ATE517957T1 - Verfahren zur herstellung eines silikonschichtverbunds - Google Patents

Verfahren zur herstellung eines silikonschichtverbunds

Info

Publication number
ATE517957T1
ATE517957T1 AT04799889T AT04799889T ATE517957T1 AT E517957 T1 ATE517957 T1 AT E517957T1 AT 04799889 T AT04799889 T AT 04799889T AT 04799889 T AT04799889 T AT 04799889T AT E517957 T1 ATE517957 T1 AT E517957T1
Authority
AT
Austria
Prior art keywords
silicone layer
producing
layer composite
addition
organopolysiloxane composition
Prior art date
Application number
AT04799889T
Other languages
English (en)
Inventor
Yoshitsugu Morita
Tomoko Kato
Hiroji Enami
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE517957T1 publication Critical patent/ATE517957T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
AT04799889T 2003-11-28 2004-11-24 Verfahren zur herstellung eines silikonschichtverbunds ATE517957T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003400426A JP4503271B2 (ja) 2003-11-28 2003-11-28 シリコーン積層体の製造方法
PCT/JP2004/017829 WO2005052078A1 (en) 2003-11-28 2004-11-24 A method of manufacturing a layered silicone composite material

Publications (1)

Publication Number Publication Date
ATE517957T1 true ATE517957T1 (de) 2011-08-15

Family

ID=34631645

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04799889T ATE517957T1 (de) 2003-11-28 2004-11-24 Verfahren zur herstellung eines silikonschichtverbunds

Country Status (7)

