ATE426837T1 - Lithographisches verfahren zur verdrahtung einer seitenoberflache eines substrats - Google Patents

Lithographisches verfahren zur verdrahtung einer seitenoberflache eines substrats

Info

Publication number
ATE426837T1
ATE426837T1 AT03798346T AT03798346T ATE426837T1 AT E426837 T1 ATE426837 T1 AT E426837T1 AT 03798346 T AT03798346 T AT 03798346T AT 03798346 T AT03798346 T AT 03798346T AT E426837 T1 ATE426837 T1 AT E426837T1
Authority
AT
Austria
Prior art keywords
wiring
substrate
mask
exposure
lithographic method
Prior art date
Application number
AT03798346T
Other languages
English (en)
Inventor
Antonius Nellissen
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE426837T1 publication Critical patent/ATE426837T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AT03798346T 2002-09-27 2003-09-26 Lithographisches verfahren zur verdrahtung einer seitenoberflache eines substrats ATE426837T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02079067 2002-09-27

Publications (1)

Publication Number Publication Date
ATE426837T1 true ATE426837T1 (de) 2009-04-15

Family

ID=32039180

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03798346T ATE426837T1 (de) 2002-09-27 2003-09-26 Lithographisches verfahren zur verdrahtung einer seitenoberflache eines substrats

Country Status (10)

Country Link
US (2) US7659038B2 (de)
EP (1) EP1546812B1 (de)
JP (1) JP2006500632A (de)
KR (1) KR20050048644A (de)
CN (1) CN1327298C (de)
AT (1) ATE426837T1 (de)
AU (1) AU2003263530A1 (de)
DE (1) DE60326861D1 (de)
TW (1) TW200423837A (de)
WO (1) WO2004029722A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102165001A (zh) * 2008-09-30 2011-08-24 普立万公司 阻燃热塑性弹性体
CN109963409B (zh) 2019-04-10 2021-02-23 京东方科技集团股份有限公司 基板侧面导线的制造方法和基板结构
KR102179672B1 (ko) * 2019-05-29 2020-11-17 주식회사 테토스 기판 측면부 배선 형성 방법
KR102207602B1 (ko) * 2019-05-29 2021-01-26 주식회사 테토스 기판 측면부 배선 형성 방법
KR102199602B1 (ko) * 2019-05-29 2021-01-07 주식회사 테토스 기판 회로 패턴 형성용 노광 장치
EP3611567A3 (de) 2019-07-23 2020-05-13 ASML Netherlands B.V. Verbesserungen an messzielen
WO2021100978A1 (ko) * 2019-11-20 2021-05-27 엘지디스플레이 주식회사 사이드 배선 제조 장치, 사이드 배선 제조 방법 및 표시 장치 제조 방법
EP4068373A4 (de) 2020-05-08 2023-06-07 Samsung Electronics Co., Ltd. Anzeigemodul mit glassubstrat mit darin ausgebildeter seitenverdrahtung und herstellungsverfahren dafür
CN111757608A (zh) * 2020-07-13 2020-10-09 深圳市国铭达科技有限公司 一种塑胶基底天线振子的电路及3d金属电路的加工方法
CN113660768B (zh) * 2021-08-13 2023-02-28 东风汽车集团股份有限公司 一种防破解多层pcb及其制作方法
CN113950193B (zh) * 2021-09-24 2024-09-10 上海富乐华半导体科技有限公司 Dbc覆铜陶瓷基板上圆形半腐蚀沉孔的设计方法
CN115413131B (zh) * 2022-08-15 2025-07-08 生益电子股份有限公司 侧壁选择性阻光模具、阶梯槽的图形制作方法及pcb

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703675A (en) * 1992-01-17 1997-12-30 Nikon Corporation Projection-exposing apparatus with deflecting grating member
US5413884A (en) 1992-12-14 1995-05-09 American Telephone And Telegraph Company Grating fabrication using electron beam lithography
TW358167B (en) * 1996-03-25 1999-05-11 Corning Inc Method of forming a grating in an optical waveguide
JP2747282B2 (ja) * 1996-08-29 1998-05-06 富山日本電気株式会社 印刷配線板の製造方法
DE69833193T2 (de) * 1997-08-05 2006-09-21 Koninklijke Philips Electronics N.V. Verfahren zur herstellung mehrerer elektronischer bauteile
US6183918B1 (en) * 1997-11-12 2001-02-06 Oki Electric Industry Co., Ltd. Alignment method and system for use in manufacturing an optical filter
JPH11212246A (ja) * 1998-01-22 1999-08-06 Dainippon Printing Co Ltd 回折格子形成用位相マスク
US6262791B1 (en) * 1998-07-10 2001-07-17 Ball Semiconductor, Inc. Optical element for imaging a flat mask onto a nonplanar substrate
US6188519B1 (en) * 1999-01-05 2001-02-13 Kenneth Carlisle Johnson Bigrating light valve
JP2001100391A (ja) * 1999-10-01 2001-04-13 Mitsubishi Electric Corp 半導体露光用レティクル、半導体露光用レティクルの製造方法および半導体装置
EP1151476B1 (de) 1999-11-11 2008-04-16 Nxp B.V. Halbleiteranordnung mit einem feldeffekttransistor und vefahren zur herstellung
EP1128211A1 (de) 2000-02-21 2001-08-29 Motorola, Inc. Kontaktlithographie unter Einsatz einer Schicht mit niedriger Oberflächenenergie

Also Published As

Publication number Publication date
US20100009140A1 (en) 2010-01-14
US20060051679A1 (en) 2006-03-09
AU2003263530A1 (en) 2004-04-19
WO2004029722A2 (en) 2004-04-08
CN1327298C (zh) 2007-07-18
DE60326861D1 (de) 2009-05-07
EP1546812A2 (de) 2005-06-29
CN1685286A (zh) 2005-10-19
EP1546812B1 (de) 2009-03-25
KR20050048644A (ko) 2005-05-24
WO2004029722A3 (en) 2004-11-11
JP2006500632A (ja) 2006-01-05
TW200423837A (en) 2004-11-01
AU2003263530A8 (en) 2004-04-19
US7659038B2 (en) 2010-02-09

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