ATE254802T1 - Vorrichtung zur trennung eines verbundbauteils mit einem flüssigkeitsstrahl - Google Patents

Vorrichtung zur trennung eines verbundbauteils mit einem flüssigkeitsstrahl

Info

Publication number
ATE254802T1
ATE254802T1 AT01202222T AT01202222T ATE254802T1 AT E254802 T1 ATE254802 T1 AT E254802T1 AT 01202222 T AT01202222 T AT 01202222T AT 01202222 T AT01202222 T AT 01202222T AT E254802 T1 ATE254802 T1 AT E254802T1
Authority
AT
Austria
Prior art keywords
separating
liquid jet
composite member
composite component
separate
Prior art date
Application number
AT01202222T
Other languages
English (en)
Inventor
Kazuaki Ohmi
Takao Yonehara
Kiyofumi Sakaguchi
Kazutaka Yanagita
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE254802T1 publication Critical patent/ATE254802T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1137—Using air blast directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1374—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing with means projecting fluid against work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1922—Vibrating delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1933—Spraying delaminating means [e.g., atomizer, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1933—Spraying delaminating means [e.g., atomizer, etc.
    • Y10T156/1939—Air blasting delaminating means]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49821—Disassembling by altering or destroying work part or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/364—By fluid blast and/or suction

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Element Separation (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Processing Of Solid Wastes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Centrifugal Separators (AREA)
AT01202222T 1997-03-27 1998-03-26 Vorrichtung zur trennung eines verbundbauteils mit einem flüssigkeitsstrahl ATE254802T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7549897 1997-03-27
JP13847797 1997-05-28

Publications (1)

Publication Number Publication Date
ATE254802T1 true ATE254802T1 (de) 2003-12-15

Family

ID=26416627

Family Applications (2)

Application Number Title Priority Date Filing Date
AT01202222T ATE254802T1 (de) 1997-03-27 1998-03-26 Vorrichtung zur trennung eines verbundbauteils mit einem flüssigkeitsstrahl
AT98302313T ATE224098T1 (de) 1997-03-27 1998-03-26 Verfahren und vorrichtung zum zerteilen einer verbundbauteil unter verwendung einer flüssigkeit

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT98302313T ATE224098T1 (de) 1997-03-27 1998-03-26 Verfahren und vorrichtung zum zerteilen einer verbundbauteil unter verwendung einer flüssigkeit

Country Status (11)

Country Link
US (5) US6382292B1 (de)
EP (2) EP1134790B1 (de)
KR (2) KR100397607B1 (de)
CN (2) CN1157762C (de)
AT (2) ATE254802T1 (de)
AU (1) AU747567B2 (de)
CA (1) CA2233127C (de)
DE (2) DE69819940T2 (de)
ES (2) ES2182226T3 (de)
SG (1) SG68035A1 (de)
TW (1) TW463229B (de)

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EP1134790B1 (de) 2003-11-19
CN100477072C (zh) 2009-04-08
US20020029849A1 (en) 2002-03-14
CA2233127C (en) 2004-07-06
EP0867917A2 (de) 1998-09-30
KR100397607B1 (ko) 2003-10-17
EP0867917A3 (de) 2000-05-17
DE69819940D1 (de) 2003-12-24
ES2206379T3 (es) 2004-05-16
US6382292B1 (en) 2002-05-07
US6475323B1 (en) 2002-11-05
AU5966298A (en) 1998-10-01
US20040171233A1 (en) 2004-09-02
CN1157762C (zh) 2004-07-14
DE69807767T2 (de) 2003-08-14
TW463229B (en) 2001-11-11
US20020179243A1 (en) 2002-12-05
CA2233127A1 (en) 1998-09-27
CN1208246A (zh) 1999-02-17
US6746559B2 (en) 2004-06-08
EP1134790A2 (de) 2001-09-19
ATE224098T1 (de) 2002-09-15
EP1134790A3 (de) 2001-12-19
KR19980080777A (ko) 1998-11-25
AU747567B2 (en) 2002-05-16
ES2182226T3 (es) 2003-03-01
DE69807767D1 (de) 2002-10-17
SG68035A1 (en) 1999-10-19
CN1444252A (zh) 2003-09-24
US20020088558A1 (en) 2002-07-11
EP0867917B1 (de) 2002-09-11
DE69819940T2 (de) 2004-08-19
KR100401448B1 (ko) 2003-10-17

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