|
CN100338786C
(zh)
*
|
2002-06-19 |
2007-09-19 |
三垦电气株式会社 |
半导体发光装置及其制法和半导体发光装置用反射器
|
|
US7244965B2
(en)
*
|
2002-09-04 |
2007-07-17 |
Cree Inc, |
Power surface mount light emitting die package
|
|
US7775685B2
(en)
*
|
2003-05-27 |
2010-08-17 |
Cree, Inc. |
Power surface mount light emitting die package
|
|
US7692206B2
(en)
|
2002-12-06 |
2010-04-06 |
Cree, Inc. |
Composite leadframe LED package and method of making the same
|
|
JP4274935B2
(ja)
*
|
2003-12-26 |
2009-06-10 |
トキコーポレーション株式会社 |
発光ユニット用ケースおよび発光ユニット製造方法
|
|
TWM258416U
(en)
*
|
2004-06-04 |
2005-03-01 |
Lite On Technology Corp |
Power LED package module
|
|
US7456499B2
(en)
|
2004-06-04 |
2008-11-25 |
Cree, Inc. |
Power light emitting die package with reflecting lens and the method of making the same
|
|
US7280288B2
(en)
|
2004-06-04 |
2007-10-09 |
Cree, Inc. |
Composite optical lens with an integrated reflector
|
|
DE102004045947A1
(de)
*
|
2004-06-30 |
2006-01-19 |
Osram Opto Semiconductors Gmbh |
Leuchtdiodenanordnung
|
|
KR20060018453A
(ko)
*
|
2004-08-24 |
2006-03-02 |
삼성전자주식회사 |
히트 싱크를 갖는 반도체 소자
|
|
JP5192811B2
(ja)
*
|
2004-09-10 |
2013-05-08 |
ソウル セミコンダクター カンパニー リミテッド |
多重モールド樹脂を有する発光ダイオードパッケージ
|
|
CN100347869C
(zh)
*
|
2004-09-14 |
2007-11-07 |
宏齐科技股份有限公司 |
发光芯片的封装结构
|
|
TWI405349B
(zh)
*
|
2004-10-07 |
2013-08-11 |
首爾半導體股份有限公司 |
側照明透鏡以及使用此透鏡的發光元件
|
|
US20060087866A1
(en)
*
|
2004-10-22 |
2006-04-27 |
Ng Kee Y |
LED backlight
|
|
WO2006065007A1
(en)
*
|
2004-12-16 |
2006-06-22 |
Seoul Semiconductor Co., Ltd. |
Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
|
|
US7821023B2
(en)
|
2005-01-10 |
2010-10-26 |
Cree, Inc. |
Solid state lighting component
|
|
US9793247B2
(en)
|
2005-01-10 |
2017-10-17 |
Cree, Inc. |
Solid state lighting component
|
|
US9070850B2
(en)
|
2007-10-31 |
2015-06-30 |
Cree, Inc. |
Light emitting diode package and method for fabricating same
|
|
US7777247B2
(en)
*
|
2005-01-14 |
2010-08-17 |
Cree, Inc. |
Semiconductor light emitting device mounting substrates including a conductive lead extending therein
|
|
US7939842B2
(en)
*
|
2005-01-27 |
2011-05-10 |
Cree, Inc. |
Light emitting device packages, light emitting diode (LED) packages and related methods
|
|
JP5059739B2
(ja)
*
|
2005-03-11 |
2012-10-31 |
ソウル セミコンダクター カンパニー リミテッド |
直列接続された発光セルのアレイを有する発光ダイオードパッケージ
|
|
KR100609784B1
(ko)
*
|
2005-05-20 |
2006-08-09 |
럭스피아 주식회사 |
일체형 방열판을 가지는 발광다이오드 패키지 및 멀티패키지 모듈
|
|
US8669572B2
(en)
|
2005-06-10 |
2014-03-11 |
Cree, Inc. |
Power lamp package
|
|
US7980743B2
(en)
|
2005-06-14 |
2011-07-19 |
Cree, Inc. |
LED backlighting for displays
|
|
US20060292747A1
(en)
*
|
2005-06-27 |
2006-12-28 |
Loh Ban P |
