ATE454649T1 - Verfahren zur erzeugung einer vertiefung in einer oberfläche einer schicht aus fotoresist - Google Patents
Verfahren zur erzeugung einer vertiefung in einer oberfläche einer schicht aus fotoresistInfo
- Publication number
- ATE454649T1 ATE454649T1 AT04812505T AT04812505T ATE454649T1 AT E454649 T1 ATE454649 T1 AT E454649T1 AT 04812505 T AT04812505 T AT 04812505T AT 04812505 T AT04812505 T AT 04812505T AT E454649 T1 ATE454649 T1 AT E454649T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- photoresist
- creating
- recess
- dose
- Prior art date
Links
- 229920002120 photoresistant polymer Polymers 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
- B01J2/14—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic in rotating dishes or pans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/734,328 US20050130075A1 (en) | 2003-12-12 | 2003-12-12 | Method for making fluid emitter orifice |
| PCT/US2004/040004 WO2005062129A1 (en) | 2003-12-12 | 2004-11-29 | Method for making fluid emitter orifice |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE454649T1 true ATE454649T1 (de) | 2010-01-15 |
Family
ID=34653336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04812505T ATE454649T1 (de) | 2003-12-12 | 2004-11-29 | Verfahren zur erzeugung einer vertiefung in einer oberfläche einer schicht aus fotoresist |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20050130075A1 (de) |
| EP (1) | EP1700166B1 (de) |
| JP (1) | JP4498363B2 (de) |
| KR (1) | KR101160710B1 (de) |
| CN (1) | CN100458569C (de) |
| AT (1) | ATE454649T1 (de) |
| DE (1) | DE602004025041D1 (de) |
| TW (1) | TWI332442B (de) |
| WO (1) | WO2005062129A1 (de) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7571380B2 (en) * | 2004-01-13 | 2009-08-04 | International Business Machines Corporation | Differential dynamic content delivery with a presenter-alterable session copy of a user profile |
| US20050280674A1 (en) * | 2004-06-17 | 2005-12-22 | Mcreynolds Darrell L | Process for modifying the surface profile of an ink supply channel in a printhead |
| US7585616B2 (en) * | 2005-01-31 | 2009-09-08 | Hewlett-Packard Development Company, L.P. | Method for making fluid emitter orifice |
| JP2008311474A (ja) * | 2007-06-15 | 2008-12-25 | Fujifilm Corp | パターン形成方法 |
| DE102010031527A1 (de) * | 2010-07-19 | 2012-01-19 | Flint Group Germany Gmbh | Verfahren zur Herstellung von Flexodruckformen umfassend die Bestrahlung mit UV-LEDs |
| JP5701000B2 (ja) | 2010-10-07 | 2015-04-15 | キヤノン株式会社 | インクジェット記録ヘッドおよびその製造方法 |
| US8652767B2 (en) | 2011-02-28 | 2014-02-18 | Canon Kabushiki Kaisha | Liquid ejection head and process for producing the same |
| JP5901149B2 (ja) * | 2011-06-01 | 2016-04-06 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| JP5959941B2 (ja) | 2012-05-31 | 2016-08-02 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| JP6000713B2 (ja) * | 2012-07-25 | 2016-10-05 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| JP6230279B2 (ja) | 2013-06-06 | 2017-11-15 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| WO2015163888A1 (en) | 2014-04-24 | 2015-10-29 | Hewlett-Packard Development Company, L.P. | Fluidic ejection device with layers having different light sensitivities |
| JP6598497B2 (ja) | 2015-04-27 | 2019-10-30 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
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| US4007464A (en) * | 1975-01-23 | 1977-02-08 | International Business Machines Corporation | Ink jet nozzle |
| DE2626420C3 (de) * | 1976-06-12 | 1979-11-29 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren zum gleichzeitigen Ätzen von mehreren durchgehenden Löchern |
| US4092166A (en) * | 1976-12-27 | 1978-05-30 | International Business Machines Corporation | Double exposure and double etch technique for producing precision parts from crystallizable photosensitive glass |