Country Link
US (2) US7919150B2 (de)
EP (1) EP1697473B1 (de)
JP (1) JP4503271B2 (de)
KR (1) KR101109503B1 (de)
CN (1) CN1886476A (de)
AT (1) ATE517957T1 (de)
WO (1) WO2005052078A1 (de)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4503271B2 (ja) * 2003-11-28 2010-07-14 東レ・ダウコーニング株式会社 シリコーン積層体の製造方法
US7438952B2 (en) * 2004-06-30 2008-10-21 Ppg Industries Ohio, Inc. Methods and systems for coating articles having a plastic substrate
US7192795B2 (en) * 2004-11-18 2007-03-20 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
GB2444189B (en) * 2005-08-02 2011-09-21 World Properties Inc Silicone compositions, methods of manufacture, and articles formed therefrom
JP5481613B2 (ja) * 2005-09-14 2014-04-23 Ｅ＆Ｃエンジニアリング株式会社 共振型電波吸収体とその製造方法
JP4872296B2 (ja) * 2005-09-30 2012-02-08 日亜化学工業株式会社 シリコーンゴム封止型発光装置、及び該発光装置の製造方法
JP4684835B2 (ja) * 2005-09-30 2011-05-18 信越化学工業株式会社 シリコーンゴム硬化物の表面タック性を低減する方法、半導体封止用液状シリコーンゴム組成物、シリコーンゴム封止型半導体装置、及び該半導体装置の製造方法
US20070092736A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20070092737A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US7595515B2 (en) * 2005-10-24 2009-09-29 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
JP2009513021A (ja) * 2005-10-24 2009-03-26 スリーエム イノベイティブ プロパティズ カンパニー 成形された封入材を有する発光デバイスの製造方法
JP4816951B2 (ja) * 2005-12-06 2011-11-16 信越化学工業株式会社 シリコーン組成物及びその硬化物
KR20080104279A (ko) * 2006-02-24 2008-12-02 다우 코닝 코포레이션 실리콘으로 캡슐화된 발광 장치 및 실리콘 제조용의 경화성실리콘 조성물
CN102646724A (zh) 2006-04-18 2012-08-22 道康宁公司 硒化铟铜基光伏器件及其制造方法
WO2008088570A1 (en) * 2006-04-18 2008-07-24 Itn Energy Systems, Inc. Reinforcing structures for thin-film photovoltaic device substrates, and associated methods
EP2333841A3 (de) * 2006-04-18 2013-06-05 Dow Corning Corporation Photovoltaische Vorrichtung auf Basis von Cadmiumtellurid und Herstellungsverfahren
ES2328873T3 (es) * 2006-04-18 2009-11-18 Dow Corning Corporation Dispositivo fotovoltaico basado en diseleniuro de indio y cobre y procedimiento de preparacion del mismo.
CN101421100B (zh) * 2006-04-18 2013-03-27 陶氏康宁公司 用缩合固化的有机硅树脂组合物涂布的金属箔基底
JP5202819B2 (ja) * 2006-04-26 2013-06-05 富士フイルム株式会社 反射防止フィルムの製造方法
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
JP2007329182A (ja) * 2006-06-06 2007-12-20 Shin Etsu Polymer Co Ltd キャリア治具及びその製造方法
US8092735B2 (en) 2006-08-17 2012-01-10 3M Innovative Properties Company Method of making a light emitting device having a molded encapsulant
WO2008036769A2 (en) 2006-09-19 2008-03-27 Itn Energy Systems, Inc. Semi-transparent dual layer back contact for bifacial and tandem junction thin-film photovolataic devices
WO2008100991A1 (en) 2007-02-13 2008-08-21 3M Innovative Properties Company Led devices having lenses and methods of making same
US9944031B2 (en) * 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
DE102007025749A1 (de) * 2007-06-01 2008-12-11 Wacker Chemie Ag Leuchtkörper-Silicon-Formteil
TWI458780B (zh) 2007-07-31 2014-11-01 Dow Corning Toray Co Ltd 提供高透明矽酮硬化物之硬化性矽酮組合物
US20090065792A1 (en) * 2007-09-07 2009-03-12 3M Innovative Properties Company Method of making an led device having a dome lens
US7960192B2 (en) * 2007-09-14 2011-06-14 3M Innovative Properties Company Light emitting device having silicon-containing composition and method of making same
JP2009152099A (ja) * 2007-12-21 2009-07-09 Shin Etsu Polymer Co Ltd 携帯電話の照明構造
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5571295B2 (ja) * 2008-07-14 2014-08-13 東レ・ダウコーニング株式会社 ヒドロシリル化反応により硬化してなるシリコーン層を備えた基材の製造方法および回収された有機溶媒を使用するシリコーン組成物
US9051445B2 (en) 2008-07-31 2015-06-09 Dow Corning Toray Co., Ltd. Multi-component sponge-forming liquid silicone rubber composition and silicone rubber sponge manufacturing method
JP5475296B2 (ja) 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
JP5475295B2 (ja) 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
JP5568240B2 (ja) * 2009-02-02 2014-08-06 東レ・ダウコーニング株式会社 硬化性シリコーンゴム組成物
JP5626097B2 (ja) * 2010-05-07 2014-11-19 信越化学工業株式会社 剥離紙又は剥離フィルム用シリコーン組成物、並びに剥離紙又は剥離フィルムとその製造方法
JP5434954B2 (ja) * 2010-05-07 2014-03-05 信越化学工業株式会社 剥離紙又は剥離フィルム用下塗りシリコーン組成物、並びに処理紙又は処理フィルム
KR101213028B1 (ko) 2011-02-09 2012-12-18 주식회사 케이씨씨 오르가노폴리실록산, 그 제조방법 및 이를 포함하는 실리콘 조성물
KR101409537B1 (ko) * 2011-11-25 2014-06-19 주식회사 엘지화학 경화성 조성물
JP5660145B2 (ja) * 2012-04-03 2015-01-28 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
US9475258B2 (en) 2012-06-15 2016-10-25 The Boeing Company Multiple-resin composite structures and methods of producing the same
JP6306982B2 (ja) * 2013-08-28 2018-04-04 丸榮日産株式会社 蓄光シリコーンゲルシート
WO2015053412A1 (ja) * 2013-10-11 2015-04-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および光半導体装置
KR101457900B1 (ko) * 2014-03-26 2014-11-04 실리콘밸리(주) 실리콘 적층을 이용한 디스플레이용 필름 및 그 제조방법
JP2016084419A (ja) * 2014-10-27 2016-05-19 信越化学工業株式会社 集光型太陽電池用シリコーンゴム組成物及び集光型太陽電池用フレネルレンズ及びプリズムレンズ
WO2017119363A1 (ja) * 2016-01-08 2017-07-13 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物、並びに光半導体装置
GB201603107D0 (en) * 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
JP6575429B2 (ja) * 2016-05-02 2019-09-18 横浜ゴム株式会社 密着付与剤及び硬化性樹脂組成物
GB201709852D0 (en) * 2017-06-20 2017-08-02 Advanced Insulation Plc Thermal insulation structure
JP6915527B2 (ja) * 2017-12-27 2021-08-04 信越化学工業株式会社 有機ｅｌ用透明乾燥剤及びその使用方法
JP6965840B2 (ja) * 2018-07-13 2021-11-10 信越化学工業株式会社 含フッ素ポリシロキサン硬化性組成物、該組成物の硬化物で被覆されたゴム硬化物又はゲル硬化物、該被覆されたゴム硬化物又はゲル硬化物を有する電気・電子部品及び光半導体装置、並びにゴム硬化物又はゲル硬化物の表面粘着性を低減する方法
CN112654687B (zh) 2018-08-10 2023-08-25 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
JP7088880B2 (ja) * 2019-05-30 2022-06-21 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、該組成物の製造方法、及び光半導体装置
WO2021029412A1 (ja) 2019-08-13 2021-02-18 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
KR102847441B1 (ko) 2019-08-13 2025-08-21 다우 도레이 캄파니 리미티드 감압 접착층 형성성 오가노폴리실록산 조성물 및 그의 사용
JP7648329B2 (ja) * 2019-08-13 2025-03-18 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
JP7401247B2 (ja) * 2019-10-08 2023-12-19 信越化学工業株式会社 硬化性組成物、その硬化物、及び半導体装置
WO2021071510A1 (en) 2019-10-11 2021-04-15 Hewlett-Packard Development Company, L.P. Three-dimensional printing with hydrophobizing and hydrophilizing agents