Top-surface-mount power light emitter with integral heat sink
|
|
KR100629496B1
(ko)
*
|
2005-08-08 |
2006-09-28 |
삼성전자주식회사 |
Led 패키지 및 그 제조방법
|
|
US20070126020A1
(en)
*
|
2005-12-03 |
2007-06-07 |
Cheng Lin |
High-power LED chip packaging structure and fabrication method thereof
|
|
USD549186S1
(en)
*
|
2005-12-05 |
2007-08-21 |
Moritex Corporation |
Condenser lens for a light emitting diode
|
|
USD573113S1
(en)
*
|
2005-12-09 |
2008-07-15 |
Nichia Corporation |
Light emitting diode
|
|
KR100765714B1
(ko)
*
|
2005-12-15 |
2007-10-11 |
엘지전자 주식회사 |
리드프레임, 그를 이용한 발광 소자 패키지 및 그의 제조방법
|
|
TWD127499S1
(zh)
*
|
2005-12-21 |
2009-02-21 |
伊諾特有限公司 |
發光二極體之封裝殼
|
|
WO2007081719A2
(en)
|
2006-01-05 |
2007-07-19 |
Illumitex, Inc. |
Separate optical device for directing light from an led
|
|
KR101283182B1
(ko)
|
2006-01-26 |
2013-07-05 |
엘지이노텍 주식회사 |
발광 다이오드 패키지 및 그 제조 방법
|
|
USD567773S1
(en)
*
|
2006-01-31 |
2008-04-29 |
Nichia Corporation |
Light emitting diode
|
|
US20070181897A1
(en)
*
|
2006-02-03 |
2007-08-09 |
Been-Yu Liaw |
High heat dissipating package baseplate for a high brightness LED
|
|
CN100556242C
(zh)
*
|
2006-02-17 |
2009-10-28 |
莱美光电股份有限公司 |
分离式发光二极管电路板的制造方法
|
|
USD572670S1
(en)
*
|
2006-03-30 |
2008-07-08 |
Nichia Corporation |
Light emitting diode
|
|
KR100729439B1
(ko)
*
|
2006-03-23 |
2007-06-15 |
(주)싸이럭스 |
발광소자 패키지 구조체와 그 제조방법 및 이를 적용한발광소자의 제조방법
|
|
US7675145B2
(en)
|
2006-03-28 |
2010-03-09 |
Cree Hong Kong Limited |
Apparatus, system and method for use in mounting electronic elements
|
|
USD555113S1
(en)
*
|
2006-04-12 |
2007-11-13 |
Semi-Photonics Co., Ltd. |
Opto-electronic device
|
|
USD555114S1
(en)
*
|
2006-04-12 |
2007-11-13 |
Semi-Photonics Co., Ltd. |
Light emitting diode
|
|
US11210971B2
(en)
|
2009-07-06 |
2021-12-28 |
Cree Huizhou Solid State Lighting Company Limited |
Light emitting diode display with tilted peak emission pattern
|
|
US8748915B2
(en)
|
2006-04-24 |
2014-06-10 |
Cree Hong Kong Limited |
Emitter package with angled or vertical LED
|
|
US7635915B2
(en)
|
2006-04-26 |
2009-12-22 |
Cree Hong Kong Limited |
Apparatus and method for use in mounting electronic elements
|
|
US7655957B2
(en)
*
|
2006-04-27 |
2010-02-02 |
Cree, Inc. |
Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
|
|
JP4830768B2
(ja)
*
|
2006-05-10 |
2011-12-07 |
日亜化学工業株式会社 |
半導体発光装置及び半導体発光装置の製造方法
|
|
EP2027602A4
(de)
*
|
2006-05-23 |
2012-11-28 |
Cree Inc |
Beleuchtungseinrichtung und herstellungsverfahren
|
|
KR100904152B1
(ko)
*
|
2006-06-30 |
2009-06-25 |
서울반도체 주식회사 |
히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광다이오드 패키지 제조방법 및 그것에 의해 제조된 발광다이오드 패키지
|
|
US8044418B2
(en)
*
|
2006-07-13 |
