12-11 Integrierter konvektiver und wärmeleitender kühlkörper für mehrere montagepositionen

Country Status (14)

Country Link
US (1) US6239972B1 (de)
EP (1) EP1238574B1 (de)
JP (1) JP2003518761A (de)
KR (1) KR20020061000A (de)
AT (1) ATE240632T1 (de)
AU (1) AU769351B2 (de)
CA (1) CA2394064A1 (de)
DE (1) DE60002758T2 (de)
DK (1) DK1238574T3 (de)
ES (1) ES2195950T3 (de)
IL (2) IL150185A0 (de)
NZ (1) NZ520138A (de)
TW (1) TW499829B (de)
WO (1) WO2001047333A2 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6320723B1 (en) * 1999-06-24 2001-11-20 Seagate Technology Llc Protective cover for a disc drive printed circuit board wherein the cover and a circuit board component are thermally connected
US6426466B1 (en) * 2000-02-09 2002-07-30 International Business Machines Corporation Peripheral power board structure
US6545871B1 (en) * 2000-10-27 2003-04-08 Thomson Licensing, S.A. Apparatus for providing heat dissipation for a circuit element
US6377463B1 (en) * 2000-12-12 2002-04-23 Intel Corporation Retention module for processor and chipset thermal solutions
US6639801B2 (en) * 2001-08-10 2003-10-28 Agilent Technologies, Inc. Mechanical packaging architecture for heat dissipation
GB0200138D0 (en) * 2002-01-04 2002-02-20 Pace Micro Tech Plc A holder for electrical apparatus
US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6659168B1 (en) * 2002-07-09 2003-12-09 Hewlett-Packard Development Company, L.P. Heatsink with multiple fin types
US6975511B1 (en) * 2002-07-18 2005-12-13 Rockwell Collins Ruggedized electronic module cooling system
US6741466B1 (en) 2002-07-18 2004-05-25 Rockwell Collins Modular electronics system chassis
US6771508B1 (en) * 2003-02-14 2004-08-03 Intel Corporation Method and apparatus for cooling an electronic component
US7027299B2 (en) * 2003-08-19 2006-04-11 Sun Microsystems, Inc. Electronics assembly with arrangement for air cooling
JP4371210B2 (ja) * 2003-12-05 2009-11-25 日本電気株式会社 電子ユニットおよびその放熱構造
US7113406B1 (en) * 2004-07-22 2006-09-26 Cisco Technology, Inc. Methods and apparatus for fastening a set of heatsinks to a circuit board
CN100379333C (zh) * 2004-11-15 2008-04-02 广达电脑股份有限公司 散热装置
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
US7462934B2 (en) * 2006-06-20 2008-12-09 Microsoft Corporation Integrated heat sink
JP4796457B2 (ja) * 2006-08-16 2011-10-19 富士通株式会社 機器、演算装置および放熱部材
US20080060789A1 (en) * 2006-09-12 2008-03-13 Chang Sob Lee Heat transfer plate with retainer assembly
US7492598B2 (en) * 2006-09-20 2009-02-17 Cisco Technology, Inc. Heatsink attachment mechanism
US9380726B2 (en) * 2007-05-22 2016-06-28 James Charles Calder Retainer and thermal displacement apparatus for electronic components, methods of production and applications thereof
US8082978B2 (en) * 2007-08-07 2011-12-27 Georgia Tech Research Corporation Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
CN101907908B (zh) * 2009-06-04 2013-03-13 富准精密工业(深圳)有限公司 电子设备及其机箱
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US8270172B2 (en) * 2010-04-23 2012-09-18 GE Intelligent Platforms Embedded Systems, Inc. Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
DE102011107316A1 (de) * 2011-07-06 2013-06-06 Abb Ag Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems
US9417670B2 (en) 2012-08-07 2016-08-16 Lockheed Martin Corporation High power dissipation mezzanine card cooling frame
US9125299B2 (en) * 2012-12-06 2015-09-01 Apple Inc. Cooling for electronic components
US9223167B2 (en) 2013-06-26 2015-12-29 Apple Inc. Liquid crystal switching barrier thermal control
US9389029B2 (en) 2013-09-30 2016-07-12 Apple Inc. Heat transfer structure
CN105700646A (zh) * 2014-11-27 2016-06-22 英业达科技有限公司 服务器
US9674986B2 (en) 2015-08-03 2017-06-06 Apple Inc. Parallel heat spreader
US10794637B2 (en) 2016-10-03 2020-10-06 Ge Aviation Systems Llc Circular heatsink
US11259445B2 (en) 2020-03-05 2022-02-22 Hamilton Sundstrand Corporation Cooling mechanism for electrionic component mounted on a printed wiring board
CN111800979B (zh) * 2020-05-13 2021-09-07 浙江众合科技股份有限公司 一种用于板卡测试的随用随取式板卡储存装置
CN111487650B (zh) * 2020-05-14 2022-07-26 国网河北省电力有限公司沧州供电分公司 一种对数据采集变电站进行巡检用的定位装置
US20230224387A1 (en) 2022-01-10 2023-07-13 Apple Inc. Handheld electronic device
US12610490B2 (en) 2024-02-12 2026-04-21 Wavetherm Corporation Wedge based circuit board retainer with dual end drivescrew

