ATE247332T1 - Lageveränderungs-vorrichtung und -verfahren für eine halbleiterscheibe - Google Patents

Lageveränderungs-vorrichtung und -verfahren für eine halbleiterscheibe

Info

Publication number
ATE247332T1
ATE247332T1 AT99916975T AT99916975T ATE247332T1 AT E247332 T1 ATE247332 T1 AT E247332T1 AT 99916975 T AT99916975 T AT 99916975T AT 99916975 T AT99916975 T AT 99916975T AT E247332 T1 ATE247332 T1 AT E247332T1
Authority
AT
Austria
Prior art keywords
position change
change device
wafer
semiconductor disc
positioning
Prior art date
Application number
AT99916975T
Other languages
English (en)
Inventor
Pierre Astegno
Ekaterina Esteve
Alain Gaudon
Original Assignee
Recif Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Recif Sa filed Critical Recif Sa
Application granted granted Critical
Publication of ATE247332T1 publication Critical patent/ATE247332T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AT99916975T 1998-05-05 1999-05-03 Lageveränderungs-vorrichtung und -verfahren für eine halbleiterscheibe ATE247332T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9805660A FR2778496B1 (fr) 1998-05-05 1998-05-05 Procede et dispositif de changement de position d'une plaque de semi-conducteur
PCT/FR1999/001045 WO1999057752A1 (fr) 1998-05-05 1999-05-03 Procede et dispositif de changement de position d'une plaque de semi-conducteur

Publications (1)

Publication Number Publication Date
ATE247332T1 true ATE247332T1 (de) 2003-08-15

Family

ID=9526034

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99916975T ATE247332T1 (de) 1998-05-05 1999-05-03 Lageveränderungs-vorrichtung und -verfahren für eine halbleiterscheibe

Country Status (10)

Country Link
US (2) US6652216B1 (de)
EP (2) EP1365442A3 (de)
JP (1) JP2002514009A (de)
KR (1) KR20010071196A (de)
AT (1) ATE247332T1 (de)
CA (1) CA2331079A1 (de)
DE (1) DE69910376T2 (de)
FR (1) FR2778496B1 (de)
TW (1) TW419772B (de)
WO (1) WO1999057752A1 (de)

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US6468022B1 (en) * 2000-07-05 2002-10-22 Integrated Dynamics Engineering, Inc. Edge-gripping pre-aligner
FR2823188B1 (fr) * 2001-04-06 2003-09-05 R2D Ingenierie Methode et manipulateur pour le transfert de supports de composants electroniques et/ou informatiques conformes en disques
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US7217076B2 (en) 2001-08-31 2007-05-15 Asyst Technologies, Inc. Semiconductor material handling system
FR2835337B1 (fr) * 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
US20040013503A1 (en) * 2002-07-22 2004-01-22 Jaswant Sandhu Robotic hand with multi-wafer end effector
US6769861B2 (en) * 2002-10-08 2004-08-03 Brooks Automation Inc. Apparatus for alignment and orientation of a wafer for processing
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US9691651B2 (en) * 2005-01-28 2017-06-27 Brooks Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
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TWI481804B (zh) * 2012-10-03 2015-04-21 Wei Hua Chaing 瓶裝藥劑製程之自動化取送料軌道搬運車
CN103715128B (zh) * 2013-12-30 2018-10-16 上海集成电路研发中心有限公司 可调节式晶圆固定装置、方法及晶圆清洗平台
US10755960B2 (en) * 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
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CN110155721B (zh) * 2019-06-06 2021-03-12 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 传输机械臂
US11295975B2 (en) * 2019-09-13 2022-04-05 Brooks Automation Us, Llc Method and apparatus for substrate alignment
CN112563180B (zh) * 2020-12-10 2025-02-18 上海微松工业自动化有限公司 一种基于滚轮夹持驱动的晶圆定位校准装置
US20250090257A1 (en) * 2023-09-20 2025-03-20 Kawasaki Jukogyo Kabushiki Kaisha Panel conveyance apparatus and panel conveyance method
CN119361497B (zh) * 2024-12-25 2025-10-31 北京日扬弘创智能装备有限公司 晶圆夹持手臂及用于晶圆夹持手臂控制的系统、方法和装置

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Also Published As

Publication number Publication date
DE69910376T2 (de) 2004-06-24
CA2331079A1 (en) 1999-11-11
EP1078391B1 (de) 2003-08-13
EP1365442A2 (de) 2003-11-26
KR20010071196A (ko) 2001-07-28
US6652216B1 (en) 2003-11-25
FR2778496A1 (fr) 1999-11-12
WO1999057752A1 (fr) 1999-11-11
JP2002514009A (ja) 2002-05-14
EP1078391A1 (de) 2001-02-28
TW419772B (en) 2001-01-21
US20040091343A1 (en) 2004-05-13
US7108476B2 (en) 2006-09-19
FR2778496B1 (fr) 2002-04-19
DE69910376D1 (de) 2003-09-18
EP1365442A3 (de) 2008-07-30

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