2011-10-25 |
Cree, Inc. |
Leadframe-based packages for solid state light emitting devices
|
|
US7960819B2
(en)
*
|
2006-07-13 |
2011-06-14 |
Cree, Inc. |
Leadframe-based packages for solid state emitting devices
|
|
US8735920B2
(en)
|
2006-07-31 |
2014-05-27 |
Cree, Inc. |
Light emitting diode package with optical element
|
|
US8367945B2
(en)
*
|
2006-08-16 |
2013-02-05 |
Cree Huizhou Opto Limited |
Apparatus, system and method for use in mounting electronic elements
|
|
CN101145592B
(zh)
*
|
2006-09-13 |
2010-09-29 |
佰鸿工业股份有限公司 |
高散热性发光二极管装置
|
|
USD577689S1
(en)
*
|
2006-09-15 |
2008-09-30 |
Nichia Corporation |
Light emitting diode
|
|
KR101241528B1
(ko)
|
2006-09-25 |
2013-03-08 |
엘지이노텍 주식회사 |
발광 장치
|
|
JP2010506402A
(ja)
|
2006-10-02 |
2010-02-25 |
イルミテックス, インコーポレイテッド |
Ledのシステムおよび方法
|
|
US20080089072A1
(en)
*
|
2006-10-11 |
2008-04-17 |
Alti-Electronics Co., Ltd. |
High Power Light Emitting Diode Package
|
|
USD594827S1
(en)
*
|
2006-12-07 |
2009-06-23 |
Cree, Inc. |
Lamp package
|
|
KR100851183B1
(ko)
*
|
2006-12-27 |
2008-08-08 |
엘지이노텍 주식회사 |
반도체 발광소자 패키지
|
|
US9711703B2
(en)
|
2007-02-12 |
2017-07-18 |
Cree Huizhou Opto Limited |
Apparatus, system and method for use in mounting electronic elements
|
|
US7922360B2
(en)
*
|
2007-02-14 |
2011-04-12 |
Cree, Inc. |
Thermal transfer in solid state light emitting apparatus and methods of manufacturing
|
|
US7964888B2
(en)
|
2007-04-18 |
2011-06-21 |
Cree, Inc. |
Semiconductor light emitting device packages and methods
|
|
KR101380385B1
(ko)
*
|
2007-06-29 |
2014-04-10 |
서울반도체 주식회사 |
일괄 봉지 기술을 이용하는 led 패키지 제조방법
|
|
CN101388161A
(zh)
*
|
2007-09-14 |
2009-03-18 |
科锐香港有限公司 |
Led表面安装装置和并入有此装置的led显示器
|
|
US8866169B2
(en)
|
2007-10-31 |
2014-10-21 |
Cree, Inc. |
LED package with increased feature sizes
|
|
US10256385B2
(en)
|
2007-10-31 |
2019-04-09 |
Cree, Inc. |
Light emitting die (LED) packages and related methods
|
|
USD615504S1
(en)
*
|
2007-10-31 |
2010-05-11 |
Cree, Inc. |
Emitter package
|
|
KR200447448Y1
(ko)
*
|
2007-11-29 |
2010-01-25 |
(주)솔라루체 |
Led 소자용 리드프레임 패키지 및 이를 이용한 led패키지
|
|
USD633631S1
(en)
|
2007-12-14 |
2011-03-01 |
Cree Hong Kong Limited |
Light source of light emitting diode
|
|
DE102008013898A1
(de)
*
|
2007-12-14 |
2009-06-25 |
Osram Opto Semiconductors Gmbh |
Optoelektronisches Bauelement, Anordnung und Verfahren zur Herstellung eines optoelektronischen Bauelements
|
|
USD634863S1
(en)
|
2008-01-10 |
2011-03-22 |
Cree Hong Kong Limited |
Light source of light emitting diode
|
|
CN101939849A
(zh)
|
2008-02-08 |
2011-01-05 |
伊鲁米特克有限公司 |
用于发射器层成形的系统和方法
|
|
DE102008011862A1
(de)
*
|
2008-02-29 |
2009-09-03 |
Osram Opto Semiconductors Gmbh |
Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung
|
|
TWI360239B
(en)
*
|
2008-03-19 |
2012-03-11 |
E Pin Optical Industry Co Ltd |
Package structure for light emitting diode
|
|
DE102008021435A1
(de)
|
2008-04-29 |
2009-11-19 |
Schott Ag |
Gehäuse für LEDs mit hoher Leistung
|
|
KR100997198B1
(ko)
*
|
2008-05-06 |
2010-11-29 |
김민공 |
프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제하우징을 이용한 발광다이오드 금속제 패키지
|
|
KR100951779B1
(ko)
|
2008-05-09 |
2010-04-08 |
주식회사 디에스엘시디 |
발광다이오드 패키지 및 그 제조방법
|
|
US8049230B2
(en)
|
2008-05-16 |
2011-11-01 |
Cree Huizhou Opto Limited |
Apparatus and system for miniature surface mount devices
|
|
US9129832B2
(en)
*
|
2008-08-26 |
2015-09-08 |
Dingguo Pan |
LED multi-chip bonding die and light strip using the same
|
|
JP5217800B2
(ja)
|
2008-09-03 |
2013-06-19 |
日亜化学工業株式会社 |
発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
|
|
DE102008045925A1
(de)
*
|
2008-09-04 |
2010-03-11 |
Osram Opto Semiconductors Gmbh |
Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
|
|
US9425172B2
(en)
|
2008-10-24 |
2016-08-23 |
Cree, Inc. |
Light emitter array
|
|
US8791471B2
(en)
|
2008-11-07 |
2014-07-29 |
Cree Hong Kong Limited |
Multi-chip light emitting diode modules
|
|
KR100888236B1
(ko)
*
|
2008-11-18 |
2009-03-12 |
서울반도체 주식회사 |
발광 장치
|
|
TW201034256A
(en)
|
2008-12-11 |
2010-09-16 |
Illumitex Inc |
Systems and methods for packaging light-emitting diode devices
|
|
USD648686S1
(en)
|
2010-04-30 |
2011-11-15 |
Cree, Inc. |
Light emitting diode (LED) package
|
|
USD621799S1
(en)
|
2009-01-12 |
2010-08-17 |
Cree, Inc. |
Light emitting diode
|
|
US7923739B2
(en)
|
2009-06-05 |
2011-04-12 |
Cree, Inc. |
Solid state lighting device
|
|
US8598602B2
(en)
*
|
2009-01-12 |
2013-12-03 |
Cree, Inc. |
Light emitting device packages with improved heat transfer
|
|
USD641719S1
(en)
*
|
2009-06-05 |
2011-07-19 |
Cree, Inc. |
Light emitting diode
|
|
US20110037083A1
(en)
*
|
2009-01-14 |
2011-02-17 |
Alex Chi Keung Chan |
Led package with contrasting face
|
|
US8368112B2
(en)
|
2009-01-14 |
2013-02-05 |
Cree Huizhou Opto Limited |
Aligned multiple emitter package
|
|
JP2010182486A
(ja)
*
|
2009-02-04 |
2010-08-19 |
Koito Mfg Co Ltd |
車両用灯具
|
|
US8351794B2
(en)
*
|
2009-03-10 |
2013-01-08 |
Avago Technologies Fiber Ip (Singapore) Pte. Ltd. |
Parallel optical transceiver module having a heat dissipation system that dissipates heat and protects components of the module from particulates and handling
|
|
US20100252853A1
(en)
*
|
2009-03-19 |
2010-10-07 |
Christy Alexander C |
Thermal Energy Dissipating Arrangement for a Light Emitting Diode
|
|
US20100270580A1
(en)
*
|
