ATE365083T1 - Verfahrensregelung für photoresistente beschichtung mit solventdampfsensor - Google Patents
Verfahrensregelung für photoresistente beschichtung mit solventdampfsensorInfo
- Publication number
- ATE365083T1 ATE365083T1 AT98967092T AT98967092T ATE365083T1 AT E365083 T1 ATE365083 T1 AT E365083T1 AT 98967092 T AT98967092 T AT 98967092T AT 98967092 T AT98967092 T AT 98967092T AT E365083 T1 ATE365083 T1 AT E365083T1
- Authority
- AT
- Austria
- Prior art keywords
- solvent vapor
- carrier gas
- coating
- photoresistant
- gas supply
- Prior art date
Links
- 239000002904 solvent Substances 0.000 title abstract 10
- 239000011248 coating agent Substances 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 239000012159 carrier gas Substances 0.000 abstract 5
- 238000004528 spin coating Methods 0.000 abstract 2
- 239000007789 gas Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0486—Operating the coating or treatment in a controlled atmosphere
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/987,179 US6027760A (en) | 1997-12-08 | 1997-12-08 | Photoresist coating process control with solvent vapor sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE365083T1 true ATE365083T1 (de) | 2007-07-15 |
Family
ID=25533082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT98967092T ATE365083T1 (de) | 1997-12-08 | 1998-12-08 | Verfahrensregelung für photoresistente beschichtung mit solventdampfsensor |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6027760A (de) |
| EP (2) | EP1847328A1 (de) |
| JP (1) | JP3747403B2 (de) |
| KR (1) | KR100502442B1 (de) |
| AT (1) | ATE365083T1 (de) |
| DE (1) | DE69837972T2 (de) |
| WO (1) | WO1999029439A1 (de) |
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| US7030039B2 (en) * | 1994-10-27 | 2006-04-18 | Asml Holding N.V. | Method of uniformly coating a substrate |
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| US7018943B2 (en) * | 1994-10-27 | 2006-03-28 | Asml Holding N.V. | Method of uniformly coating a substrate |
| US6780461B2 (en) | 1998-09-14 | 2004-08-24 | Asml Holding N.V. | Environment exchange control for material on a wafer surface |
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| US6676757B2 (en) * | 1999-12-17 | 2004-01-13 | Tokyo Electron Limited | Coating film forming apparatus and coating unit |
| US6497055B2 (en) * | 2000-01-04 | 2002-12-24 | Texas Instruments Incorporated | System and method for controlling a vapor dryer process |
| JP2001223153A (ja) * | 2000-02-10 | 2001-08-17 | Mitsubishi Electric Corp | レジスト剥離装置およびレジスト剥離液管理方法、並びに半導体装置およびその製造方法 |
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| JP2002231708A (ja) * | 2001-01-30 | 2002-08-16 | Tokyo Electron Ltd | 塗布膜処理装置および塗布膜処理方法 |
| KR101027485B1 (ko) * | 2001-02-12 | 2011-04-06 | 에이에스엠 아메리카, 인코포레이티드 | 반도체 박막 증착을 위한 개선된 공정 |
| CN1900823B (zh) * | 2001-02-28 | 2013-01-23 | Asml控股公司 | 均匀涂布基片的方法 |
| US6936546B2 (en) * | 2002-04-26 | 2005-08-30 | Accretech Usa, Inc. | Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates |
| JP2003338499A (ja) * | 2002-05-20 | 2003-11-28 | Tokyo Electron Ltd | 膜形成方法及び膜形成装置 |
| US7326437B2 (en) * | 2003-12-29 | 2008-02-05 | Asml Holding N.V. | Method and system for coating polymer solution on a substrate in a solvent saturated chamber |
| US7078355B2 (en) * | 2003-12-29 | 2006-07-18 | Asml Holding N.V. | Method and system of coating polymer solution on surface of a substrate |
| US7822586B2 (en) * | 2004-08-11 | 2010-10-26 | Entegris, Inc. | System and method for optimizing and simulating thermal management systems and predictive flow control |
