ATE467698T1 - Verfahren und vorrichtung zur chemischen plasmaverarbeitung von kunststoffbehältern - Google Patents

Verfahren und vorrichtung zur chemischen plasmaverarbeitung von kunststoffbehältern

Info

Publication number
ATE467698T1
ATE467698T1 AT04717827T AT04717827T ATE467698T1 AT E467698 T1 ATE467698 T1 AT E467698T1 AT 04717827 T AT04717827 T AT 04717827T AT 04717827 T AT04717827 T AT 04717827T AT E467698 T1 ATE467698 T1 AT E467698T1
Authority
AT
Austria
Prior art keywords
plastic containers
plasma processing
chemical plasma
plasma
cvd
Prior art date
Application number
AT04717827T
Other languages
English (en)
Inventor
Akira Kobayashi
Koji Yamada
Takeshi Aihara
Hideo Kurashima
Original Assignee
Toyo Seikan Kaisha Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Seikan Kaisha Ltd filed Critical Toyo Seikan Kaisha Ltd
Application granted granted Critical
Publication of ATE467698T1 publication Critical patent/ATE467698T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192Microwave generated discharge
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • C23C16/045Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C23C16/463Cooling of the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Containers Having Bodies Formed In One Piece (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AT04717827T 2003-03-12 2004-03-05 Verfahren und vorrichtung zur chemischen plasmaverarbeitung von kunststoffbehältern ATE467698T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003066912 2003-03-12
PCT/JP2004/002836 WO2004081253A1 (ja) 2003-03-12 2004-03-05 プラスチック容器の化学プラズマ処理方法及び装置

Publications (1)

Publication Number Publication Date
ATE467698T1 true ATE467698T1 (de) 2010-05-15

Family

ID=32984546

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04717827T ATE467698T1 (de) 2003-03-12 2004-03-05 Verfahren und vorrichtung zur chemischen plasmaverarbeitung von kunststoffbehältern

Country Status (8)

Country Link
US (1) US20060172085A1 (de)
EP (1) EP1619266B1 (de)
JP (1) JP4548337B2 (de)
KR (1) KR101092119B1 (de)
CN (1) CN100557079C (de)
AT (1) ATE467698T1 (de)
DE (1) DE602004027130D1 (de)
WO (1) WO2004081253A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2903622B1 (fr) * 2006-07-17 2008-10-03 Sidel Participations Dispositif pour le depot d'un revetement sur une face interne d'un recipient
JP5136551B2 (ja) 2007-06-06 2013-02-06 東洋製罐株式会社 生分解性樹脂ボトル及びその製造方法
JP5312860B2 (ja) * 2007-07-09 2013-10-09 日本リビング株式会社 Dlc製膜方法及び製膜装置
JP5286478B2 (ja) * 2008-06-30 2013-09-11 東洋製罐株式会社 ポリエステル容器及びその製造方法
DE102016114292A1 (de) 2016-08-02 2018-02-08 Khs Corpoplast Gmbh Verfahren zum Beschichten von Kunststoffbehältern
US10464109B2 (en) * 2016-11-30 2019-11-05 Nolan Smith Bottle cap thread rinsing system
DE102017108992A1 (de) * 2017-04-26 2018-10-31 Khs Corpoplast Gmbh Vorrichtung zur Innenbeschichtung von Behältern
DE102023107505A1 (de) * 2023-03-24 2024-09-26 Khs Gmbh Behälterbeschichtungsanlage, insbesondere zum Beschichten von Getränkebehältern

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053246A (en) * 1990-03-30 1991-10-01 The Goodyear Tire & Rubber Company Process for the surface treatment of polymers for reinforcement-to-rubber adhesion
JPH06184628A (ja) * 1992-12-16 1994-07-05 Hitachi Ltd 真空熱処理方法
JPH06313671A (ja) * 1993-04-30 1994-11-08 Mitsubishi Kasei Eng Co 回転円筒型処理装置
US5565248A (en) * 1994-02-09 1996-10-15 The Coca-Cola Company Method and apparatus for coating hollow containers through plasma-assisted deposition of an inorganic substance
AU2648297A (en) * 1996-05-22 1997-12-09 Tetra Laval Holdings & Finance Sa Method and apparatus for treating inside surfaces of containers
DE19722205A1 (de) * 1997-05-27 1998-12-03 Leybold Systems Gmbh Verfahren und Vorrichtung zur Beschichtung von Kunststoff- oder Glasbehältern mittels eines PCVD-Beschichtungsverfahrens
RU2199792C2 (ru) * 1997-09-30 2003-02-27 Тетра Лаваль Холдинг Энд Финанс С.А. Способ и устройство для плазменной обработки внутренней поверхности пластиковых бутылок
JP2001518565A (ja) * 1997-09-30 2001-10-16 テトラ ラヴァル ホールディングズ アンド ファイナンス エス.アー. プラズマ強化プロセスにおける小口径開口部付きプラスチック製容器の内面処理装置および方法
SE9901100D0 (sv) * 1999-03-24 1999-03-24 Amersham Pharm Biotech Ab Surface and tis manufacture and uses
JP2002017071A (ja) * 2000-06-29 2002-01-18 Ishikawajima Harima Heavy Ind Co Ltd 高速回転電動機とその冷却方法
JP2002051586A (ja) * 2000-07-31 2002-02-15 Mitsubishi Materials Corp 穿孔装置および穿孔工法
JP2002071071A (ja) * 2000-08-31 2002-03-08 Suncall Corp 自動車の排気管接続構造及び該構造に使用するコイルバネ
JP4595276B2 (ja) * 2000-12-25 2010-12-08 東洋製罐株式会社 マイクロ波プラズマ処理方法及び装置
US20020182101A1 (en) * 2001-03-27 2002-12-05 Pavel Koulik Process and device for plasma surface treatment
TW570876B (en) * 2001-05-11 2004-01-11 Toyo Seikan Kaisha Ltd Silicon oxide film
KR101162377B1 (ko) * 2003-03-28 2012-07-09 도요 세이칸 가부시키가이샤 플라즈마 cvd법에 의한 화학 증착막 및 그 형성 방법

Also Published As

Publication number Publication date
CN100557079C (zh) 2009-11-04
JP4548337B2 (ja) 2010-09-22
EP1619266A1 (de) 2006-01-25
KR20050114230A (ko) 2005-12-05
WO2004081253A1 (ja) 2004-09-23
US20060172085A1 (en) 2006-08-03
KR101092119B1 (ko) 2011-12-12
CN1788105A (zh) 2006-06-14
DE602004027130D1 (de) 2010-06-24
EP1619266B1 (de) 2010-05-12
EP1619266A4 (de) 2008-07-23
JPWO2004081253A1 (ja) 2006-06-15

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