2009-04-22 |
2010-10-28 |
Jason Loomis Posselt |
Substrate based light source package with electrical leads
|
|
US8957435B2
(en)
*
|
2009-04-28 |
2015-02-17 |
Cree, Inc. |
Lighting device
|
|
USD615051S1
(en)
*
|
2009-05-05 |
2010-05-04 |
Prolight Opto Technology Corporation |
LED package
|
|
US8686445B1
(en)
|
2009-06-05 |
2014-04-01 |
Cree, Inc. |
Solid state lighting devices and methods
|
|
USD648687S1
(en)
|
2009-06-05 |
2011-11-15 |
Cree, Inc. |
Light emitting device package
|
|
US8860043B2
(en)
*
|
2009-06-05 |
2014-10-14 |
Cree, Inc. |
Light emitting device packages, systems and methods
|
|
US9111778B2
(en)
|
2009-06-05 |
2015-08-18 |
Cree, Inc. |
Light emitting diode (LED) devices, systems, and methods
|
|
US7875970B2
(en)
*
|
2009-06-10 |
2011-01-25 |
Green Arrow Asia Limited |
Integrated circuit package having a castellated heatspreader
|
|
CN101936500A
(zh)
*
|
2009-06-30 |
2011-01-05 |
富准精密工业(深圳)有限公司 |
发光二极管模组
|
|
US8415692B2
(en)
|
2009-07-06 |
2013-04-09 |
Cree, Inc. |
LED packages with scattering particle regions
|
|
US8598809B2
(en)
|
2009-08-19 |
2013-12-03 |
Cree, Inc. |
White light color changing solid state lighting and methods
|
|
US8585253B2
(en)
|
2009-08-20 |
2013-11-19 |
Illumitex, Inc. |
System and method for color mixing lens array
|
|
US8449128B2
(en)
|
2009-08-20 |
2013-05-28 |
Illumitex, Inc. |
System and method for a lens and phosphor layer
|
|
USD613701S1
(en)
*
|
2009-08-25 |
2010-04-13 |
Prolight Opto Technology Corporation |
Light emitting diode module
|
|
US8679865B2
(en)
*
|
2009-08-28 |
2014-03-25 |
Samsung Electronics Co., Ltd. |
Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package
|
|
US8410371B2
(en)
|
2009-09-08 |
2013-04-02 |
Cree, Inc. |
Electronic device submounts with thermally conductive vias and light emitting devices including the same
|
|
WO2011029154A1
(en)
*
|
2009-09-10 |
2011-03-17 |
Hamish Mclennan |
Improved light emitting diode (led) assembly and method of manufacturing the same
|
|
CN102024882A
(zh)
*
|
2009-09-14 |
2011-04-20 |
展晶科技(深圳)有限公司 |
发光二极管装置及其制造方法
|
|
US8120056B2
(en)
*
|
2009-10-19 |
2012-02-21 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Light emitting diode assembly
|
|
US7893445B2
(en)
*
|
2009-11-09 |
2011-02-22 |
Cree, Inc. |
Solid state emitter package including red and blue emitters
|
|
WO2011060319A1
(en)
*
|
2009-11-13 |
2011-05-19 |
Uni-Light Llc |
Led thermal management
|
|
CN102751426B
(zh)
*
|
2010-01-20 |
2015-08-12 |
光宝电子(广州)有限公司 |
封装结构及发光二极管封装结构
|
|
US8350370B2
(en)
|
2010-01-29 |
2013-01-08 |
Cree Huizhou Opto Limited |
Wide angle oval light emitting diode package
|
|
US9024350B2
(en)
*
|
2010-02-08 |