| US4169008A (en) * | 1977-06-13 | 1979-09-25 | International Business Machines Corporation | Process for producing uniform nozzle orifices in silicon wafers |
| US6007324A (en) * | 1977-10-23 | 1999-12-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Double layer method for fabricating a rim type attenuating phase shifting mask |
| US4157935A (en) * | 1977-12-23 | 1979-06-12 | International Business Machines Corporation | Method for producing nozzle arrays for ink jet printers |
| JPS5623783A (en) * | 1979-08-01 | 1981-03-06 | Matsushita Electronics Corp | Formation of electrode for semiconductor device |
| JPS6037734A (ja) * | 1983-08-10 | 1985-02-27 | Mitsubishi Electric Corp | パタ−ン形成方法 |
| JPS6224628A (ja) * | 1985-07-24 | 1987-02-02 | Matsushita Electronics Corp | ホトレジストパタ−ンの形成方法 |
| JPS62141548A (ja) * | 1985-12-16 | 1987-06-25 | Mitsubishi Electric Corp | パタ−ン形成方法 |
| JPS62276552A (ja) * | 1986-05-26 | 1987-12-01 | Hitachi Micro Comput Eng Ltd | パタ−ン形成用マスク及びそれを用いた電子装置の製造方法 |
| JPH01293620A (ja) * | 1988-05-23 | 1989-11-27 | Nec Corp | 半導体装置の製造方法 |
| US4863560A (en) * | 1988-08-22 | 1989-09-05 | Xerox Corp | Fabrication of silicon structures by single side, multiple step etching process |
| JPH02213122A (ja) * | 1989-02-14 | 1990-08-24 | Rohm Co Ltd | レジストパターンの製造方法 |
| JPH03266437A (ja) * | 1990-03-16 | 1991-11-27 | Toshiba Corp | 半導体装置の製造方法 |
| KR930008139B1 (en) * | 1990-08-30 | 1993-08-26 | Samsung Electronics Co Ltd | Method for preparation of pattern |
| JPH04367216A (ja) * | 1991-06-14 | 1992-12-18 | Sharp Corp | レジストパターンの形成方法 |
| JPH0529754A (ja) * | 1991-07-25 | 1993-02-05 | Nec Corp | プリント配線板のソルダーレジストマスクの形成方法 |
| JPH05175658A (ja) * | 1991-12-20 | 1993-07-13 | Fujitsu Ltd | 薄膜多層配線基板の製造方法 |
| JP2932877B2 (ja) * | 1992-02-06 | 1999-08-09 | セイコーエプソン株式会社 | インクジェットヘッドの製造方法 |
| JP2797854B2 (ja) * | 1992-02-07 | 1998-09-17 | 住友金属工業株式会社 | 半導体装置のコンタクトホール形成方法 |
| JPH06286129A (ja) * | 1992-02-20 | 1994-10-11 | Seikosha Co Ltd | インクジェットヘッド |
| JP3104425B2 (ja) * | 1992-08-22 | 2000-10-30 | 日本電気株式会社 | 半導体装置の製造方法 |
| KR950008384B1 (ko) * | 1992-12-10 | 1995-07-28 | 삼성전자주식회사 | 패턴의 형성방법 |
| GB9301602D0 (en) * | 1993-01-27 | 1993-03-17 | Domino Printing Sciences Plc | Nozzle plate for ink jet printer |
| WO1994024610A1 (en) * | 1993-04-13 | 1994-10-27 | Astarix, Inc. | High resolution mask programmable via selected by low resolution photomasking |
| JPH07156409A (ja) * | 1993-10-04 | 1995-06-20 | Xerox Corp | 一体形成した流路構造を有するインクジェット・プリントヘッドおよびその作製方法 |
| JPH07329305A (ja) * | 1994-06-07 | 1995-12-19 | Canon Inc | 液体噴射記録ヘッドの製造方法 |
| US5560837A (en) * | 1994-11-08 | 1996-10-01 | Hewlett-Packard Company | Method of making ink-jet component |
| US5532090A (en) * | 1995-03-01 | 1996-07-02 | Intel Corporation | Method and apparatus for enhanced contact and via lithography |
| US6162589A (en) * | 1998-03-02 | 2000-12-19 | Hewlett-Packard Company | Direct imaging polymer fluid jet orifice |
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| US5753417A (en) * | 1996-06-10 | 1998-05-19 | Sharp Microelectronics Technology, Inc. | Multiple exposure masking system for forming multi-level resist profiles |
| WO1998051506A1 (en) * | 1997-05-14 | 1998-11-19 | Seiko Epson Corporation | Method of forming nozzle for injectors and method of manufacturing ink jet head |
| US5885749A (en) * | 1997-06-20 | 1999-03-23 | Clear Logic, Inc. | Method of customizing integrated circuits by selective secondary deposition of layer interconnect material |
| JP2000056469A (ja) * | 1998-08-06 | 2000-02-25 | Tdk Corp | レジストパターンの形成方法 |
| JP2000150502A (ja) * | 1998-11-16 | 2000-05-30 | Matsushita Electronics Industry Corp | 有機絶縁膜の形成方法 |
| US6521474B2 (en) * | 1998-11-27 | 2003-02-18 | Sanyo Electric Co., Ltd. | Manufacturing method for reflection type liquid crystal display |
| US6093507A (en) * | 1999-01-04 | 2000-07-25 | Taiwan Semiconductor Manufacturing Company | Simplified process for fabricating levinson and chromeless type phase shifting masks |
