ES2195950T3 - Disipador de calor por conveccion y por conduccion integrado para posiciones de montaje multiples. - Google Patents

Disipador de calor por conveccion y por conduccion integrado para posiciones de montaje multiples.

Info

Publication number
ES2195950T3
ES2195950T3 ES00986314T ES00986314T ES2195950T3 ES 2195950 T3 ES2195950 T3 ES 2195950T3 ES 00986314 T ES00986314 T ES 00986314T ES 00986314 T ES00986314 T ES 00986314T ES 2195950 T3 ES2195950 T3 ES 2195950T3
Authority
ES
Spain
Prior art keywords
heat sink
heatsink
printed wiring
frame member
mounting positions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00986314T
Other languages
English (en)
Inventor
Matthew A Tehan
Armand Losinski
Jay Berkley Parkinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Application granted granted Critical
Publication of ES2195950T3 publication Critical patent/ES2195950T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un sistema de gestión térmica integrada para dispositivos electrónicos, que incluyen dispositivos electrónicos con disipador inferior (41, 43, 45, 47) y con disipador superior (51, 53), que pueden estar montados en una placa (13) de cableado impreso, comprendiendo dicho sistema de gestión térmica: - una placa (13) de cableado impreso para soportar dispositivos electrónicos, teniendo dicha placa una primera superficie, una segunda superficie y un borde continuo que interconecta dichas primera y segunda superficies, incluyendo también la citada placa una capa (25, 31) térmicamente conductora en comunicación con la placa de cableado impreso; - al menos un dispositivo electrónico con disipador inferior y al menos un dispositivo electrónico con disipador superior montados en, al menos, una de dichas superficies primera y segunda, estando conectado térmicamente dicho dispositivo con disipador superior a dicha capa térmicamente conductora; - un miembro (15) de bastidor conectado a una de dichas superficies primera y segunda, junto a dicho borde, teniendo dicho bastidor al menos un primer lugar de montaje de un disipador de calor; y - un disipador de calor (17), incluyendo éste una parte que está destinada a aplicarse con dicho dispositivo eléctrico con disipador inferior, incluyendo además dicho disipador de calor una parte conectada a dicho miembro de bastidor para proporcionar una vía conductora desde dicho dispositivo electrónico con disipador inferior a dicho miembro de bastidor.
ES00986314T 1999-12-13 2000-12-11 Disipador de calor por conveccion y por conduccion integrado para posiciones de montaje multiples. Expired - Lifetime ES2195950T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/460,196 US6239972B1 (en) 1999-12-13 1999-12-13 Integrated convection and conduction heat sink for multiple mounting positions

Publications (1)

Publication Number Publication Date
ES2195950T3 true ES2195950T3 (es) 2003-12-16

Family

ID=23827734

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00986314T Expired - Lifetime ES2195950T3 (es) 1999-12-13 2000-12-11 Disipador de calor por conveccion y por conduccion integrado para posiciones de montaje multiples.

Country Status (14)

Country Link
US (1) US6239972B1 (es)
EP (1) EP1238574B1 (es)
JP (1) JP2003518761A (es)
KR (1) KR20020061000A (es)
AT (1) ATE240632T1 (es)
AU (1) AU769351B2 (es)
CA (1) CA2394064A1 (es)
DE (1) DE60002758T2 (es)
DK (1) DK1238574T3 (es)
ES (1) ES2195950T3 (es)
IL (2) IL150185A0 (es)
NZ (1) NZ520138A (es)
TW (1) TW499829B (es)
WO (1) WO2001047333A2 (es)

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US6771508B1 (en) * 2003-02-14 2004-08-03 Intel Corporation Method and apparatus for cooling an electronic component
US7027299B2 (en) * 2003-08-19 2006-04-11 Sun Microsystems, Inc. Electronics assembly with arrangement for air cooling
JP4371210B2 (ja) * 2003-12-05 2009-11-25 日本電気株式会社 電子ユニットおよびその放熱構造
US7113406B1 (en) * 2004-07-22 2006-09-26 Cisco Technology, Inc. Methods and apparatus for fastening a set of heatsinks to a circuit board
CN100379333C (zh) * 2004-11-15 2008-04-02 广达电脑股份有限公司 散热装置
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
US7462934B2 (en) * 2006-06-20 2008-12-09 Microsoft Corporation Integrated heat sink
JP4796457B2 (ja) * 2006-08-16 2011-10-19 富士通株式会社 機器、演算装置および放熱部材
US20080060789A1 (en) * 2006-09-12 2008-03-13 Chang Sob Lee Heat transfer plate with retainer assembly
US7492598B2 (en) * 2006-09-20 2009-02-17 Cisco Technology, Inc. Heatsink attachment mechanism
US9380726B2 (en) * 2007-05-22 2016-06-28 James Charles Calder Retainer and thermal displacement apparatus for electronic components, methods of production and applications thereof
US8082978B2 (en) * 2007-08-07 2011-12-27 Georgia Tech Research Corporation Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
CN101907908B (zh) * 2009-06-04 2013-03-13 富准精密工业(深圳)有限公司 电子设备及其机箱
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
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US9417670B2 (en) 2012-08-07 2016-08-16 Lockheed Martin Corporation High power dissipation mezzanine card cooling frame
US9125299B2 (en) * 2012-12-06 2015-09-01 Apple Inc. Cooling for electronic components
US9223167B2 (en) 2013-06-26 2015-12-29 Apple Inc. Liquid crystal switching barrier thermal control
US9389029B2 (en) 2013-09-30 2016-07-12 Apple Inc. Heat transfer structure
CN105700646A (zh) * 2014-11-27 2016-06-22 英业达科技有限公司 服务器
US9674986B2 (en) 2015-08-03 2017-06-06 Apple Inc. Parallel heat spreader
US10794637B2 (en) 2016-10-03 2020-10-06 Ge Aviation Systems Llc Circular heatsink
US11259445B2 (en) 2020-03-05 2022-02-22 Hamilton Sundstrand Corporation Cooling mechanism for electrionic component mounted on a printed wiring board
CN111800979B (zh) * 2020-05-13 2021-09-07 浙江众合科技股份有限公司 一种用于板卡测试的随用随取式板卡储存装置
CN111487650B (zh) * 2020-05-14 2022-07-26 国网河北省电力有限公司沧州供电分公司 一种对数据采集变电站进行巡检用的定位装置
US20230224387A1 (en) 2022-01-10 2023-07-13 Apple Inc. Handheld electronic device
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Also Published As

Publication number Publication date
AU2258101A (en) 2001-07-03
ATE240632T1 (de) 2003-05-15
US6239972B1 (en) 2001-05-29
DE60002758D1 (de) 2003-06-18
NZ520138A (en) 2003-10-31
EP1238574B1 (en) 2003-05-14
KR20020061000A (ko) 2002-07-19
CA2394064A1 (en) 2001-06-28
DE60002758T2 (de) 2004-04-08
WO2001047333A3 (en) 2002-01-17
WO2001047333A2 (en) 2001-06-28
EP1238574A2 (en) 2002-09-11
DK1238574T3 (da) 2003-07-21
IL150185A0 (en) 2002-12-01
AU769351B2 (en) 2004-01-22
IL150185A (en) 2006-04-10
JP2003518761A (ja) 2003-06-10
TW499829B (en) 2002-08-21

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