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2800652A1 (de) * 1978-01-07 1979-07-12 Bayer Ag Schichtkoerper und verfahren zu ihrer herstellung
JPS60262631A (ja) * 1984-06-11 1985-12-26 Minolta Camera Co Ltd 定着用回転体の製造方法
JPS6189022A (ja) * 1984-10-08 1986-05-07 Nissei Denki Kk 二種以上のゴム材を接合したゴム材成形品の製造方法
JPS62148901A (ja) 1985-12-23 1987-07-02 Canon Inc 光学材料
JPS62239106A (ja) 1986-04-11 1987-10-20 Canon Inc 可変焦点光学素子
FR2618337B1 (fr) 1987-07-22 1989-12-15 Dow Corning Sa Pansement chirurgical et procede pour le fabriquer
JP2796307B2 (ja) * 1988-06-24 1998-09-10 株式会社金陽社 定着器用ロール
CA2031063A1 (en) * 1989-12-20 1991-06-21 Kenneth C. Fey Silicone paints for protection of silicone elastomeric coating materials
JP2508891B2 (ja) * 1990-05-29 1996-06-19 信越化学工業株式会社 シリコ―ンゴム組成物及びその硬化物
JP2547134B2 (ja) 1991-09-13 1996-10-23 信越化学工業株式会社 シリコーン複合体の製造方法
JP2547135B2 (ja) 1991-09-13 1996-10-23 信越化学工業株式会社 シリコーン複合体の製造方法
JP3257812B2 (ja) * 1991-12-13 2002-02-18 ジーイー東芝シリコーン株式会社 フロントガラス付ビームランプ
JP3648756B2 (ja) * 1994-03-22 2005-05-18 Ｊｓｒ株式会社 半導体素子用コーテイング材
JP3011617B2 (ja) * 1994-08-11 2000-02-21 信越化学工業株式会社 シリコーン−エポキシ樹脂組成物
JP3093964B2 (ja) * 1994-11-17 2000-10-03 信越化学工業株式会社 シリコーンゴムとシリコーン−エポキシ樹脂の複合体及びその製造方法
TW296400B (de) * 1994-11-17 1997-01-21 Shinetsu Chem Ind Co
JP3502279B2 (ja) * 1997-10-28 2004-03-02 三菱レイヨン株式会社 傾斜組成硬化被膜層が形成された被覆物品及びその製造方法
US6204523B1 (en) * 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
JP2002047473A (ja) * 2000-08-03 2002-02-12 Ge Toshiba Silicones Co Ltd 接着剤および接着方法
JP2003118040A (ja) * 2001-10-11 2003-04-23 Ge Toshiba Silicones Co Ltd 衝撃緩和用複合体
JP2003279925A (ja) * 2002-03-25 2003-10-02 Olympus Optical Co Ltd ウォブリング素子、ウォブリング素子の製造方法および画像表示装置
JP4503271B2 (ja) * 2003-11-28 2010-07-14 東レ・ダウコーニング株式会社 シリコーン積層体の製造方法

Also Published As

Publication number Publication date
US20110143025A1 (en) 2011-06-16
KR101109503B1 (ko) 2012-01-31
EP1697473A1 (de) 2006-09-06
KR20060123401A (ko) 2006-12-01
US20070134425A1 (en) 2007-06-14
JP2005161132A (ja) 2005-06-23
EP1697473B1 (de) 2011-07-27
WO2005052078A1 (en) 2005-06-09
US7919150B2 (en) 2011-04-05
CN1886476A (zh) 2006-12-27
US8153202B2 (en) 2012-04-10
JP4503271B2 (ja) 2010-07-14

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