ATE382881T1 - Individualisiertes markierungsverfahren für leiterplatten - Google Patents

Individualisiertes markierungsverfahren für leiterplatten

Info

Publication number
ATE382881T1
ATE382881T1 AT01951725T AT01951725T ATE382881T1 AT E382881 T1 ATE382881 T1 AT E382881T1 AT 01951725 T AT01951725 T AT 01951725T AT 01951725 T AT01951725 T AT 01951725T AT E382881 T1 ATE382881 T1 AT E382881T1
Authority
AT
Austria
Prior art keywords
circuit boards
marking process
blanks
individualized marking
individualized
Prior art date
Application number
AT01951725T
Other languages
English (en)
Inventor
Rauno Salmi
Original Assignee
Rauno Salmi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rauno Salmi filed Critical Rauno Salmi
Application granted granted Critical
Publication of ATE382881T1 publication Critical patent/ATE382881T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C11/00—Auxiliary processes in photography
    • G03C11/02—Marking or applying text
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0551—Exposure mask directly printed on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0614—Marking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Heat Sensitive Colour Forming Recording (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Glass Compositions (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Surgical Instruments (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Making Paper Articles (AREA)
AT01951725T 2000-06-21 2001-06-21 Individualisiertes markierungsverfahren für leiterplatten ATE382881T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20001480A FI109054B (fi) 2000-06-21 2000-06-21 Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn

Publications (1)

Publication Number Publication Date
ATE382881T1 true ATE382881T1 (de) 2008-01-15

Family

ID=8558614

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01951725T ATE382881T1 (de) 2000-06-21 2001-06-21 Individualisiertes markierungsverfahren für leiterplatten

Country Status (10)

Country Link
US (1) US20030175625A1 (de)
EP (1) EP1297383B1 (de)
JP (1) JP2004501518A (de)
KR (1) KR20030025934A (de)
CN (1) CN1203371C (de)
AT (1) ATE382881T1 (de)
AU (1) AU2001272581A1 (de)
DE (1) DE60132205T2 (de)
FI (1) FI109054B (de)
WO (1) WO2001098829A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK176229B1 (da) * 2002-06-18 2007-03-26 Photosolar Aps Optisk element til afskærmning af lys
JP4565916B2 (ja) * 2004-07-23 2010-10-20 三洋電機株式会社 光反応装置
US8492072B2 (en) * 2009-04-30 2013-07-23 Infineon Technologies Ag Method for marking objects
CN103324037B (zh) 2013-07-04 2015-01-07 北京京东方光电科技有限公司 一种曝光装置及其曝光方法
CN116235094A (zh) * 2020-11-17 2023-06-06 奥宝科技有限公司 多图案无掩模光刻方法及系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694081A (en) * 1970-02-11 1972-09-26 Pek Inc Method and apparatus for contact printing
DE3147994A1 (de) * 1981-12-04 1983-06-16 Fa. Georg Rothkegel, 5140 Erkelenz "verfahren zur herstellung von ordnungs- oder organisationskennzeichen"
JPS6172216A (ja) * 1984-09-17 1986-04-14 Shinku Lab:Kk 露光方法
JPS6454455A (en) * 1987-08-25 1989-03-01 Mitsubishi Electric Corp Aligner
JPH0189771U (de) * 1987-12-04 1989-06-13
US4853317A (en) * 1988-04-04 1989-08-01 Microfab Technologies, Inc. Method and apparatus for serializing printed circuit boards and flex circuits
JPH03239552A (ja) * 1990-02-15 1991-10-25 Matsushita Electric Works Ltd プリント配線板への印字方法
JPH04359588A (ja) * 1991-06-06 1992-12-11 Mitsubishi Electric Corp プリント配線板の製造方法
CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
JPH06255232A (ja) * 1991-09-11 1994-09-13 Cmk Corp プリント配線板の製造方法
JPH10112579A (ja) * 1996-10-07 1998-04-28 M S Tec:Kk レジスト露光方法及びその露光装置
JPH10230382A (ja) * 1997-02-21 1998-09-02 Fuji Print Kogyo Kk プリント基板のダイレクト描画方法
US6251550B1 (en) * 1998-07-10 2001-06-26 Ball Semiconductor, Inc. Maskless photolithography system that digitally shifts mask data responsive to alignment data

Also Published As

Publication number Publication date
WO2001098829A1 (en) 2001-12-27
JP2004501518A (ja) 2004-01-15
HK1056611A1 (en) 2004-02-20
EP1297383A1 (de) 2003-04-02
FI109054B (fi) 2002-05-15
FI20001480A0 (fi) 2000-06-21
DE60132205T2 (de) 2008-12-18
KR20030025934A (ko) 2003-03-29
DE60132205D1 (de) 2008-02-14
FI20001480L (fi) 2001-12-22
AU2001272581A1 (en) 2002-01-02
EP1297383B1 (de) 2008-01-02
CN1437713A (zh) 2003-08-20
US20030175625A1 (en) 2003-09-18
CN1203371C (zh) 2005-05-25

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Legal Events

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