2015-05-05 |
Ban P Loh |
LED light module
|
|
USD643381S1
(en)
*
|
2010-04-07 |
2011-08-16 |
Everlight Electronics Co., Ltd. |
Light emitting diode
|
|
USD640643S1
(en)
*
|
2010-04-07 |
2011-06-28 |
Everlight Electronics Co., Ltd. |
Light emitting diode
|
|
USD651989S1
(en)
*
|
2010-04-09 |
2012-01-10 |
Everlight Electronics Co., Ltd. |
Light emitting diode
|
|
US9012938B2
(en)
|
2010-04-09 |
2015-04-21 |
Cree, Inc. |
High reflective substrate of light emitting devices with improved light output
|
|
US9240526B2
(en)
|
2010-04-23 |
2016-01-19 |
Cree, Inc. |
Solid state light emitting diode packages with leadframes and ceramic material
|
|
US8648359B2
(en)
|
2010-06-28 |
2014-02-11 |
Cree, Inc. |
Light emitting devices and methods
|
|
US8269244B2
(en)
|
2010-06-28 |
2012-09-18 |
Cree, Inc. |
LED package with efficient, isolated thermal path
|
|
USD643819S1
(en)
|
2010-07-16 |
2011-08-23 |
Cree, Inc. |
Package for light emitting diode (LED) lighting
|
|
TWD141204S1
(zh)
|
2010-07-23 |
2011-06-21 |
億光電子工業股份有限公司 |
發光二極體
|
|
US8455882B2
(en)
|
2010-10-15 |
2013-06-04 |
Cree, Inc. |
High efficiency LEDs
|
|
US11101408B2
(en)
|
2011-02-07 |
2021-08-24 |
Creeled, Inc. |
Components and methods for light emitting diode (LED) lighting
|
|
USD679842S1
(en)
|
2011-01-03 |
2013-04-09 |
Cree, Inc. |
High brightness LED package
|
|
US8610140B2
(en)
|
2010-12-15 |
2013-12-17 |
Cree, Inc. |
Light emitting diode (LED) packages, systems, devices and related methods
|
|
US8772817B2
(en)
|
2010-12-22 |
2014-07-08 |
Cree, Inc. |
Electronic device submounts including substrates with thermally conductive vias
|
|
TW201251140A
(en)
*
|
2011-01-31 |
2012-12-16 |
Cree Inc |
High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
|
|
WO2013010389A1
(zh)
|
2011-07-15 |
2013-01-24 |
中国科学院半导体研究所 |
发光二极管封装结构及其制造方法
|
|
WO2013036481A2
(en)
|
2011-09-06 |
2013-03-14 |
Cree, Inc. |
Light emitter packages and devices having improved wire bonding and related methods
|
|
DE102011113653B4
(de)
*
|
2011-09-19 |
2016-02-18 |
Rüdiger Lanz |
LED-Hochleistungsspot
|
|
US8692282B2
(en)
*
|
2011-10-27 |
2014-04-08 |
Seoul Semiconductor Co., Ltd. |
Light emitting diode package and light emitting module comprising the same
|
|
US8823041B2
(en)
|
2011-10-27 |
2014-09-02 |
Seoul Semiconductor Co., Ltd. |
Light emitting diode package and light emitting module comprising the same
|
|
CN102569604B
(zh)
*
|
2011-10-27 |
2013-11-06 |
深圳市灏天光电有限公司 |
一种隐脚式大功率led支架及封装结构与封装工艺
|
|
US20130120986A1
(en)
|
2011-11-12 |
2013-05-16 |
Raydex Technology, Inc. |
High efficiency directional light source with concentrated light output
|
|
US8564004B2
(en)
|
2011-11-29 |
2013-10-22 |
Cree, Inc. |
Complex primary optics with intermediate elements
|
|
US9510425B1
(en)
|
2012-02-22 |
2016-11-29 |
Theodore G. Nelson |
Driving circuit for light emitting diode apparatus and method of operation
|
|
USD711840S1
(en)
|
2012-06-11 |
2014-08-26 |
Cree, Inc. |
LED package
|
|
USD725613S1
(en)
|
2012-06-15 |
2015-03-31 |
Cree, Inc. |
LED package
|
|
USD718258S1
(en)
|
2012-09-02 |
2014-11-25 |
Cree, Inc. |
LED package
|
|
KR101281532B1
(ko)
*
|
2013-01-11 |
2013-07-03 |
(주)뉴티스 |
파워 엘이디 패키지용 히트싱크 일체형 리드 프레임의 제조방법
|
|
DE202013101190U1
(de)
|
2013-03-20 |
2014-06-24 |
Zumtobel Lighting Gmbh |
Anordnung zur Lichtabgabe mit einer LED, einer Platine und einem optischen Element
|
|
USD735683S1
(en)
|
2013-05-03 |
2015-08-04 |
Cree, Inc. |
LED package
|
|
TWI559053B
(zh)
*
|
2013-05-28 |
2016-11-21 |
潘宇翔 |
適用於直下式背光模組之光源裝置及其顯示器
|
|
US9105825B2
(en)
|
2013-06-03 |
2015-08-11 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
Light source package and method of manufacturing the same
|
|
US9461024B2
(en)
|
2013-08-01 |
2016-10-04 |
Cree, Inc. |
Light emitter devices and methods for light emitting diode (LED) chips
|
|
USD718725S1
(en)
|
2013-08-01 |
2014-12-02 |
Cree, Inc. |
LED package with encapsulant
|
|
USD758976S1
(en)
|
2013-08-08 |
2016-06-14 |
Cree, Inc. |
LED package
|
|
US9601670B2
(en)
|
2014-07-11 |
2017-03-21 |
Cree, Inc. |
Method to form primary optic with variable shapes and/or geometries without a substrate
|
|
US10622522B2
(en)
|
2014-09-05 |
2020-04-14 |
Theodore Lowes |
LED packages with chips having insulated surfaces
|
|
USD790486S1
(en)
|
2014-09-30 |
2017-06-27 |
Cree, Inc. |
LED package with truncated encapsulant
|
|
USD777122S1
(en)
|
2015-02-27 |
2017-01-24 |
Cree, Inc. |
LED package
|
|
US11431146B2
(en)
*
|
2015-03-27 |
2022-08-30 |
Jabil Inc. |
Chip on submount module
|
|
USD912303S1
(en)
*
|
2015-04-07 |
2021-03-02 |
Flos S.P.A. |
Table lamp
|
|
USD783547S1
(en)
|
2015-06-04 |
2017-04-11 |
Cree, Inc. |
LED package
|
|
WO2018087027A1
(en)
*
|
2016-11-11 |
2018-05-17 |
Lumileds Holding B.V. |
Method of manufacturing a lead frame
|
|
KR102335216B1
(ko)
|
2017-04-26 |
2021-12-03 |
삼성전자 주식회사 |
발광소자 패키지
|
|
US11677059B2
(en)
|
2017-04-26 |
2023-06-13 |
Samsung Electronics Co., Ltd. |
Light-emitting device package including a lead frame
|
|
WO2019151826A1
(ko)
*
|
2018-02-05 |
2019-08-08 |
엘지이노텍 주식회사 |
반도체 소자 패키지 및 이를 포함하는 발광장치
|
|
WO2020027721A1
(en)
*
|
2018-07-31 |
2020-02-06 |
Ams Sensors Asia Pte. Ltd. |
Package including portions of a lead frame as electrically conductive leads
|
|
JP7248699B2
(ja)
*
|
2018-09-27 |
2023-03-29 |
京セラ株式会社 |
配線基板および電気装置
|