| US6303042B1 (en) * | 1999-03-02 | 2001-10-16 | Eastman Kodak Company | Making ink jet nozzle plates |
| JP2000255072A (ja) * | 1999-03-10 | 2000-09-19 | Canon Inc | インクジェット記録ヘッドの製造方法およびインクジェット記録ヘッド |
| US6310641B1 (en) * | 1999-06-11 | 2001-10-30 | Lexmark International, Inc. | Integrated nozzle plate for an inkjet print head formed using a photolithographic method |
| US6238850B1 (en) * | 1999-08-23 | 2001-05-29 | International Business Machines Corp. | Method of forming sharp corners in a photoresist layer |
| US6527370B1 (en) * | 1999-09-09 | 2003-03-04 | Hewlett-Packard Company | Counter-boring techniques for improved ink-jet printheads |
| US6290331B1 (en) * | 1999-09-09 | 2001-09-18 | Hewlett-Packard Company | High efficiency orifice plate structure and printhead using the same |
| IT1320026B1 (it) * | 2000-04-10 | 2003-11-12 | Olivetti Lexikon Spa | Testina di stampa monolitica a canali multipli di alimentazione delloinchiostro e relativo processo di fabbricazione. |
| US6528238B1 (en) * | 2000-09-22 | 2003-03-04 | David Seniuk | Methods for making patterns in radiation sensitive polymers |
| JP2002154210A (ja) * | 2000-11-20 | 2002-05-28 | Canon Inc | インクジェット記録ヘッドの製造方法、インクジェット記録ヘッド、およびインクジェット記録装置 |
| US6375313B1 (en) * | 2001-01-08 | 2002-04-23 | Hewlett-Packard Company | Orifice plate for inkjet printhead |
| US6589713B1 (en) * | 2001-01-29 | 2003-07-08 | Advanced Micro Devices, Inc. | Process for reducing the pitch of contact holes, vias, and trench structures in integrated circuits |
| US6520628B2 (en) * | 2001-01-30 | 2003-02-18 | Hewlett-Packard Company | Fluid ejection device with substrate having a fluid firing device and a fluid reservoir on a first surface thereof |
| FR2822969B1 (fr) * | 2001-04-03 | 2003-08-22 | St Microelectronics Sa | Procede d'illumination d'une couche d'une matiere, en particulier d'une resine photosensible |
| JP4743571B2 (ja) * | 2001-06-21 | 2011-08-10 | 大日本印刷株式会社 | カラーフィルタの作製方法およびカラーフィルタ |
| JP2003068610A (ja) * | 2001-08-24 | 2003-03-07 | Matsushita Electric Ind Co Ltd | 感光性樹脂のパターニング方法 |
| GB2379284A (en) * | 2001-09-01 | 2003-03-05 | Zarlink Semiconductor Ltd | Multiple level photolithography |
| JP2003195513A (ja) * | 2001-09-07 | 2003-07-09 | Canon Inc | 部材パターンの製造方法と、電子源及び画像表示装置の製造方法 |
| US6777168B2 (en) * | 2001-12-14 | 2004-08-17 | Mosel Vitelic, Inc. | Multiple photolithographic exposures with different clear patterns |
| US6881524B2 (en) * | 2002-11-27 | 2005-04-19 | Promos Technologies, Inc. | Photolithography method including a double exposure/double bake |
| JP2005142254A (ja) * | 2003-11-05 | 2005-06-02 | Toppan Printing Co Ltd | 配線基板及びその製造方法 |
-
2003
- 2003-12-12 US US10/734,328 patent/US20050130075A1/en not_active Abandoned
-
2004
- 2004-06-23 TW TW093118071A patent/TWI332442B/zh not_active IP Right Cessation
- 2004-11-29 WO PCT/US2004/040004 patent/WO2005062129A1/en not_active Ceased
- 2004-11-29 DE DE602004025041T patent/DE602004025041D1/de not_active Expired - Lifetime
- 2004-11-29 CN CNB2004800369345A patent/CN100458569C/zh not_active Expired - Fee Related
- 2004-11-29 EP EP04812505A patent/EP1700166B1/de not_active Expired - Lifetime
- 2004-11-29 JP JP2006543868A patent/JP4498363B2/ja not_active Expired - Fee Related
- 2004-11-29 AT AT04812505T patent/ATE454649T1/de not_active IP Right Cessation
- 2004-11-29 KR KR1020067011461A patent/KR101160710B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1700166A1 (de) | 2006-09-13 |
| KR20060123303A (ko) | 2006-12-01 |
| TW200518943A (en) | 2005-06-16 |
| KR101160710B1 (ko) | 2012-06-28 |
| US20050130075A1 (en) | 2005-06-16 |
| TWI332442B (en) | 2010-11-01 |
| EP1700166B1 (de) | 2010-01-06 |
| WO2005062129A1 (en) | 2005-07-07 |
| JP2007514201A (ja) | 2007-05-31 |
| JP4498363B2 (ja) | 2010-07-07 |
| CN100458569C (zh) | 2009-02-04 |
| CN1890610A (zh) | 2007-01-03 |
| DE602004025041D1 (de) | 2010-02-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |