ATE247893T1 - Kupfer-verbundfolie, verfahren zu deren herstellung, und kupferkaschiertes laminat und leiterplatte unter verwendung derselben - Google Patents

Kupfer-verbundfolie, verfahren zu deren herstellung, und kupferkaschiertes laminat und leiterplatte unter verwendung derselben

Info

Publication number
ATE247893T1
ATE247893T1 AT99100362T AT99100362T ATE247893T1 AT E247893 T1 ATE247893 T1 AT E247893T1 AT 99100362 T AT99100362 T AT 99100362T AT 99100362 T AT99100362 T AT 99100362T AT E247893 T1 ATE247893 T1 AT E247893T1
Authority
AT
Austria
Prior art keywords
same
copper
release layer
producing
layer
Prior art date
Application number
AT99100362T
Other languages
English (en)
Inventor
Takashi Kataoka
Yutaka Hirasawa
Takuya Yamamoto
Kenichiro Iwakiri
Akiko Sugioka
Junshi Yoshioka
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/039,960 external-priority patent/US6319620B1/en
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE247893T1 publication Critical patent/ATE247893T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12007—Component of composite having metal continuous phase interengaged with nonmetal continuous phase
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT99100362T 1998-01-19 1999-01-15 Kupfer-verbundfolie, verfahren zu deren herstellung, und kupferkaschiertes laminat und leiterplatte unter verwendung derselben ATE247893T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015098 1998-01-19
US09/039,960 US6319620B1 (en) 1998-01-19 1998-03-16 Making and using an ultra-thin copper foil

Publications (1)

Publication Number Publication Date
ATE247893T1 true ATE247893T1 (de) 2003-09-15

Family

ID=26357057

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99100362T ATE247893T1 (de) 1998-01-19 1999-01-15 Kupfer-verbundfolie, verfahren zu deren herstellung, und kupferkaschiertes laminat und leiterplatte unter verwendung derselben

Country Status (6)

Country Link
US (2) US6270889B1 (de)
EP (1) EP0930811B1 (de)
CN (1) CN1159958C (de)
AT (1) ATE247893T1 (de)
DE (1) DE69910457T2 (de)
TW (1) TW442395B (de)

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JP3676152B2 (ja) * 1999-11-11 2005-07-27 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
JP4394234B2 (ja) * 2000-01-20 2010-01-06 日鉱金属株式会社 銅電気めっき液及び銅電気めっき方法
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CN101892499B (zh) * 2010-07-24 2011-11-09 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
CN102427680B (zh) * 2011-11-16 2013-12-18 博罗县精汇电子科技有限公司 一种单面板金手指的制造工艺
JP5902931B2 (ja) * 2011-12-06 2016-04-13 新光電気工業株式会社 配線基板の製造方法、及び、配線基板製造用の支持体
TW201349976A (zh) * 2012-05-31 2013-12-01 臻鼎科技股份有限公司 多層線路板之製作方法
JP5175992B1 (ja) * 2012-07-06 2013-04-03 Ｊｘ日鉱日石金属株式会社 極薄銅箔及びその製造方法、並びに極薄銅層
CN102975456B (zh) * 2012-12-10 2015-08-05 云南昆钢新型复合材料开发有限公司 一种聚乙烯-聚丙烯层压金属复合材料防粘隔离膜
CN102964663B (zh) * 2012-12-10 2014-08-13 云南昆钢新型复合材料开发有限公司 一种聚乙烯层压金属复合材料隔离膜
JP2015133342A (ja) * 2014-01-09 2015-07-23 京セラサーキットソリューションズ株式会社 配線基板の製造方法
JP5883542B2 (ja) * 2014-02-21 2016-03-15 三井金属鉱業株式会社 保護層付銅張積層板及び多層プリント配線板
CN105632938B (zh) * 2014-11-28 2019-02-05 深南电路有限公司 一种金属载体的加工方法及封装基板
CN104968155B (zh) * 2015-06-03 2018-01-02 合肥工业大学 一种用于形成超薄铜箔剥离层的有机组合物及制备和应用
WO2017149810A1 (ja) * 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法
US10714756B2 (en) 2016-11-11 2020-07-14 GM Global Technology Operations LLC Metal deposition methods for forming bimetallic structures, batteries incorporating bipolar current collectors made therefrom, and applications thereof
CN106929886A (zh) * 2017-03-16 2017-07-07 詹秋兰 一种镀件上电镀产生电解铜箔的制作方法
JP7032578B2 (ja) * 2019-01-11 2022-03-08 三井金属鉱業株式会社 積層体
CN112981481B (zh) * 2021-02-05 2021-12-28 广东嘉元科技股份有限公司 一种超薄铜箔及其制备方法
CN113507780A (zh) * 2021-07-08 2021-10-15 江西柔顺科技有限公司 一种散热线路板及其制备方法
CN113858603A (zh) * 2021-09-13 2021-12-31 深圳市信维通信股份有限公司 一种聚合物挠性覆铜板的制备方法
CN115233262B (zh) * 2022-08-01 2023-12-12 九江德福科技股份有限公司 一种附载体极薄铜箔的制备方法
CN116641018A (zh) * 2023-05-16 2023-08-25 九江德福科技股份有限公司 附载体极薄铜箔及其制备方法
CN118685827B (zh) * 2024-08-23 2024-12-13 安徽华威铜箔科技有限公司 一种一体式载体铜箔生产设备
CN120519928B (zh) * 2025-07-25 2025-11-18 山东大学 一种以金属-有机二硫化物为复合剥离层的极薄铜箔的制备方法
CN120683569B (zh) * 2025-08-28 2025-12-05 山东大学 带载体极薄金属箔的制备方法

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Also Published As

Publication number Publication date
DE69910457T2 (de) 2004-07-01
US6270889B1 (en) 2001-08-07
DE69910457D1 (de) 2003-09-25
CN1159958C (zh) 2004-07-28
TW442395B (en) 2001-06-23
CN1230872A (zh) 1999-10-06
US20020070120A1 (en) 2002-06-13
EP0930811B1 (de) 2003-08-20
EP0930811A1 (de) 1999-07-21

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