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3467891A (en) * 1967-10-03 1969-09-16 Gen Electric Combination electrical,mechanical,and thermal connector assembly
US4441140A (en) * 1980-11-20 1984-04-03 Raytheon Company Printed circuit board holder
US4819713A (en) * 1987-04-23 1989-04-11 Calmark Corporation Retainer for electronic modules
US4971570A (en) 1989-08-31 1990-11-20 Hughes Aircraft Company Wedge clamp thermal connector
DE69025624T2 (de) * 1989-12-22 1996-10-24 The Foxboro Co., Foxboro, Mass. Leichte anordnung für versiegelte schaltungsplatte
US5220485A (en) 1990-04-18 1993-06-15 Harris Corporation Heat removing edge guide system and related method
DE9006916U1 (de) * 1990-06-20 1991-10-24 Robert Bosch Gmbh, 70469 Stuttgart Gehäuse für eine elektronische Schaltung
FR2669178B1 (fr) 1990-11-09 1996-07-26 Merlin Gerin Coffre et carte electronique a drain thermique et procede de fabrication d'une telle carte.
US5258887A (en) * 1992-06-15 1993-11-02 Eaton Corporation Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
US5276585A (en) 1992-11-16 1994-01-04 Thermalloy, Inc. Heat sink mounting apparatus
JPH06309532A (ja) 1993-04-26 1994-11-04 Mitsubishi Electric Corp Ｉｃカード
EP0633608B1 (de) 1993-07-08 2000-10-11 Sumitomo Metal Industries, Ltd. Herstellungsverfahren für eine Stift-Wärmesenke
US5385175A (en) 1993-11-01 1995-01-31 Intevep, S.A. Conduit having hydrophilic and oleophobic inner surfaces for oil transportation
US5615735A (en) 1994-09-29 1997-04-01 Hewlett-Packard Co. Heat sink spring clamp
US5472353A (en) 1995-04-13 1995-12-05 Hristake; Val Isobaric expandable thermal clamp for printed circuit board
US5542468A (en) 1995-06-28 1996-08-06 Lin; Chuen-Sheng CPU heat dissipator hook-up apparatus
US5831829A (en) 1996-07-18 1998-11-03 Lin; Mike Heat dissipating device for central processing units
DE19632545A1 (de) * 1996-08-13 1998-02-19 Bodenseewerk Geraetetech Elektronisches Gerät in Modulbauweise
US5930115A (en) 1996-08-26 1999-07-27 Compaq Computer Corp. Apparatus, method and system for thermal management of a semiconductor device
US5815371A (en) 1996-09-26 1998-09-29 Dell U.S.A., L.P. Multi-function heat dissipator
US5959350A (en) 1997-05-21 1999-09-28 Hon Hai Precision Ind. Co., Ltd. Fixing device for securing a heat sink to a CPU module
US5835349A (en) * 1997-06-12 1998-11-10 Harris Corporation Printed circuit board-mounted, sealed heat exchanger
TW335191U (en) 1997-07-15 1998-06-21 Hon Hai Prec Ind Co Ltd Securing device
US5886821A (en) 1997-10-02 1999-03-23 Fresnel Technologies, Inc. Lens assembly for miniature motion sensor
US5898750A (en) 1998-01-23 1999-04-27 Framatome Technologies Nested sleeve grid restraint system
US6104613A (en) * 1998-05-12 2000-08-15 Lockheed Martin Federal Systems, Inc. VME eurocard double printed wiring card host circuit card circuit (module) assembly
US5999407A (en) * 1998-10-22 1999-12-07 Lockheed Martin Corp. Electronic module with conductively heat-sunk components

Also Published As

Publication number Publication date
AU2258101A (en) 2001-07-03
US6239972B1 (en) 2001-05-29
DE60002758D1 (de) 2003-06-18
NZ520138A (en) 2003-10-31
EP1238574B1 (de) 2003-05-14
KR20020061000A (ko) 2002-07-19
CA2394064A1 (en) 2001-06-28
DE60002758T2 (de) 2004-04-08
WO2001047333A3 (en) 2002-01-17
WO2001047333A2 (en) 2001-06-28
EP1238574A2 (de) 2002-09-11
DK1238574T3 (da) 2003-07-21
IL150185A0 (en) 2002-12-01
AU769351B2 (en) 2004-01-22
ES2195950T3 (es) 2003-12-16
IL150185A (en) 2006-04-10
JP2003518761A (ja) 2003-06-10
TW499829B (en) 2002-08-21

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