| US20060052997A1 (en) * | 2004-09-09 | 2006-03-09 | International Business Machines Corporation | Automating identification of critical memory regions for pre-silicon operating systems |
| US7740908B2 (en) * | 2005-02-28 | 2010-06-22 | Fujifilm Corporation | Method for forming a film by spin coating |
| JP4402016B2 (ja) * | 2005-06-20 | 2010-01-20 | キヤノン株式会社 | 蒸着装置及び蒸着方法 |
| JP4666494B2 (ja) * | 2005-11-21 | 2011-04-06 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US20070237897A1 (en) * | 2006-03-28 | 2007-10-11 | Erich Thallner | Device and method for coating a microstructured and/or nanostructured structural substrate |
| EP1840940B8 (de) | 2006-03-28 | 2014-11-26 | Thallner, Erich, Dipl.-Ing. | Vorrichtung und Verfahren zum Beschichten eines mikro- und/oder nanostrukturierten Struktursubstrats |
| CN100449698C (zh) * | 2006-08-10 | 2009-01-07 | 中芯国际集成电路制造(上海)有限公司 | 涂胶机的排气控制装置 |
| JP4982320B2 (ja) * | 2007-09-27 | 2012-07-25 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| KR100947482B1 (ko) * | 2007-10-12 | 2010-03-17 | 세메스 주식회사 | 처리액 감지기를 갖는 밸브, 이를 이용한 기판 처리 장치및 기판 처리 방법 |
| JP5398307B2 (ja) * | 2009-03-06 | 2014-01-29 | 株式会社東芝 | 半導体装置の製造方法 |
| KR101533856B1 (ko) * | 2010-08-28 | 2015-07-06 | 이찬우 | 캐니스터 온도 조절 장치 |
| US8997775B2 (en) | 2011-05-24 | 2015-04-07 | Rohm And Haas Electronic Materials Llc | Vapor delivery device, methods of manufacture and methods of use thereof |
| CN103041954A (zh) * | 2011-10-13 | 2013-04-17 | 北大方正集团有限公司 | 一种用于旋涂设备的液位报警系统 |
| US9243325B2 (en) * | 2012-07-18 | 2016-01-26 | Rohm And Haas Electronic Materials Llc | Vapor delivery device, methods of manufacture and methods of use thereof |
| JP6148475B2 (ja) * | 2013-01-25 | 2017-06-14 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
| KR101513224B1 (ko) * | 2013-05-22 | 2015-04-17 | 주식회사 뉴젠스 | 케미컬 버블링 장치 |
| JP6444698B2 (ja) * | 2014-11-17 | 2018-12-26 | 東芝メモリ株式会社 | 基板処理装置および基板処理方法 |
| DE102018104669A1 (de) * | 2018-03-01 | 2019-09-05 | Dionex Softron Gmbh | Verwendung einer akustischen Welle in einem Chromatographiesystem |
| KR102772974B1 (ko) * | 2018-08-23 | 2025-02-27 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 및 기판 처리 시스템 |
| KR102581895B1 (ko) * | 2020-12-29 | 2023-09-22 | 세메스 주식회사 | 챔버 내 압력을 제어하기 위한 압력 조절 장치 및 이를 포함하는 기판 처리 장치 |
| CN115308999B (zh) * | 2022-10-12 | 2023-03-24 | 苏州矩阵光电有限公司 | 一种匀胶烘干一体机及匀胶烘干方法 |
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-
1997
- 1997-12-08 US US08/987,179 patent/US6027760A/en not_active Expired - Lifetime
-
1998
- 1998-12-08 EP EP07007848A patent/EP1847328A1/de not_active Withdrawn
- 1998-12-08 KR KR10-2000-7006196A patent/KR100502442B1/ko not_active Expired - Lifetime
- 1998-12-08 JP JP2000524085A patent/JP3747403B2/ja not_active Expired - Lifetime
- 1998-12-08 EP EP98967092A patent/EP1044074B8/de not_active Expired - Lifetime
- 1998-12-08 AT AT98967092T patent/ATE365083T1/de not_active IP Right Cessation
- 1998-12-08 WO PCT/US1998/026143 patent/WO1999029439A1/en not_active Ceased
- 1998-12-08 DE DE69837972T patent/DE69837972T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69837972D1 (de) | 2007-08-02 |
| EP1044074A4 (de) | 2006-03-01 |
| US6027760A (en) | 2000-02-22 |
| JP2001525251A (ja) | 2001-12-11 |
| JP3747403B2 (ja) | 2006-02-22 |
| WO1999029439A1 (en) | 1999-06-17 |
| KR20010032867A (ko) | 2001-04-25 |
| EP1847328A1 (de) | 2007-10-24 |
| KR100502442B1 (ko) | 2005-07-20 |
| EP1044074B8 (de) | 2007-08-08 |
| EP1044074B1 (de) | 2007-06-20 |
| EP1044074A1 (de) | 2000-10-18 |
| WO1999029439A8 (en) | 1999-08-19 |
| DE69837972T2 (de) | 2008-02-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |